Intelligent soldering tip

US11897057B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11897057-B2
Application numberUS-202217831740-A
CountryUS
Kind codeB2
Filing dateJun 3, 2022
Priority dateApr 2, 2018
Publication dateFeb 13, 2024
Grant dateFeb 13, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.

First claim

Opening claim text (preview).

That which is claimed: 1. A tip portion for a soldering tool, the tip portion comprising: a handpiece configured to be graspable by an operator; a tip extending from a forward end of the handpiece, wherein the tip comprises a heater and a sensor; electronic components comprising a connection wire and a tip memory device configured to communicate parametric data to control a temperature of the tip; a plug pin disposed on an opposite side of the handpiece relative to the tip, the plug pin comprising a first electrical connection for power, a second electrical connection for ground, and a third electrical connection for communicating data; wherein the connection wire connects the sensor to the third electrical connection of the plug pin. 2. The tip portion of claim 1 wherein the tip, the handpiece, and plug pin are disposed on a common lateral axis. 3. The tip portion of claim 1 wherein the handpiece comprises an insulated grip disposed on an external surface of the handpiece. 4. The tip portion of claim 1 , wherein the tip memory device is configured to communicate the parametric data to a controller of a soldering tool to enable the controller to operate the heater based on the parametric data. 5. The tip portion of claim 4 , wherein the tip memory device is configured to communicate the parametric data to the controller via the connection wire and the third electrical connection of the plug pin. 6. The tip portion of claim 1 , wherein the tip memory device is further configured to store and communicate a tip identifier associated with an identity of the tip portion. 7. The tip portion of claim 1 , wherein the parametric data comprises temperature offset data indicating a temperature difference between a sensed temperature at the sensor and a temperature at a distal end of the tip. 8. A tip portion for a soldering tool, the tip portion comprising: a handpiece that is configured to be graspable by an operator; a tip comprising a heater and a sensor; a plug pin disposed on an opposite side of the handpiece relative to the tip, the plug pin configured to electrically connect the tip portion to a soldering tool; and a tip memory device configured to store parametric data and communicate the parametric data to control a temperature of the tip; wherein a connection wire of the tip portion, as a single wire interface, connects the sensor to the plug pin, with the tip memory device also being connected to the connection wire; wherein the heater is connected to the plug pin to power the heater. 9. The tip portion of claim 8 wherein the tip, the handpiece, and plug pin are disposed on a common lateral axis. 10. The tip portion of claim 8 wherein the handpiece comprises an insulated grip disposed on an external surface of the handpiece. 11. The tip portion of claim 8 , wherein the tip memory device is configured to communicate the parametric data to a controller of a soldering tool to enable the controller to operate the heater based on the parametric data. 12. The tip portion of claim 8 , wherein the tip memory device is further configured to store and communicate a tip identifier associated with an identity of the tip portion. 13. The tip portion of claim 8 , wherein the parametric data comprises temperature offset data indicating a temperature difference between a sensed temperature at the sensor and a temperature at a distal end of the tip.

Assignees

Inventors

Classifications

  • B23K3/033Primary

    comprising means for controlling or selecting the temperature or power · CPC title

  • Removable soldering bits · CPC title

  • Soldering or brazing jigs, fixtures or clamping means · CPC title

  • B23K35/00Primary

    Rods, electrodes, materials, or media, for use in soldering, welding, or cutting · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11897057B2 cover?
A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to…
Who is the assignee on this patent?
Apex Brands Inc
What technology area does this patent fall under?
Primary CPC classification B23K3/033. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 13 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).