Solventless release coating organopolysiloxane composition and sheet-form substrate having cured release coating
US-10030169-B2 · Jul 24, 2018 · US
US11886110B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11886110-B2 |
| Application number | US-202117209814-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 23, 2021 |
| Priority date | Mar 27, 2020 |
| Publication date | Jan 30, 2024 |
| Grant date | Jan 30, 2024 |
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An imprinting apparatus includes a silicon master and an anti-stick layer coating the silicon master. The silicon master includes a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features comprises a depression having an opening with its largest opening dimension being less than about 300 nm. The anti-stick layer includes a crosslinked silane polymer network.
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What is claimed is: 1. A method, comprising: applying a formulation on a surface of a silicon master including a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features having a largest opening dimension being less than about 300 nm, the formulation including: a first silane monomer: and a second silane monomer including a hydrolyzable chloride group, the second silane monomer being present in an amount ranging from 0.001 wt % to less than about 1.4 wt % based on a total weight of silanes present in the formulation; and curing the applied formulation, thereby forming an anti-stick layer. 2. The method as defined in claim 1 , wherein the second silane monomer is: 3. The method as defined in claim 1 , wherein the formulation further includes: i) a dimer including two bonded units of the first silane monomer; ii) a trimer including three bonded units of the first silane monomer; iii) a higher molecular species including more than three bonded units of the first silane monomer; iv) the first silane monomer having at least one hydrolyzed ethoxy group; or v) any combination of i), ii), iii), and iv). 4. The method as defined in claim 1 , wherein curing involves: an incubation process; a rinsing process after the incubation process; and a heating process after the rinsing process. 5. The method as defined in claim 4 , wherein the incubation process and the heating processes are independently performed at a temperature ranging from about 20° C. to about 250° C., for a time ranging from about 1 minute to about 30 minutes. 6. The method as defined in claim 1 , further comprising generating the formulation by: diluting a neat silane material including the first and second silane monomers in a first solvent to form a precursor solution; exposing the precursor solution to an aqueous, basic solution to generate an aqueous phase and an organic phase, wherein the organic phase includes the first solvent; removing the aqueous phase; removing the first solvent from the organic phase to obtain a purified silane material; and diluting the purified silane material in a second solvent. 7. The method as defined in claim 6 , wherein the second solvent is an aprotic solvent that i) solvates the purified silane material and ii) has a boiling point ranging from about 50° C. to about 250° C. 8. The method as defined in claim 6 , wherein the purified silane material is present in the formulation in an amount ranging from about 1 wt % to about 20 wt %. 9. The method as defined in claim 1 , wherein applying the formulation involves spin coating. 10. The method as defined in claim 1 , wherein one of: the formulation is solvent free; or the formulation includes from about 1 wt % to about 20 wt % of the first silane monomer. 11. The method as defined in claim 1 , wherein the second silane monomer is present in an amount ranging from about 0.28 wt % to about 1.1 wt % based on the total weight of silanes present in the formulation. 12. A method, comprising: forming an imprinting apparatus by: depositing a formulation on a silicon master including a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features having a largest opening dimension of less than about 300 nm, and the formulation including: a first silane monomer: and a second silane monomer including a hydrolyzable chloride group, the second silane monomer being present in an amount ranging from about 0.001 wt % to less than about 1.4 wt % based on a total weight of silanes present in the formulation; and curing the formulation, thereby forming an anti-stick layer on the silicon master; depositing a silicon-based working stamp material on the anti-stick layer of the imprinting apparatus; curing the silicon-based working stamp material to form a working stamp including a negative replica of the plurality of features; and releasing the working stamp from the imprinting apparatus. 13. The method as defined in claim 12 , wherein curing the formulation involves: an incubation process; a rinsing process after the incubation process; and a heating process after the rinsing process. 14. The method as defined in claim 13 , wherein the incubation and heating processes are independently performed at a temperature ranging from about 20° C. to about 250° C., for a time ranging from about 1 minute to about 30 minutes. 15. The method as defined in claim 12 , wherein the silicon-based working stamp material includes a silicon acrylate monomer.
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title
in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) · CPC title
Coating on a rotating support, e.g. using a whirler or a spinner · CPC title
Finishing the coated layer, e.g. drying, baking, soaking · CPC title
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