Tool, device, and method for polishing lenses

US11890712B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11890712-B2
Application numberUS-201716307174-A
CountryUS
Kind codeB2
Filing dateJun 2, 2017
Priority dateJun 6, 2016
Publication dateFeb 6, 2024
Grant dateFeb 6, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A tool, a device, and a method for zonal polishing of optical workpieces, wherein the tool has a preformed cap for forming a polishing surface, and the tool is placed against the workpiece that is to be polished in such a way that the tilt angle of the axis of rotation of the tool to the normal of the contact surface on the workpiece remains at least essentially constant and/or the size of the contact surface remains at least essentially constant.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for polishing of a surface of an optical workpiece, comprising: swiveling or advancing a tool with a curved polishing surface relative to the workpiece, so that a contact portion of the polishing surface of the tool is pressed partially against the workpiece to be polished, moving the tool over a full diameter of the surface to be polished and through a center of the surface to be polished, rotating the workpiece, increasing a rotational speed of the workpiece when the tool is moved towards the center of the surface and decreasing the rotational speed of the workpiece when the tool is moved away from the center, and rotating the tool at a constant rotational speed which is faster than a maximum rotational speed of the workpiece, wherein the moving of the tool across the diameter of the surface combined together with the rotating of the workpiece results in the contact portion traversing a spiral polishing path. 2. The method according to claim 1 , wherein the polishing surface is pressed partially against the workpiece to be polished to a degree producing an indentation of the contact portion, and wherein a diameter of the contact portion is kept at least essentially constant by variation of a depth of the indentation. 3. The method according to claim 1 , wherein a diameter of the contact portion decreases when moving towards the center of the surface that is to be polished and increases when moving away from the center. 4. The method according to claim 1 , wherein the diameter of the contact portion is smaller than the surface of the workpiece. 5. The method according to claim 1 , wherein the rotational speed of the workpiece during rotation is varied depending on at least one of a rotating position of the workpiece, a locally desired dwell time, or a profile of the workpiece. 6. The method according to claim 1 , further comprising keeping of a diameter of the contact portion at least essentially constant during the polishing of the workpiece. 7. The method according to claim 1 , wherein the polishing surface is pressed partially against the workpiece to be polished to a degree producing an indentation of the contact portion, and wherein an indentation depth of the contact portion is varied by advancing the tool during the polishing of the workpiece. 8. The method according to claim 1 , further comprising keeping a distance between adjacent tracks of the spiral polishing path at least essentially constant. 9. The method according to claim 7 , wherein the degree of said indenting is varied by feedback controlled during advancing of the tool relative to the workpiece during the polishing process depending on the radial position of the contact portion on the workpiece. 10. The method according to claim 7 , wherein a diameter of the contact portion is kept at least essentially constant by variation of the indentation depth. 11. The method according to claim 7 , wherein a diameter of the contact portion decreases when moving towards the center of the surface that is to be polished and increases in the opposite direction. 12. The method according to claim 7 , wherein the rotational speed of the workpiece increases starting from polishing on the edge to the center of the surface and decreases when moving away from the center. 13. The method according to claim 7 , wherein the moving of the tool across the diameter of the surface combined together with the rotating of the workpiece results in the contact portion traversing a spiral polishing path relative to the workpiece. 14. The method according to claim 7 , wherein the diameter of the contact portion is smaller than the surface of the workpiece, and wherein the depth of the indentation is varied depending on at least one of a desired contact pressure of the tool on the workpiece or a profile of the workpiece. 15. The method according to claim 1 , wherein the rotational speed of the workpiece is changed within one rotation.

Assignees

Inventors

Classifications

  • B24B13/01Primary

    Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools · CPC title

  • of optical work, e.g. lenses, prisms {(control of the position of the tool for bevelling optical work B24B47/225)} · CPC title

  • conformable in shape to the optical surface, e.g. by fluid pressure acting on an elastic membrane · CPC title

  • by means of tools with abrading surfaces corresponding in shape with the lenses to be made · CPC title

  • grinding of lenses, the tool or work being controlled by information-carrying means, e.g. patterns, punched tapes, magnetic tapes · CPC title

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What does patent US11890712B2 cover?
A tool, a device, and a method for zonal polishing of optical workpieces, wherein the tool has a preformed cap for forming a polishing surface, and the tool is placed against the workpiece that is to be polished in such a way that the tilt angle of the axis of rotation of the tool to the normal of the contact surface on the workpiece remains at least essentially constant and/or the size of the …
Who is the assignee on this patent?
Schneider Gmbh & Co Kg
What technology area does this patent fall under?
Primary CPC classification B24B13/01. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).