Two-stage expanded beam optical coupling

Patent metadata

Field	Value
Publication number	US-11886014-B2
Application number	US-202117522203-A
Country	US
Kind code	B2
Filing date	Nov 9, 2021
Priority date	Nov 9, 2020
Publication date	Jan 30, 2024
Grant date	Jan 30, 2024

Abstract

A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.

First claim

What is claimed is:

1. A silicon-based photonic chip comprising an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly, wherein the interface comprises:
a single-mode waveguide configured to guide light and to provide a first light beam;
a first optical element configured to expand the first light beam in a first direction that is in-plane of the photonic chip and to confine the first light beam in a direction that is perpendicular to the plane of the photonic chip, thereby providing an expanded light beam; and
a second optical element configured to deflect the expanded light beam and to further expand the expanded light beam in a second direction that is perpendicular to the first direction, thereby providing an output light beam from the photonic chip having a beam dimension in the first direction that is the same as a beam dimension in the first direction of the expanded light beam provided by the first optical element.

2. The photonic chip of claim 1 , wherein:
the first optical element is configured to shape the expanded light beam.

3. The photonic chip of claim 1 , wherein the second optical element is configured to shape the output light beam.

4. The photonic chip of claim 1 , wherein:
the second optical element is configured to deflect the expanded light beam by an angle in a range of 80°-100° relative to the first direction.

5. The photonic chip of claim 1 , wherein:
the first light beam has a beam diameter in a range of 0.5-1.5 μm; and
the output light beam has a beam diameter larger than 10 μm.

6. The photonic chip of claim 1 , wherein:
the first optical element comprises silicon and is patterned on a silicon-based substrate of the photonic chip.

7. The photonic chip of claim 1 , wherein:
the second optical element is integrated with or inserted into a silicon-based substrate of the photonic chip.

8. The photonic chip of claim 1 , wherein:
the first optical element is disposed in-plane relative to the photonic chip and comprises at least one of:
a convex lens;
a graded index lens;
a slab coupler evanescently coupled to the single-mode waveguide;
a light reflective element; or
a micro-mirror.

9. The photonic chip of claim 1 , wherein:
the second optical element comprises at least one of:
a cylindrical light-reflective element;
a metallized polymer structure; or
a micro-mirror.

10. The photonic chip of claim 1 , wherein:
the second optical element comprises a curved lens with an integrated mirror.

11. The photonic chip of claim 10 , wherein:
the curved lens is a 1D curved lens and the integrated mirror is a 45° mirror.

12. The photonic chip of claim 1 , further comprising:
a trench disposed at least partly between the first optical element and the second optical element such that a path of the expanded light beam from the first optical element to the second optical element goes through at least a part of the trench.

13. The photonic chip of claim 12 , wherein:
the second optical element is disposed within the trench.

14. The photonic chip of claim 13 , further comprising:
a dielectric material disposed within the trench and at least partially surrounding the second optical element.

15. The photonic chip of claim 12 , wherein:
the second optical element comprises an edge coupler arranged at an edge of the photonic chip, the edge of the photonic chip being at least partially defined by the trench.

16. A method for fabricating a silicon-based photonic chip that comprises an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly, wherein the method comprises:
fabricating a single-mode waveguide configured to guide light and to provide a first light beam;
fabricating a first optical element, wherein the first optical element is configured to expand the first light beam in a first direction that is in-plane relative to the photonic chip and to confine the first light beam in a direction that is perpendicular to the plane of the photonic chip, thereby providing an expanded light beam; and
fabricating a second optical element, wherein the second optical element is configured to deflect the expanded light beam and to further expand the expanded light beam in a second direction that is perpendicular to the first direction, thereby providing an output light beam out of the photonic chip having a beam dimension in the first direction that is the same as a beam dimension in the first direction of the expanded light beam provided by the first optical element.

17. The method of claim 16 , wherein the first optical element comprises silicon, and wherein fabricating the first optical element comprises patterning the first optical element on a silicon-based substrate of the photonic chip.

18. The method of claim 16 , further comprising: inserting the second optical element into a silicon-based substrate of the photonic chip.

19. The method of claim 16 , wherein the first optical element comprises at least one of a convex lens, a graded index lens, a slab coupler evanescently coupled to the single-mode waveguide, a light reflective element, or a micro-mirror.

20. The method of claim 16 , wherein the second optical element comprises at least one of a cylindrical light-reflective element, a metallized polymer structure, or a micro-mirror.

Assignees

• Imec Vzw
• Univ Leuven Kath
• Univ Gent

Inventors

• He Junwen
• Van Campenhout Joris
• Van Steenberge Geert
• Missinne Jeroen
• Yilmaz Yigit
• Kim Do Won
• La Tulipe Douglas Charles

Classifications

• G02B6/36 Primary

  Mechanical coupling means (G02B6/255, G02B6/42 take precedence) · CPC title

• G02B6/12004

  Combinations of two or more optical elements · CPC title

• G02B6/132

  by deposition of thin films · CPC title

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/4206

  Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title