Sealed package and method of forming same

Patent metadata

Field	Value
Publication number	US-11896830-B2
Application number	US-202117164998-A
Country	US
Kind code	B2
Filing date	Feb 2, 2021
Priority date	Jun 28, 2018
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

First claim

What is claimed is:

1. A hermetically-sealed package comprising a housing that extends along a housing axis between a first end and a second end, wherein the housing comprises first and second opaque portions and a transparent portion disposed between the first and second opaque portions, wherein the first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion, wherein at least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring.

2. The package of claim 1 , wherein the first opaque portion is hermetically sealed to the first end of the transparent portion by the weld ring and the second opaque portion is hermetically sealed to the second end of the transparent portion by a second weld ring.

3. The package of claim 2 , wherein at least one of the weld ring or the second weld ring is diffusion bonded to the transparent portion of the housing.

4. The package of claim 3 , wherein at least one of the weld ring or the second weld ring is laser diffusion bonded to the transparent portion of the housing.

5. The package of claim 2 , wherein at least one of the weld ring or the second weld ring is compression bonded to the transparent portion of the housing.

6. The package of claim 1 , wherein the transparent portion of the housing is substantially transmissive to electromagnetic radiation having a frequency in a range of 10 kHz to 20 MHz.

7. The package of claim 1 , further comprising an inductive coil disposed at least partially within the transparent portion of the housing.

8. The package of claim 1 , wherein the first opaque portion of the housing comprises an external contact adapted to provide an electrical signal to tissue of a patient.

9. The package of claim 1 , further comprising an external contact hermetically sealed to the second opaque portion of the housing.

10. The package of claim 1 , wherein the housing comprises an elliptical cross-section in a plane orthogonal to the housing axis.

11. The package of claim 1 , further comprising a tine connected to the first opaque portion of the housing adjacent to the first end of the housing.

12. The package of claim 1 , wherein the transparent portion of the housing comprises a ceramic material.

13. The package of claim 1 , wherein at least one of the first and second opaque portions of the housing comprises a ceramic material.

14. A housing assembly, comprising:
a housing comprising an outer surface and an inner surface and extending along a housing axis between a first end and a second end; and
a weld ring compression bonded to the outer surface of the housing at the first end and a second weld ring compression bonded to the outer surface of the housing at the second end, wherein the weld ring and the second weld ring are hermetically-sealed to the outer surface of the housing.

15. The assembly of claim 14 , further comprising a diffusion layer disposed between the weld ring and the outer surface of the housing that is formed when the weld ring is compression bonded to the outer surface of the housing.

16. The assembly of claim 14 , wherein the housing comprises a ceramic material.

17. The assembly of claim 14 , wherein at least a portion of the housing is substantially transmissive to electromagnetic radiation having a frequency in a range of 10 kHz to 20 MHz.

18. The assembly of claim 14 , wherein the housing further comprises a flange disposed adjacent to the first end of the housing, wherein the weld ring is disposed over the flange.

19. The assembly of claim 18 , wherein the flange comprises a tapered portion, wherein the weld ring comprises a flange that comprises a tapered portion, wherein the tapered portion of the flange of the housing is adapted to receive the tapered portion of the flange of the weld ring.

20. The assembly of claim 18 , wherein the housing further comprises a second flange disposed adjacent to the second end of the housing, wherein the second weld ring is disposed over the second flange.

Assignees

• Medtronic Inc

Inventors

• Thom Andrew J
• Iyer Rajesh V
• Munns Gordon O
• Nielsen Christian S
• Ries Andrew J

Classifications

• H02J7/42

  with electronic devices having internal batteries, e.g. mobile phones · CPC title

• H02J2105/46

  Medical devices, medical implants or life supporting devices · CPC title

• A61N1/37223 Primary

  Circuits for electromagnetic coupling · CPC title

• A61N1/3754

  Feedthroughs · CPC title

• A61N1/3758

  Packaging of the components within the casing · CPC title