Systems and methods for improved sustainment of a high performance FRC with multi-scaled capture type vacuum pumping

US11894150B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11894150-B2
Application numberUS-202217965071-A
CountryUS
Kind codeB2
Filing dateOct 13, 2022
Priority dateNov 4, 2016
Publication dateFeb 6, 2024
Grant dateFeb 6, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Systems and methods that facilitate forming and maintaining FRCs with superior stability as well as particle, energy and flux confinement and, more particularly, systems and methods that facilitate forming and maintaining FRCs with elevated system energies and improved sustainment utilizing multi-scaled capture type vacuum pumping.

First claim

Opening claim text (preview).

What is claimed is: 1. A capture vacuum pump system comprising a first capture vacuum pump and a second capture vacuum pump, each of the first and second capture vacuum pumps comprising an open sided chamber including two or more plates with surfaces having a view of each other, the two or more plates comprising one or more side plates coupled to the end plate at a first end of the one or more side plates and extending to an opening defined by a second end of the one or more side plates, the opening defining an area equivalent to the surface of the end plate with the length of the one or more side plates defining a depth (D) of the capture vacuum pump and the two or more plates with surfaces having a view of the opening, a film of titanium deposited on the surfaces of the plates, wherein the film deposited surfaces having a sticking factor corresponding to the probability of an individual gas molecule sticking to the film deposited surface due to a single hit of the individual gas molecule to the film deposited surface when the film deposited surfaces are exposed to the gas, wherein the capture vacuum pump has a sticking factor greater than a sticking factor of a flat plate defining an area equivalent to the open side of the first and second capture pumps, wherein at least one of the two or more plates of the first and second capture vacuum pumps comprise a first array of individual capture vacuum pumps, wherein each individual capture vacuum pump in the first array of individual capture vacuum pumps comprising two or more plates with surfaces having a view of each other, the two or more plates comprising one or more side plates coupled to an end plate at a first end of the one or more side plates and extending to an opening defined by a second end of the one or more side plates, the opening defining an area equivalent to the surface of the end plate with the length of the one or more side plates defining a depth (D) of the individual capture vacuum pump, and the two or more plates with surfaces having a view of the opening. 2. The capture vacuum pump system of claim 1 , wherein at least one of the two or more plates of each individual capture vacuum pump in the array of the individual capture vacuum pumps comprising a second array of individual capture vacuum pumps, wherein each individual capture vacuum pump in the second array of individual capture vacuum pumps being a capture vacuum pump comprising two or more plates with surfaces having a view of each other, the two or more plates comprising one or more side plates coupled to an end plate at a first end of the one or more side plates and extending to an opening defined by a second end of the one or more side plates, the opening defining an area equivalent to the surface of the end plate with the length of the one or more side plates defining a depth (D) of the individual capture vacuum pump, and the two or more plates with surfaces having a view of the opening. 3. The capture vacuum pump system of claim 1 , wherein the first and second capture vacuum pumps having a sticking factor that is N times greater than a sticking factor of a flat plate defining an area equivalent to the open side of the first and second capture pumps, wherein N is 4<N<16. 4. The capture vacuum pump system of claim 1 , wherein the first and second capture vacuum pumps having a sticking factor that is N times greater than a sticking factor of a flat plate defining an area equivalent to the open side of the first and second capture pumps, wherein N is 4<N<16. 5. The capture vacuum pump system of claim 2 , wherein the first and second capture vacuum pumps having a sticking factor that is N times greater than a sticking factor of a flat plate defining an area equivalent to the open side of the first and second capture pumps, wherein N is 4<N<16.

Assignees

Inventors

Classifications

  • G21B1/17Primary

    Vacuum chambers; Vacuum systems · CPC title

  • by condensing or freezing, e.g. cryogenic pumps · CPC title

  • to obtain high vacuum · CPC title

  • G21B1/052Primary

    reversed field configuration · CPC title

  • Particle injectors for producing thermonuclear fusion reactions, e.g. pellet injectors · CPC title

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Frequently asked questions

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What does patent US11894150B2 cover?
Systems and methods that facilitate forming and maintaining FRCs with superior stability as well as particle, energy and flux confinement and, more particularly, systems and methods that facilitate forming and maintaining FRCs with elevated system energies and improved sustainment utilizing multi-scaled capture type vacuum pumping.
Who is the assignee on this patent?
Tae Tech Inc
What technology area does this patent fall under?
Primary CPC classification G21B1/17. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).