Imprinting apparatus

US11886110B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11886110-B2
Application numberUS-202117209814-A
CountryUS
Kind codeB2
Filing dateMar 23, 2021
Priority dateMar 27, 2020
Publication dateJan 30, 2024
Grant dateJan 30, 2024

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An imprinting apparatus includes a silicon master and an anti-stick layer coating the silicon master. The silicon master includes a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features comprises a depression having an opening with its largest opening dimension being less than about 300 nm. The anti-stick layer includes a crosslinked silane polymer network.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: applying a formulation on a surface of a silicon master including a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features having a largest opening dimension being less than about 300 nm, the formulation including: a first silane monomer:  and a second silane monomer including a hydrolyzable chloride group, the second silane monomer being present in an amount ranging from 0.001 wt % to less than about 1.4 wt % based on a total weight of silanes present in the formulation; and curing the applied formulation, thereby forming an anti-stick layer. 2. The method as defined in claim 1 , wherein the second silane monomer is: 3. The method as defined in claim 1 , wherein the formulation further includes: i) a dimer including two bonded units of the first silane monomer; ii) a trimer including three bonded units of the first silane monomer; iii) a higher molecular species including more than three bonded units of the first silane monomer; iv) the first silane monomer having at least one hydrolyzed ethoxy group; or v) any combination of i), ii), iii), and iv). 4. The method as defined in claim 1 , wherein curing involves: an incubation process; a rinsing process after the incubation process; and a heating process after the rinsing process. 5. The method as defined in claim 4 , wherein the incubation process and the heating processes are independently performed at a temperature ranging from about 20° C. to about 250° C., for a time ranging from about 1 minute to about 30 minutes. 6. The method as defined in claim 1 , further comprising generating the formulation by: diluting a neat silane material including the first and second silane monomers in a first solvent to form a precursor solution; exposing the precursor solution to an aqueous, basic solution to generate an aqueous phase and an organic phase, wherein the organic phase includes the first solvent; removing the aqueous phase; removing the first solvent from the organic phase to obtain a purified silane material; and diluting the purified silane material in a second solvent. 7. The method as defined in claim 6 , wherein the second solvent is an aprotic solvent that i) solvates the purified silane material and ii) has a boiling point ranging from about 50° C. to about 250° C. 8. The method as defined in claim 6 , wherein the purified silane material is present in the formulation in an amount ranging from about 1 wt % to about 20 wt %. 9. The method as defined in claim 1 , wherein applying the formulation involves spin coating. 10. The method as defined in claim 1 , wherein one of: the formulation is solvent free; or the formulation includes from about 1 wt % to about 20 wt % of the first silane monomer. 11. The method as defined in claim 1 , wherein the second silane monomer is present in an amount ranging from about 0.28 wt % to about 1.1 wt % based on the total weight of silanes present in the formulation. 12. A method, comprising: forming an imprinting apparatus by: depositing a formulation on a silicon master including a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features having a largest opening dimension of less than about 300 nm, and the formulation including: a first silane monomer:  and a second silane monomer including a hydrolyzable chloride group, the second silane monomer being present in an amount ranging from about 0.001 wt % to less than about 1.4 wt % based on a total weight of silanes present in the formulation; and curing the formulation, thereby forming an anti-stick layer on the silicon master; depositing a silicon-based working stamp material on the anti-stick layer of the imprinting apparatus; curing the silicon-based working stamp material to form a working stamp including a negative replica of the plurality of features; and releasing the working stamp from the imprinting apparatus. 13. The method as defined in claim 12 , wherein curing the formulation involves: an incubation process; a rinsing process after the incubation process; and a heating process after the rinsing process. 14. The method as defined in claim 13 , wherein the incubation and heating processes are independently performed at a temperature ranging from about 20° C. to about 250° C., for a time ranging from about 1 minute to about 30 minutes. 15. The method as defined in claim 12 , wherein the silicon-based working stamp material includes a silicon acrylate monomer.

Assignees

Inventors

Classifications

  • G03F7/0002Primary

    Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title

  • in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) · CPC title

  • Coating on a rotating support, e.g. using a whirler or a spinner · CPC title

  • Finishing the coated layer, e.g. drying, baking, soaking · CPC title

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What does patent US11886110B2 cover?
An imprinting apparatus includes a silicon master and an anti-stick layer coating the silicon master. The silicon master includes a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features comprises a depression having an opening with its largest opening dimension being less than about 300 nm. The anti-stick layer includes a crosslinked s…
Who is the assignee on this patent?
Illumina Inc
What technology area does this patent fall under?
Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 30 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).