Method and apparatus for isothermal cooling

Patent metadata

Field	Value
Publication number	US-11892208-B2
Application number	US-202117541198-A
Country	US
Kind code	B2
Filing date	Dec 2, 2021
Priority date	May 2, 2017
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

A cooling apparatus includes: a first fluid flowpath including the following elements, in downstream flow sequence: a subcooler having a first side in fluid communication with the first fluid flowpath and a second side configured to be disposed in thermal communication with a source of cooling fluid; a flow control valve; a primary evaporator assembly including at least one primary evaporator configured to be disposed in thermal communication with a primary heat load; and a pressure regulator operable to maintain a refrigerant saturation pressure within the primary evaporator at a predetermined set point.

First claim

What is claimed is:

1. A cooling apparatus comprising:
a source of cooling fluid that stores cooling fluid therein;
a first fluid flowpath in fluid communication with the source of cooling fluid to receive the cooling fluid from the source of cooling fluid, the first fluid flowpath including the following elements, in downstream flow sequence:
a subcooler having a first side in fluid communication with the first fluid flowpath and a second side configured to be disposed in thermal communication with the source of cooling fluid;
a flow control valve;
a primary evaporator assembly including at least one primary evaporator configured to be disposed in thermal communication with a primary heat load;
a pressure regulator operable to maintain a cooling fluid saturation pressure within the primary evaporator at a predetermined set point;
a second fluid flowpath coupled to the source of cooling fluid and configured pass a portion of the cooling fluid through the second side of the subcooler and return the portion of the cooling fluid to the first fluid flowpath downstream of the primary evaporator assembly, wherein the second fluid flowpath includes a flow restrictor located upstream of the subcooler and configured to expand the portion of the cooling fluid from liquid to vapor; and
a third fluid flowpath that conducts vapor from the source of cooling fluid to the first fluid flowpath at a location downstream of the primary evaporator assembly.

2. The cooling apparatus of claim 1 , wherein the source of cooling fluid includes a separator vessel positioned upstream of the subcooler.

3. The cooling apparatus of claim 1 , wherein the second fluid flowpath is configured to extract the cooling fluid from the first flowpath, pass the cooling fluid through a flow restrictor and the second side of the subcooler, and return the cooling fluid to the first fluid flowpath.

4. The cooling apparatus of claim 1 , further comprising an eductor disposed in the first fluid flowpath upstream of the subcooler, and a suction line connecting a suction inlet of the eductor to the first fluid flowpath at a point downstream of the primary evaporator assembly.

5. The cooling apparatus of claim 1 , wherein the second fluid flowpath and the first fluid flowpath both flow into a suction accumulator.

6. The cooling apparatus of claim 1 , wherein the first fluid flowpath further comprises one or more secondary evaporators downstream of the primary evaporator assembly, configured to be disposed in thermal communication with a secondary heat load.

7. The cooling apparatus of claim 6 , wherein the primary evaporator assembly and the secondary evaporators are disposed in series.

8. A cooling apparatus comprising:
a first fluid flowpath including the following elements, in downstream flow sequence:
a subcooler having a first side in fluid communication with the first fluid flowpath and a second side configured to be disposed in thermal communication with a cold sink;
a flow control valve;
a primary evaporator assembly including at least one primary evaporator configured to be disposed in thermal communication with a primary heat load;
a pressure regulator operable to maintain a refrigerant saturation pressure within the primary evaporator at a predetermined set point;
a second fluid flowpath is configured to extract refrigerant from the first flowpath, pass the refrigerant through the second side of the subcooler, and return the refrigerant to the first fluid flowpath; and
a suction accumulator, wherein the second fluid flowpath and the first fluid flowpath both flow into the suction accumulator,
wherein the first fluid flowpath further comprises one or more secondary evaporators downstream of the primary evaporator assembly, configured to be disposed in thermal communication with a secondary heat load, wherein the primary evaporator assembly and the secondary evaporators are positioned in series.

9. The cooling apparatus of claim 8 , further comprising a separator vessel positioned upstream of the subcooler and providing a source of refrigerant.

10. The cooling apparatus of claim 8 , where the primary evaporator assembly includes two or more evaporators arranged in parallel flow.

11. The cooling apparatus of claim 8 , further comprising a third fluid flowpath configured to extract vapor from a source of refrigerant.

12. The cooling apparatus of claim 8 , further comprising:
a compressor having an inlet and an outlet, a cooler in fluid communication with the outlet of the compressor, and a cooler flow restrictor positioned upstream of the subcooler;
wherein the suction accumulator is disposed at a point downstream of the cooler flow restrictor.

13. The cooling apparatus of claim 12 , wherein the cooler flow restrictor comprises an eductor disposed in the first fluid flowpath between the cooler and a separator vessel, and a suction line connecting a suction inlet of the eductor to the first fluid flowpath at a point downstream of the evaporator assembly.

14. A cooling apparatus comprising:
a first fluid flowpath including the following elements, in downstream flow sequence:
a separator vessel;
a subcooler having a first side in fluid communication with the first fluid flowpath and a second side configured to be disposed in thermal communication with a cold sink;
a flow control valve;
a primary evaporator assembly including at least one primary evaporator configured to be disposed in thermal communication with a primary heat load;
a pressure regulator operable to maintain a refrigerant saturation pressure within the primary evaporator at a predetermined set point; and
a second fluid flowpath having a first end connected in fluid communication with the first fluid flowpath at a point downstream of the separator vessel, wherein the second fluid flowpath is configured to extract refrigerant from the first flowpath, pass the refrigerant through a flow restrictor and the second side of the subcooler, and return the refrigerant to the first fluid flowpath at a second end, wherein the flow restrictor is disposed upstream of the subcooler in the second fluid flowpath and configured to expand the portion of the cooling fluid from liquid to vapor.

15. The cooling apparatus of claim 14 , further comprising a suction accumulator disposed in the first fluid flowpath at a point downstream of the pressure regulator, wherein a first end of the second fluid flowpath is connected in fluid communication with the first fluid flowpath at a point downstream of the suction accumulator.

16. The cooling apparatus of claim 14 , further comprising an eductor disposed in the first fluid flowpath upstream of the subcooler, and a suction line connecting a suction inlet of the eductor to the first fluid flowpath at a point downstream of the primary evaporator assembly.

17. The cooling apparatus of claim 14 , wherein the second fluid flowpath returns the cooling fluid to the first fluid flowpath downstream of a secondary evaporator that is disposed in series with the primary evaporator assembly.

Assignees

• Rolls Royce Nam Tech Inc

Inventors

• Jansen Eugene Charles

Classifications

• F25B40/00 Primary

  Subcoolers, desuperheaters or superheaters · CPC title

• F25B6/00

  Compression machines, plants or systems, with several condenser circuits · CPC title

• F25B40/02

  Subcoolers · CPC title

• F25B41/20

  Disposition of valves, e.g. of on-off valves or flow control valves (expansion valves F25B41/31) · CPC title

• F25B2400/13

  Economisers · CPC title