Electronic apparatus

Patent metadata

Field	Value
Publication number	US-11895774-B2
Application number	US-202117562493-A
Country	US
Kind code	B2
Filing date	Dec 27, 2021
Priority date	Feb 26, 2021
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.

First claim

What is claimed is:

1. An electronic apparatus comprising:
an electronic panel comprising a base substrate, a plurality of pixels on the base substrate, and a plurality of pads in an adhesive area, the plurality of pads is spaced apart from the plurality of pixels;
a circuit board comprising a base film, and a plurality of leads disposed on the base film and overlapping the plurality of pads in a plan view; and
a conductive adhesive member disposed on the adhesive area and configured to electrically connect the circuit board and the electronic panel,
wherein the plurality of pads comprises a plurality of pixel pads electrically connected to the plurality of pixels, an arrangement pad spaced apart from the plurality of pixel pads, and a resistance measurement pad disposed between the arrangement pad and the plurality of pixels pads and insulated from the plurality of pixel pads, and
the plurality of leads comprises a plurality of pixel leads overlapping the plurality of pixel pads in the plan view, an arrangement lead overlapping the arrangement pad in the plan view, and a resistance measurement lead disposed between the plurality of pixel leads and the arrangement lead and insulated from the plurality of pixel leads,
wherein the resistance measurement lead comprises a plurality of resistance measurement leads disposed between the arrangement lead and the plurality of pixel leads and electrically connected to the resistance measurement pad, and a dummy lead spaced apart from each of the plurality of resistance measurement leads in the plan view.

2. The electronic apparatus according to claim 1 , wherein:
the resistance measurement lead comprises first, second, and third leads arranged along a direction from the arrangement lead towards the pixel leads; and
the third lead is connected to a plurality of terminals.

3. The electronic apparatus according to claim 2 , wherein the dummy lead is disposed between the first lead and the second lead.

4. The electronic apparatus according to claim 2 , wherein the dummy lead is disposed between the first lead and the arrangement lead.

5. The electronic apparatus according to claim 2 , wherein the resistance measurement pad comprises:
a first pad connected with the first lead;
a second pad connected with the second lead; and
a third pad connected with the third lead,
wherein the first to third pads are connected with each other.

6. The electronic apparatus according to claim 5 , wherein the resistance measurement pad further comprises a dummy pad disposed between the first pad and the second pad and spaced apart from the first to third pads in the plan view,
wherein the dummy pad overlaps the dummy lead in the plan view.

7. The electronic apparatus according to claim 6 , wherein the dummy pad and the dummy lead are connected with each other through the conductive adhesive member.

8. The electronic apparatus according to claim 6 , wherein a gap between the dummy pad and the dummy lead in a thickness direction of the electronic apparatus is larger than a gap between the pixel lead and the pixel pad in the thickness direction of the electronic apparatus.

9. The electronic apparatus according to claim 1 , wherein the dummy lead comprises a first dummy lead and a second dummy lead spaced apart from each other with the arrangement lead disposed therebetween.

10. The electronic apparatus according to claim 9 , wherein the first dummy lead includes a plurality of first dummy leads and the second dummy lead includes a plurality of second dummy leads,
wherein at least one of the plurality of first dummy leads has a shape that is different from a shape of another first dummy lead of the plurality of first dummy leads, and
wherein at least one of the plurality of second dummy leads has a shape that is different from a shape of another second dummy lead of the plurality of second dummy leads.

11. The electronic apparatus according to claim 9 , wherein:
the plurality of leads further comprises driving evaluation leads spaced apart from the arrangement lead and configured to receive an electrical signal; and
the first dummy lead and the second dummy lead are disposed in an area surrounded by the resistance measurement lead, the arrangement lead, and the driving evaluation leads.

12. An electronic apparatus comprising:
an electronic panel comprising a base substrate, a plurality of pixels on the base substrate, and a plurality of pads in an adhesive area, the plurality of pads are spaced apart from the plurality of pixels;
a circuit board comprising a base film, and a plurality of leads disposed on the base film and overlapping the plurality of pads in a plan view; and
a conductive adhesive member disposed on the adhesive area and configured to electrically connect the circuit board and the electronic panel,
wherein the plurality of pads comprises:
pixel pads electrically connected to the pixels and the circuit board;
an arrangement pad electrically insulated from the pixel pads;
resistance measurement pads insulated from the pixel pads, and electrically connected to the circuit board; and
a dummy pad disposed between the arrangement pad and the pixel pads and spaced apart from the resistance measurement pads in the plan view.

13. The electronic apparatus according to claim 12 , wherein:
the resistance measurement pads comprise first, second, and third pads arranged along a direction from the arrangement pad toward the pixel pads; and
the dummy pad is disposed between the first pad and the second pad.

14. The electronic apparatus according to claim 13 , wherein:
the first to third pads are connected with each other; and
the dummy pad is spaced apart from the first to third pads.

15. The electronic apparatus according to claim 13 , wherein the dummy pad is disposed between the first pad and the arrangement pad.

16. The electronic apparatus according to claim 13 , wherein the dummy pad comprises:
a first dummy pad disposed among the arrangement pad, the first pad, and the plurality of pixels; and
a second dummy pad spaced apart from the first dummy pad with the arrangement pad disposed therebetween.

17. The electronic apparatus according to claim 13 , wherein the plurality of leads comprises:
first to third leads separately disposed from each other and respectively connected to the first to third pads; and
a dummy lead overlapping the dummy pad in the plan view.

18. The electronic apparatus according to claim 17 , wherein the dummy lead is connected with the dummy pad.

19. The electronic apparatus according to claim 17 , wherein:
at least one of the base film or the base substrate includes a deformation that is positioned in an area in which the dummy lead or the dummy pad is disposed; and
the dummy lead is electrically insulated from the dummy pad.

20. The electronic apparatus according to claim 17 , the third lead is connected to a plurality of terminals.

21. A combined electronic apparatus comprising:
an electronic panel having a plurality of pixels in a display area and a plurality of pads in an adhesive area,
a circuit board comprising a plurality of leads that overlap the plurality of pads in a plan view,
a conductive adhesive member disposed on the adhesive area and configured to combine and electrically connect the circuit board and the electronic panel to each other;
a measurement connection pattern formed by electrical connection of resistance measurement leads of the plurality of leads to resistance measurem

Assignees

• Samsung Display Co Ltd

Inventors

• Oh Jaejin
• Kwack Junho
• Park Dongjin
• Lee Kyung-Mok
• Lee Dong-Youb

Classifications

• H10P74/273 Primary

  Interconnections for measuring or testing, e.g. probe pads · CPC title

• H10D86/441

  Interconnections, e.g. scanning lines · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H05K1/118 Primary

  specially for flexible printed circuits, e.g. using folded portions · CPC title