Apparatus and method for processing substrate

Patent metadata

Field	Value
Publication number	US-11897006-B2
Application number	US-202217740358-A
Country	US
Kind code	B2
Filing date	May 10, 2022
Priority date	May 26, 2021
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

The present disclosure provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a substrate support unit configured to support a substrate, a liquid supply unit configured to supply a liquid containing any one of a chemical liquid and a cleaning liquid to the substrate supported by the substrate support unit, a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit, and a capture module provided in the processing container to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate support unit configured to support a substrate;
a liquid supply unit configured to supply a liquid containing either a chemical liquid or a cleaning liquid to the substrate supported by the substrate support unit;
a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit; and
a capture module provided in the processing container and configured to capture the liquid scattered from the substrate, the capture module configured to be movable forward and backward in a sliding manner from an inner wall of the processing container and be operated in a position adjustment mode for capturing the liquid.

2. The substrate processing apparatus of claim 1 , wherein the capture module is configured to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering.

3. The substrate processing apparatus of claim 1 , wherein the capture module includes a mesh net structure configured to capture the re-scattered liquid.

4. The substrate processing apparatus of claim 1 , wherein the capture module is located inside the processing container in a multi-layered form to capture the liquid.

5. The substrate processing apparatus of claim 2 , wherein the capture module includes a polypropylene (PP) material.

6. The substrate processing apparatus of claim 2 , wherein the specifications of the capture module include a thickness in a range of 0.5 T to 1 T, and a width of at least 10 mm.

7. The substrate processing apparatus of claim 1 , wherein the capture module,
primarily captures the chemical liquid scattered to the processing container based on the supply of the chemical liquid to the substrate by the liquid supply unit, and
secondarily captures the cleaning liquid scattered to the processing container based on the supply of the cleaning liquid to the substrate by the liquid supply unit,
wherein
the chemical liquid primarily captured in advance is cleaned through the secondary capture.

8. The substrate processing apparatus of claim 1 , wherein the processing container comprises:
a first processing container;
a second processing container configured to form a first inflow space with the first processing container; and
a third processing container configured to form a second inflow space with the second processing container,
wherein the capture module is provided in at least any one of the first inflow space and the second inflow space to capture the inflowing liquid.

9. The substrate processing apparatus of claim 1 , wherein the capture module is installed to be spaced apart from an inner wall of the processing container through a connector installed on the inner wall of the processing container.

10. The substrate processing apparatus of claim 9 , wherein the capture module is tilted in a predetermined range on the connector and operated in another position adjustment mode for capturing the liquid.

11. The substrate processing apparatus of claim 1 , wherein the capture module is installed singly or in a plurality on the processing container.

12. A substrate processing apparatus comprising:
a substrate support unit configured to support a substrate;
a liquid supply unit configured to supply a liquid containing either a chemical liquid or a cleaning liquid to the substrate supported by the substrate support unit;
a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit; and
a capture module provided in the processing container and configured to capture the liquid scattered from the substrate,
wherein the capture module is configured to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering, and includes a mesh net structure for capturing the re-scattered liquid,
is located inside the processing container in a multi-layered form to capture the liquid, and is configured to primarily capture the chemical liquid scattered to the processing container based on the supply of the chemical liquid to the substrate by the liquid supply unit, and
is configured to secondarily capture the cleaning liquid scattered to the processing container based on the supply of the cleaning liquid to the substrate by the liquid supply unit such that the chemical liquid primarily captured in advance is cleaned through the secondary capture, and
wherein the capture module is configured to be movable forward and backward in a sliding manner from an inner wall of the processing container and be operated in a position adjustment mode for capturing the liquid.

Assignees

• Semes Co Ltd

Inventors

• Kwak Ki Young
• Kwon Sang Young
• Shim Cha Sub

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• B08B3/022 Primary

  Cleaning travelling work (B08B3/042 takes precedence) · CPC title