Method for manufacturing three-dimensional structure, and three-dimensional structure

Patent metadata

Field	Value
Publication number	US-11890820-B2
Application number	US-202117541330-A
Country	US
Kind code	B2
Filing date	Dec 3, 2021
Priority date	Dec 18, 2020
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

A method for manufacturing a three-dimensional structure including: preparing a first structure including a fixing face; fixing a plastic layer to the fixing face of the first structure; preparing a conductive wire; and operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer.

First claim

What is claimed is:

1. A method for manufacturing a three-dimensional structure comprising:
preparing a first structure including a fixing face;
fixing a plastic layer to the fixing face of the first structure;
preparing a conductive wire; and
operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer, wherein
the fixing of the plastic layer includes
placing the first structure into a cavity of a first molding die,
injecting molten plastic onto the fixing face of the first structure in the cavity of the first molding die, and
solidifying the molten plastic to mold the plastic layer on the fixing face of the first structure,

the molding of the plastic layer includes
placing at least a part of an embedded portion of a terminal into the cavity of the first molding die and inserting an external connection portion of the terminal into an accommodation hole communicating with the cavity of the first molding die,
inserting at least the part of the embedded portion of the terminal into the molten plastic injected into the cavity of the first molding die, and
solidifying the molten plastic to insert-mold at least the part of the embedded portion of the terminal into the plastic layer,

the method further includes electrically connecting the terminal to the conductive wire,
the plastic layer includes a first face in contact with the fixing face of the first structure and a second face opposite to the first face,
a binder layer is provided on the embedded portion of the terminal,
the insert-molding of the embedded portion of the terminal includes insert-molding the embedded portion of the terminal into the plastic layer such that an exposed face of the binder layer is substantially flush with the second face of the plastic layer,
the embedding of the conductive wire includes
operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and to press the conductive wire against the second face of the plastic layer, and thereby partly embedding the conductive wire into the second face of the plastic layer, and
operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and bringing the conductive wire partly into contact with the exposed face of the binder layer, and

the electrical connecting of the terminal to the conductive wire includes melting the binder layer and partly exposing the embedded portion of the terminal from the binder layer to connect the conductive wire to the embedded portion of the terminal by heat swaging, welding, or soldering.

2. The method according to claim 1 , wherein
the conductive wire includes a wire body and a fusion layer covering the wire body, and
the electrical connection of the terminal to the conductive wire includes partly melting the fusion layer and partly exposing the wire body from the fusion layer to connect the conductive wire to the embedded portion of the terminal by heat swaging, welding, or soldering.

3. The method according to claim 2 , wherein
the conductive wire further includes an insulating layer between the wire body and the fusion layer, and
the electrical connection of the terminal to the conductive wire includes partly melting the insulating layer and the fusion layer and partly exposing the wire body from the insulating layer and the fusion layer to connect the conductive wire to the embedded portion of the terminal by heat swaging, welding, or soldering.

4. The method according to claim 1 , wherein
the fixing face of the first structure is provided with at least one protrusion and at least one recess,
the plastic layer includes a first face in contact with the fixing face of the first structure and a second face opposite to the first face,
the second face of the plastic layer is a flat face, a convex curved face, or a concave curved face, and
the embedding of the conductive wire includes operating the ultrasonic head to apply ultrasonic waves onto the conductive wire and to press the conductive wire against the second face of the plastic layer, and thereby partly embedding the conductive wire into the second face of the plastic layer.

5. The method according to claim 1 , further comprising:
fixing a second structure to the plastic layer after embedding the conductive wire and covering with the second structure the conductive wire partly protruding from the plastic layer.

6. The method according to claim 5 , further comprising:
placing the first structure, the plastic layer, the conductive wire, and the second structure into a cavity of a second molding die;
injecting molten plastic between the plastic layer and the second structure in the cavity of the second molding die;
inserting a portion of the conductive wire that protrudes from the plastic layer into the molten plastic injected into the cavity of the second molding die;
solidifying the molten plastic in the cavity of the second molding die to mold an infill layer between the plastic layer and the second structure; and
embedding the portion of the conductive wire protruding from the plastic layer in the infill layer.

Assignees

• Hosiden Corp

Inventors

• Shinoda Koji

Classifications

• B29C65/645 Primary

  using friction or ultrasonic vibrations · CPC title

• B29C45/0003

  of successively moulded portions rigidly joined to each other · CPC title

• B29C45/14311

  using means for bonding the coating to the articles (B29C45/14795 takes precedence) · CPC title

• B60R13/005

  Manufacturers' emblems, name plates, bonnet ornaments, mascots or the like; Mounting means therefor · CPC title

• B60R13/04

  External} Ornamental or guard strips; Ornamental inscriptive devices {thereon (fastening strips or bars to sheets or plates by means of clips F16B5/12) · CPC title