Composite material with adhesion promoter layer based on Si, C and O

US11897208B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11897208-B2
Application numberUS-202016737946-A
CountryUS
Kind codeB2
Filing dateJan 9, 2020
Priority dateJan 11, 2019
Publication dateFeb 13, 2024
Grant dateFeb 13, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A composite material, comprising: a substrate and a polymer layer which are directly interconnected by an adhesion promoter layer, wherein the substrate comprises a molded body and a surface of the substrate that directly contacts the adhesion promoter layer comprises a material selected from the group consisting of steel, stainless steel, iron, brass, elemental aluminum, elemental silicon, thermoplastic polymer, and thermoset polymer, wherein the adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound, wherein a surface of the adhesion promoter layer to which the polymer layer is directly connected has a proportion of C which is >50 at. %, as determined by X-ray photoelectron spectroscopy, and wherein the polymer layer is obtained by applying a polymer compound to the adhesion promoter layer and crosslinking the polymer compound to form the polymer layer. 2. The composite material according to claim 1 , wherein the organosilicon compound comprises a siloxane, silane, or silicate. 3. The composite material according to claim 2 , wherein the siloxane comprises hexamethyldisiloxane, and/or wherein the silane comprises tetramethylsilane. 4. The composite material according to claim 1 , wherein the unsaturated hydrocarbon comprises ethylene or acetylene. 5. The composite material according to claim 1 , wherein the adhesion promoter layer is formed as a gradient layer, and wherein in the gradient layer, a proportion of carbon increases toward the polymer layer and a proportion of Si decreases toward the polymer layer. 6. The composite material according to claim 1 , wherein the adhesion promoter layer is covalently bonded to the polymer layer. 7. The composite material according to claim 1 , wherein the surface of the adhesion promoter layer and/or the adhesion promoter layer as a whole comprises: Si: 3 at. % to 25 at. %, C: 50 at. % to 90 at. %, O: 5 at. % to 25 at. %. 8. The composite material according to claim 1 , wherein the polymer layer comprises a polymer selected from fluorine rubber; ethylene propylene copolymers comprising ethylene propylene diene rubber, polyacrylate rubber, or ethylene acrylate rubber; butadiene rubber comprising acrylonitrile butadiene rubber, hydrated acrylonitrile butadiene rubber, styrene-butadiene rubber, silicone rubbers, natural rubber, chloroprene rubber, or epichlorohydrin rubber; polyurethane; or epoxy polymers. 9. The composite material according to claim 1 , wherein the substrate is not a fluoropolymer. 10. The composite material according to claim 1 , wherein the adhesion promoter layer has a thickness of 30 nm to 10 μm. 11. A sealing article, comprising: the composite material according to claim 1 . 12. A method for producing the composite material according to claim 1 , comprising the steps of: (a) providing the substrate; (b) coating the substrate with the adhesion promoter layer by plasma-enhanced chemical vapor deposition (PE-CVD); (c) applying a polymer compound to the adhesion promoter layer; and (d) crosslinking the polymer compound, wherein the adhesion promoter layer is covalently bonded to the polymer layer. 13. The method according to claim 12 , wherein when the polymer compound is crosslinked in step (d), unsaturated carbon bonds at a surface of the adhesion promoter layer react with the polymer compound. 14. A method of using the composite material according to claim 1 , comprising: providing the composite material as a sealing article, or using the composite material to produce a sealing article. 15. The composite material according to claim 7 , wherein the surface of the adhesion promoter layer and/or the adhesion promoter layer as a whole comprises: Si: 4 at. % to 20 at. %, C: 60 at. % to 85 at. %, O: 10 at. % to 20 at. %. 16. The composite material according to claim 15 , wherein a sum of Si+C+0 in at least one of the surface of the adhesion promoter layer and the adhesion promotor layer as a whole is >90%, and wherein a remainder is H, N, and additional elements from the substrate. 17. The composite material according to claim 7 , wherein a sum of Si+C+0 in at least one of the surface of the adhesion promoter layer and the adhesion promotor layer as a whole is >90%, and wherein a remainder is H, N, and additional elements from the substrate. 18. The composite material according to claim 1 , wherein the adhesion promoter layer as a whole has a proportion of C which is >50 at. %.

Assignees

Inventors

Classifications

  • B29C65/528Primary

    by CVD or by PVD, i.e. by chemical vapour deposition or by physical vapour deposition · CPC title

  • Heating or curing, e.g. crosslinking or vulcanizing {during moulding, e.g. in a mould}(cold vulcanisation B29C35/18 {; vulcanising tyres, presses therefor B29D30/0601}) · CPC title

  • Reactive adhesives, e.g. chemically curing adhesives · CPC title

  • Iron or alloys of iron, e.g. steel · CPC title

  • comprising polysiloxanes · CPC title

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Frequently asked questions

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What does patent US11897208B2 cover?
A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substr…
Who is the assignee on this patent?
Freudenberg Carl Kg
What technology area does this patent fall under?
Primary CPC classification B29C65/528. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 13 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).