Cooling arrangement

Patent metadata

Field	Value
Publication number	US-11895810-B2
Application number	US-202117369514-A
Country	US
Kind code	B2
Filing date	Jul 7, 2021
Priority date	Jul 8, 2020
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

First claim

The invention claimed is:

1. A power electronic assembly comprising:
a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
wherein the power electronic module comprises a substrate having an upper surface and a lower surface, wherein the multiple power electronic components are attached to the upper surface, and wherein at least one of the multiple vapour chambers is attached to the lower surface of the substrate.

2. The power electronic assembly according to claim 1 , wherein the at least one of the multiple vapour chambers is arranged in the power electronic module and at least one other of the multiple vapour chambers is arranged in the cooling element.

3. The power electronic assembly according to claim 1 , wherein at least two vapour chambers of the multiple vapour chambers are arranged in the power electronic module.

4. The power electronic assembly according to claim 1 , wherein the substrate is a DBC substrate having a layer of copper and a layer of ceramic, wherein the at least one of the multiple vapour chambers is attached to the layer of ceramic.

5. The power electronic assembly according to claim 1 , wherein the substrate is a DBC substrate having two layers of copper, wherein the at least one of the multiple vapour chambers is attached to one of the two layers of copper.

6. The power electronic assembly according to claim 5 , wherein a surface of the at least one of the multiple vapour chambers is formed of said one of the two layers of copper.

7. The power electronic assembly according to claim 3 , wherein the power electronic module comprises at least two substrates to which the power electronic components are attached,
wherein for each substrate, one of the at least two vapour chambers is arranged to receive heat from the substrate, and
wherein at least one of the multiple vapour chambers is arranged to receive heat from the at least two vapour chambers.

8. The power electronic assembly according to claim 1 , wherein at least two of the multiple vapour chambers are arranged to transfer heat from one vapour chamber to another vapour chamber.

9. The power electronic assembly according to claim 1 , wherein at least one of the multiple vapour chambers is produced using an additive manufacturing method.

10. A power electronic device comprising:
a power electronic assembly including a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer the heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
wherein the at least one of the multiple vapour chambers is arranged in the power electronic module and at least one other of the multiple vapour chambers is arranged in the cooling element;
wherein the power electronic module comprises a substrate having an upper surface and a lower surface, wherein the multiple power electronic components are attached to the upper surface, and wherein at least one of the multiple vapour chambers is attached to the lower surface of the substrate.

11. The power electronic device according to claim 10 , wherein the power electronic device is a converter.

12. The power electronic device according to claim 10 , wherein the power electronic device is a frequency converter.

13. The power electronic assembly according to claim 1 , wherein the power electronic module comprises at least two substrates to which the power electronic components are attached,
wherein for each substrate, one of at least two vapour chambers of the multiple vapour chambers is arranged to receive heat from the substrate, and
wherein at least one of the multiple vapour chambers is arranged to receive heat from the at least two vapour chambers.

14. The power electronic assembly according to claim 2 , wherein at least two of the multiple vapour chambers are arranged to transfer heat from one vapour chamber to another vapour chamber.

15. The power electronic assembly according to claim 2 , wherein at least one of the multiple vapour chambers is produced using an additive manufacturing method.

16. A power electronic assembly comprising:
a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
wherein at least two vapour chambers of the multiple vapour chambers are arranged in the power electronic module;
wherein the power electronic module comprises at least two substrates to which the power electronic components are attached,
wherein for each substrate, one of the at least two vapour chambers is arranged to receive heat from the substrate, and
wherein at least one of the multiple vapour chambers is arranged to receive heat from the at least two vapour chambers.

Assignees

• Abb Schweiz Ag

Inventors

• Manninen Jorma
• Silvennoinen Mika
• Pakarinen Joni

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title