Magnetic component and method of forming

Patent metadata

Field	Value
Publication number	US-11887766-B2
Application number	US-202017001171-A
Country	US
Kind code	B2
Filing date	Aug 24, 2020
Priority date	Aug 24, 2020
Publication date	Jan 30, 2024
Grant date	Jan 30, 2024

Abstract

A component includes a magnetic core having a body formed of a first material, defining a first opening and a second opening thereon. A duct formed of a second material extends at least partially through the body between the first opening and the second opening. The first opening and the second opening are in fluid communication by way of the duct.

First claim

What is claimed is:

1. A method of forming a component having a body, comprising:
printing the body via a layer-by-layer process, except for the final layer of the body, including heating each printed layer;
for the final layer of the body, depositing the final layer of the body without applying heat to the deposited final layer;
coupling the body to a PCB;
applying a solder material to the PCB; and
coupling the component to the PCB via a reflow soldering process.

2. The method of claim 1 , wherein the heating comprises sintering each printed layer of the body except the last printed layer of the body.

3. The method of claim 1 , wherein the printing the body includes printing a magnetic core having a first opening and a second opening defined thereon; and
printing a duct extending at least partially through the magnetic core between the first opening and the second opening, the first opening and the second opening being in fluid communication by way of the duct.

4. The method of claim 3 , wherein the printing the body includes printing the magnetic core with a first material, and printing the duct with a second material.

5. The method of claim 4 , wherein the first material is a ferritic material.

6. The method of claim 4 , wherein the second material is a thermally conductive and electrically insulative material.

7. The method of claim 1 , additionally comprising printing a set of windings arranged around a portion of the body.

8. The method of claim 7 , wherein printing the set of windings includes printing the windings with a conductive third material.

9. The method of claim 1 , wherein, for the final layer of the body, the depositing the final layer of the body without applying heat further comprises omitting a sintering step to sinter the deposited final layer of the body.

10. The method of claim 1 , wherein, for the final layer of the body, the depositing the final layer of the body without applying heat further comprises leaving the deposited layer as an unbound powder layer.

Assignees

• Ge Aviation Systems Llc

Inventors

• Ramabhadran Ramanujam
• Wang Ruxi
• Rivas Davila Juan Manuel
• Xu Jiale

Classifications

• H01F27/08 Primary

  Cooling (heat-transfer elements F28F); Ventilating (structural details of casings H01F27/02) · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• H01F27/245

  made from sheets, e.g. grain-oriented (H01F27/26 takes precedence) · CPC title

• H01F41/0233

  Manufacturing of magnetic circuits made from sheets (magnetic cores made from sheets H01F27/245; soft magnetic alloys in the form of sheets H01F1/16) · CPC title