Electronic apparatus

Patent metadata

Field	Value
Publication number	US-11889656-B2
Application number	US-202117550198-A
Country	US
Kind code	B2
Filing date	Dec 14, 2021
Priority date	Mar 26, 2021
Publication date	Jan 30, 2024
Grant date	Jan 30, 2024

Abstract

An electronic apparatus includes a body including a containing cavity, a separation component arranged at the containing cavity to divide the containing cavity into a first cavity and a second cavity, a heat generation assembly arranged at the first cavity, and an air guide component arrange at the second cavity to drive airflow at the second cavity to dissipate the heat of the heat generation assembly through the separation component, wherein the second cavity is configured as an air duct of the electronic apparatus.

First claim

What is claimed is:

1. An electronic apparatus comprising:
a body with a containing cavity;
a separation component arranged at the containing cavity and dividing the containing cavity into a first cavity and a second cavity;
a heat generation assembly arranged at the first cavity; and
a fan arranged at the second cavity and configured to drive airflow at the second cavity to dissipate heat of the heat generation assembly through the separation component, at least a portion of the heat generation assembly overlapping with the fan in a first direction, the first direction being from the first cavity to the second cavity, and the second cavity being an air duct of the electronic apparatus;
wherein the separation component includes:
a support component connected to an inner wall of the containing cavity and having a through-hole; and
a heat exchange component arranged at the through-hole and thermally connected to the heat generation assembly, the fan at the second cavity overlapping with the heat exchange component in the first direction.

2. The electronic apparatus of claim 1 , wherein:
the fan is arranged at a distance from the separation component, a top side of the fan facing the separation component being an air inlet side of the fan.

3. The electronic apparatus of claim 2 , wherein:
the body includes an inlet and an outlet; and
the second cavity includes:
a first air duct close to the inlet of the body and having a first width in the first direction;
a second air duct close to the air inlet side of the fan and having a second width in the first direction; and
a third air duct in communication with the first air duct and the second air duct, and having a third width in the first direction, the third width being larger than the first width and the second width.

4. The electronic apparatus of claim 1 , further comprising:
a thermal conductive component arranged at the first cavity;
wherein:
the heat generation assembly includes:
a main board at least partially overlapping the fan in the first direction; and
a main heat generation component arranged at a side of the main board close to the fan and overlapping the fan in the first direction; and

the thermal conductive component contacts the main heat generation component and is thermally connected to the separation component, and is configured to conduct heat generated by the main heat generation component to the separation component.

5. The electronic apparatus of claim 1 , wherein the first cavity includes a sealed cavity.

6. The electronic apparatus of claim 1 , wherein
the heat exchange component protrudes from a surface of the support component facing the second cavity, and matches a shape of the fan.

7. The electronic apparatus of claim 1 , wherein the heat exchange component includes:
a plate structure arranged at the through-hole; and
a flow channel structure connected to the plate structure and arranged at a side facing the second cavity, a direction of the flow channel structure matching a direction in which the fan drives air to flow in the second cavity.

8. The electronic apparatus of claim 1 , wherein a projection of the first cavity in the first direction overlaps a projection of the second cavity in the first direction.

9. The electronic apparatus of claim 8 , wherein the body includes a middle frame connected to the separation component and including:
the containing cavity;
a first opening connected to the first cavity;
a second opening connected to the second cavity arranged opposite to the first opening.

10. The electronic apparatus of claim 9 , wherein the body further includes:
a first cover covering the first opening and arranged at a top of the middle frame, and matching a shape of the middle frame in the first direction; and
a second cover covering the second opening and arranged at a bottom of the middle frame, and matching the shape of the first middle frame in the first direction.

11. The electronic apparatus of claim 8 , wherein the body includes:
a first middle frame including:
the first cavity;
a first opening; and
a second opening arranged opposite to the first opening and covered by the separation component; and

a second middle frame having the second cavity and a third opening arranged opposite to the separation component, the second middle frame being connected to the first middle frame, and a projection of the second middle frame in the first direction overlapping a projection of the first middle frame in the first direction.

12. The electronic apparatus of claim 11 , wherein the body further includes:
a first cover covering the third opening and arranged at a top of the second middle frame, and matching a shape of the second middle frame in the first direction; and
a second cover covering the fifth opening and arranged at a bottom of the third middle frame, and matching the shape of the third middle frame in the first direction.

Assignees

• Lenovo Beijing Ltd

Inventors

• Xi Shenghua
• Wei Xin

Classifications

• H05K7/20145 Primary

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K5/03

  Covers · CPC title

• H05K7/20172 Primary

  Fan mounting or fan specifications · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G06F1/20 Primary

  Cooling means · CPC title