Pattern forming method, active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, method for manufacturing electronic device, and electronic device
US-2017059995-A1 · Mar 2, 2017 · US
US11892775B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11892775-B2 |
| Application number | US-202217676235-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 21, 2022 |
| Priority date | Mar 31, 2016 |
| Publication date | Feb 6, 2024 |
| Grant date | Feb 6, 2024 |
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A storage container storing a treatment liquid for manufacturing a semiconductor is provided, wherein the occurrence of defects on the semiconductor, such as particles, is suppressed and a fine resist pattern or a fine semiconductor element is manufactured. The storage container includes a storage portion that stores the treatment liquid, wherein the treatment liquid includes one kind or two or more kinds of metal atoms selected from Cu, Fe, and Zn, and a total content of particulate metal that is a metal component derived from the metal atoms and that is a nonionic metal component present in the treatment liquid as a solid without being dissolved is 0.01 to 100 mass ppt with respect to a total mass of the treatment liquid.
Opening claim text (preview).
What is claimed is: 1. A storage container comprising: a treatment liquid for manufacturing a semiconductor; and a storage portion that stores the treatment liquid, wherein the treatment liquid includes one kind or two or more kinds of metal atoms selected from Cu, Fe, and Zn, and a total content of particulate metal that is a metal component derived from the metal atoms and that is a nonionic metal component present in the treatment liquid as a solid without being dissolved is 0.01 to 100 mass ppt with respect to a total mass of the treatment liquid for manufacturing the semiconductor, wherein a mass of the particulate metal is measured by a SP-ICP-MS method. 2. The storage container according to claim 1 , wherein an inner wall of the storage portion that comes into contact with the treatment liquid is cleaned using a cleaning liquid having a contact angle of 10 degrees to 120 degrees on the inner wall before being filled with the treatment liquid. 3. The storage container according to claim 2 , wherein the cleaning liquid is ultrapure water or a liquid including at least one of components included in the treatment liquid. 4. The storage container according to claim 1 , wherein at least a portion of an inner wall of the storage portion that comes into contact with the treatment liquid is formed of a material including at least one selected from the group consisting of polyethylene, polypropylene, polytetrafluoroethylene, and perfluoroalkoxy alkane. 5. The storage container according to claim 1 , wherein at least a portion of an inner wall of the storage portion that comes into contact with the treatment liquid is formed of a material including at least one selected from the group consisting of stainless steel and nickel-chromium alloy. 6. The storage container according to claim 1 , wherein at least a portion of an inner wall of the storage portion that comes into contact with the treatment liquid is formed of a material including at least one selected from the group consisting of stainless steel and nickel-chromium alloy, and a mass ratio represented by Cr/Fe in a portion having a depth of 1 nm from an outermost surface of the inner wall is 1 to 3. 7. The storage container according to claim 1 , wherein an occupancy ratio of a void portion in the storage portion storing the treatment liquid is 50 to 0.01 vol %. 8. The storage container according to claim 1 , wherein a void portion of the storage portion storing the treatment liquid is filled with gas in which the number of particles having a diameter of 0.5 μm or more is 10 particles/L or less. 9. The storage container according to claim 1 , wherein a void portion of the storage portion storing the treatment liquid is filled with inert gas, wherein the inert gas comprising nitrogen or argon. 10. The storage container according to claim 1 , wherein the treatment liquid is a developer or a rinsing liquid. 11. The storage container according to claim 1 , wherein the treatment liquid includes a quaternary ammonium salt. 12. The storage container according to claim 1 , wherein the treatment liquid includes at least one selected from the group consisting of butyl acetate, N-methyl-2-pyrrolidone, isopropanol, ethanol, and methyl isobutyl carbinol. 13. The storage container according to claim 1 , wherein the pH of the treatment liquid is 10.0 to 15.0. 14. The storage container according to claim 1 , wherein the treatment liquid includes a surfactant. 15. The storage container according to claim 1 , wherein the treatment liquid includes at least one selected from the group consisting of butyl acetate, N-methyl-2-pyrrolidone, isopropanol, ethanol, methyl isobutyl carbinol, propylene glycol monomethyl ether, cyclohexanone, γ-butyrolactone, ethyl lactate, dimethyl sulfoxide, isoamyl acetate, a mixed solution of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether, methyl 2-hydroxyisobutyrate, methyl ethyl ketone, and propylene carbonate. 16. The storage container according to claim 1 , wherein the treatment liquid includes at least one selected from the group consisting of butyl acetate, methyl isobutyl carbinol and isoamyl acetate. 17. The storage container according to claim 1 , wherein the treatment liquid includes at least one selected from the group consisting of propylene glycol monomethyl ether, cyclohexanone, ethyl lactate, a mixed solution of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether, and methyl 2-hydroxyisobutyrate. 18. The storage container according to claim 1 , wherein the treatment liquid includes at least isopropanol. 19. A storage container comprising: a treatment liquid for manufacturing a semiconductor; and a storage portion that stores the treatment liquid, wherein the treatment liquid includes one kind or two or more kinds of metal atoms selected from Cu, Fe, and Zn, and a total content of particulate metal that is a metal component derived from the metal atoms and that is a nonionic metal component present in the treatment liquid as a solid without being dissolved is 0.01 to 100 mass ppt with respect to a total mass of the treatment liquid for manufacturing the semiconductor, wherein an inner wall of the storage portion that comes into contact with the treatment liquid is cleaned using a cleaning liquid having a contact angle of 10 degrees to 120 degrees on the inner wall before being filled with the treatment liquid.
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