Integrated circuit thermal management system

Patent metadata

Field	Value
Publication number	US-11889661-B2
Application number	US-202017024671-A
Country	US
Kind code	B2
Filing date	Sep 17, 2020
Priority date	Sep 17, 2020
Publication date	Jan 30, 2024
Grant date	Jan 30, 2024

Abstract

An integrated circuit thermal management system includes an enclosure, a heat exchanger, an integrated circuit, a slide having a moveable slide body, an electromagnetic coil, a magneto caloric material and controller circuitry. The heat exchanger is positioned on a first side of the enclosure, and the integrated circuit is positioned on a second side of the enclosure with a temperature sensor configured to generate a temperature signal indicative of a temperature of the integrated circuit. The slide is disposed in the enclosure extending between the heat exchanger and the integrated circuit. The electromagnetic coil and the magnetocaloric material are included on the slide body. The controller is configured to control energization of the magnetic coil and movement of the magnetocaloric material on the slide body between the heat exchanger and the integrated circuit based on the temperature signal.

First claim

What is claimed is:

1. An integrated circuit thermal management system comprising:
an enclosure;
a heat exchanger positioned on a first side of the enclosure;
an integrated circuit positioned on a second side of the enclosure;
a temperature sensor configured to generate a temperature signal indicative of a temperature of the integrated circuit;
a slide disposed in the enclosure and extending between the heat exchanger and the integrated circuit, the slide comprising a moveable slide body;
an electromagnetic coil and a magnetocaloric material positioned on the slide body; and
a controller configured to control energization of the electromagnetic coil and movement of the magnetocaloric material on the slide between the heat exchanger and the integrated circuit based on the temperature signal.

2. The integrated circuit thermal management system of claim 1 , wherein the electromagnetic coil is configured to activate the magnetocaloric material and moveably slide the magnetocaloric material on the slide between the heat exchanger and the integrated circuit.

3. The integrated circuit thermal management system of claim 1 , further comprising a solenoid, the electromagnetic coil configured to activate the magnetocaloric material and the solenoid configured to moveably slide the magnetocaloric material and the electromagnetic coil between the heat exchanger and the integrated circuit.

4. The integrated circuit thermal management system of claim 1 , further comprising a first heat pipe contiguously contacting and extending away from the heat exchanger, and a second heat pipe contiguously contacting and extending away from the integrated circuit toward the first heat pipe to provide a gap between the first heat pipe and the second heat pipe.

5. The integrated circuit thermal management system of claim 4 , wherein the slide is aligned to reciprocate the slide body on a rail between the heat exchanger and the integrated circuit, the rail comprising the first heat pipe axially aligned with the second heat pipe, with the gap therebetween.

6. The integrated circuit cooling system of claim 4 , wherein the magnetocaloric material is in thermal communication with the first heat pipe only when the magnetocaloric material and the electromagnetic coil are moved closer to the heat exchanger and the magnetocaloric material is in thermal communication with the second heat pipe only when the magnetocaloric material and the electromagnetic coil are moved closer to the integrated circuit.

7. The integrated circuit thermal management system of claim 1 , further comprising a deformable member that is biased to maintain thermal communication between the magnetocaloric material and the heat exchanger or is biased to maintain thermal communication between the magnetocaloric material and the integrated circuit.

8. An integrated circuit thermal management system comprising:
a slide comprising a slide body moveable between a first position and a second position;
a heat exchanger positioned at the first position;
an integrated circuit positioned at the second position;
an electromagnetic coil disposed on the slide body;
a magnetocaloric material disposed on the slide body and positioned within the electromagnetic coil;
a sensor positioned to sense an operating temperature of the integrated circuit; and
controller circuitry configured to execute instructions stored in memory to:
receive a temperature signal from the sensor indicative of the sensed operating temperature; and
control movement of the slide body between the first position and the second position and energization of the electromagnetic coil such that heat from the magnetocaloric material is transferred between the heat exchanger and the magnetocaloric material or heat from the integrated circuit is transferred between the magnetocaloric material and the integrated circuit according to the sensed operating temperature.

9. The integrated circuit thermal management system of claim 8 , wherein the controller circuitry is configured to energize the electromagnetic coil while the slide body is at the first position and deenergize the electromagnetic coil while the slide body is at the second position.

10. The integrated circuit thermal management system of claim 8 , wherein the heat exchanger includes a first thermal landing, and the integrated circuit includes a second thermal landing, and at least one of the magnetocaloric material or the slide body contiguously contact the first thermal landing in the first positon, and contiguously contact the second thermal landing in the second position.

11. The integrated circuit thermal management system of claim 10 , wherein the first thermal landing comprises a first heat pipe extending away from the heat exchanger to contact the at least one of the magnetocaloric material or the slide body in the first position, and the second thermal landing is a second heat pipe extending away from the integrated circuit toward the first heat pipe to contact the at least one of the magnetocaloric material or the slide body in the second position, and the first heat pipe and the second heat pipe extending towards each other to create a gap therebetween.

12. The integrated circuit thermal management system of claim 10 , wherein the first thermal landing comprises a first thermally conductive surface of the heat exchanger comprising a thermal paste, and the second thermal landing comprises a second thermally conductive surface of the integrated circuit, wherein the second thermally conductive surface comprises a thermal transfer paste with shock absorbing properties.

13. The integrated circuit thermal management system of claim 8 , further comprising a solenoid, the solenoid energized and deenergized by the controller circuitry to move the slide body between the first position and the second position.

14. The integrated circuit thermal management system of claim 8 , wherein the electromagnetic coil is arranged with respect to the slide and the magnetocaloric material to be energized by the controller circuitry and form a magnetic field to move the slide body between the second position and the first position and also align an orientation of magnetic dipoles in the magenetocaloric material.

15. The integrated circuit thermal management of claim 14 , further comprising a deformable member coupled with the slide, the deformable member having a resting memory position that aligns the slide body with the second position, and the deformable member deformed away from the resting memory position as the magnetic field moves the slide body from the second position to the first position.

16. The integrated circuit thermal management system of claim 8 , wherein the controller circuitry is configured to receive at least one operational parameter related to combustion in a gas turbine engine, the controller circuitry, in response to the at least one operational parameter, configured to initiate movement of the slide body between the second position and the first position, and energization of the electromagnetic coil.

17. The integrated circuit thermal management system of claim 8 , wherein the slide is a plurality of slides, the sensor is a plurality of sensors, and the integrated circuit is a plurality of spaced apart integrated circuits, a temperature of each of the spaced apart integrated circuits being sensed by a respective sensor, and the controller circuitry is configured to execute instructions stored in memory to control movement all of the slides between the first position and the second position and energization of the electromag

Assignees

• Rolls Royce Nam Tech Inc
• Rolls Royce Corp

Inventors

• Skertic Richard Joseph
• Wilson Eric E
• Costello John Joseph

Classifications

• H05K7/20381 Primary

  Thermal management, e.g. evaporation control · CPC title

• F28D15/02

  in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} · CPC title

• H01F1/012

  adapted for magnetic entropy change by magnetocaloric effect, e.g. used as magnetic refrigerating material (refrigeration systems using magnetic effects F25B21/00) · CPC title

• H01F7/064

  Circuit arrangements for actuating electromagnets (circuit arrangements for obtaining special operating characteristics H01F7/18; driving circuits for electromagnets making use of a switching regulator H01H47/325) · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title