Implantable medical devices having modular lead bores

Patent metadata

Field	Value
Publication number	US-11890484-B2
Application number	US-202218086224-A
Country	US
Kind code	B2
Filing date	Dec 21, 2022
Priority date	Dec 17, 2019
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

First claim

What is claimed is:

1. A modular lead bore for an implantable medical device that includes medical device circuitry, the modular lead bore comprising:
a plurality of lead bore modules that are hermetically coupled together, each lead bore module of the plurality of lead bore modules comprising a lead bore passageway and a feedthrough passageway;
a plurality of electrical contacts, each electrical contact of the plurality of electrical contacts being aligned to the lead bore passageway of each corresponding lead bore module;
a plurality of seals, where each seal of the plurality is present within the lead bore passageway of each corresponding lead bore module and between electrical contacts;
a plurality of hermetic feedthrough assemblies, each hermetic feedthrough assembly of the plurality of hermetic feedthrough assemblies being present within the feedthrough passageway of each corresponding lead bore module; and
a plurality of feedthrough pins, with each feedthrough pin of the plurality of feedthrough pins passing through the hermetic feedthrough assembly of each corresponding lead bore module, each feedthrough pin being electrically coupled to the electrical contact of each corresponding lead bore module and being configured to couple to the medical device circuitry.

2. The modular lead bore of claim 1 , wherein the lead bore modules are constructed of a metal and are welded together.

3. The modular lead bore of claim 1 , wherein each hermetic feedthrough assembly comprises a glass collar within the corresponding feedthrough passageway, each glass collar being bonded against the corresponding lead bore module and the corresponding feedthrough pin.

4. The modular lead bore of claim 1 , further comprising a header defining a lead bore opening that is aligned with the lead bore passageway of the plurality of lead bore modules, the header being coupled to the housing.

5. The modular lead bore of claim 4 , wherein the lead bore passageway comprises a tube that extends from the lead bore opening of the header to the lead bore module, the tube being coupled directly to a first lead bore module of the plurality.

6. The modular lead bore of claim 5 , wherein the tube is welded to the first lead bore module.

7. The modular lead bore of claim 1 , wherein each hermetic feedthrough assembly comprises a filtering capacitor creating a capacitive coupling between the pin and a body of the corresponding lead bore module.

8. The modular lead bore of claim 1 , wherein each hermetic feedthrough assembly comprises a ferrule that contacts a body of the corresponding lead bore module.

9. A method of constructing a modular lead bore, comprising:
hermetically coupling a plurality of lead bore modules together, each lead bore module comprising a lead bore passageway and a feedthrough passageway;
providing a plurality of electrical contacts with each electrical contact of the plurality of electrical contacts being present within the lead bore passageway of each corresponding lead bore module;
providing a plurality of seals, where each seal of the plurality of seals is present the lead bore passageway of each corresponding lead bore module and is present between electrical contacts;
providing a plurality of hermetic feedthrough assemblies, each hermetic feedthrough assembly of the plurality of hermetic feedthrough assemblies being present within the feedthrough passageway of each corresponding lead bore module; and
providing a plurality of feedthrough pins, each feedthrough pin of the plurality of feedthrough pins passing through the hermetic feedthrough assembly of each corresponding lead bore module, each feedthrough pin of the plurality of feedthrough pins being electrically coupled to the electrical contact of each corresponding lead bore module and being configured to couple to medical device circuitry.

10. The method of claim 9 , wherein the lead bore modules are constructed of a metal.

11. The method of claim 10 , where the lead bore modules are welded together.

12. The method of claim 9 , wherein each hermetic feedthrough assembly comprises a glass collar within the feedthrough passageway, the glass collar being bonded against the lead bore module and the feedthrough pin.

13. The method of claim 9 , wherein the lead bore passageway of the plurality of lead bore modules is configured to align with a lead bore opening of a header of the medical device.

14. The method of claim 9 , wherein each hermetic feedthrough assembly comprises a filtering capacitor creating a capacitive coupling between the pin and a body of the corresponding lead bore module.

15. The method of claim 9 , wherein each hermetic feedthrough assembly comprises a ferrule that contacts a body of the corresponding lead bore module.

Assignees

• Medtronic Inc

Inventors

• Janzig Darren A
• Thom Andrew
• Tischendorf Brad
• Roles Randy S
• Deininger Steven T
• Whitehead Nicholas R

Classifications

• A61N1/3754 Primary

  Feedthroughs · CPC title

• A61N1/37514

  Brain implants · CPC title

• A61N1/3752 Primary

  Details of casing-lead connections · CPC title

• H01R13/5224

  for medical use · CPC title

• H01R24/58

  Contacts spaced along longitudinal axis of engagement · CPC title