RF cured nanocomposite adhesives for multi-material joining applications

US11879073B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11879073-B2
Application numberUS-202016853049-A
CountryUS
Kind codeB2
Filing dateApr 20, 2020
Priority dateApr 20, 2020
Publication dateJan 23, 2024
Grant dateJan 23, 2024

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method for fabricating, and curing, nanocomposite adhesives including introducing nanoheater elements into a heat-curing adhesive to fabricate a nanocomposite adhesive, and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive to heat, and cure the nanocomposite adhesive. The nanocomposite adhesive is physically applied to first and second materials to bond the first and second materials upon curing of the nanocomposite adhesive, and the RF electromagnetic wave has a frequency in the radio-frequency range, having energy that is transferred to the nanoheater elements by electromagnetic wave interactions with permanent and induced dipoles, intrinsic photon-phonon interaction, or interactions with nanoheater defects and grain structures.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for radio frequency electromagnetic curing of nanocomposite adhesives, the method comprising: introducing into a heat-curing adhesive a plurality of nanoheater elements to create a nanocomposite adhesive, wherein (i) each of the plurality of nanoheater elements has a respective length and a respective diameter and a high length-to-diameter aspect ratio of 10 or greater, (ii) each of the plurality of nanoheater elements comprises a dielectric ceramic material, and (iii) the plurality of nanoheater elements forms a network that provides uniform dispersion of the plurality of nanoheater elements in the heat-curing adhesive; applying the nanocomposite adhesive between a first material and a second material, wherein the nanocomposite adhesive is in physical contact with both the first material and the second material; and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive, wherein the RF electromagnetic wave transfers energy to the plurality of nanoheater elements to generate heat, wherein the plurality of nanoheater elements further transfer the heat to the adhesive. 2. The method of claim 1 , further comprising: introducing into the heat-curing adhesive, a solvent before introducing into the heat- curing adhesive the nanoheater elements, to create a mixture of the solvent and the heat- curing adhesive; introducing into the mixture of the solvent and the heat-curing adhesive, the plurality of nanoheater elements; mixing the nanoheater elements into the mixture of the solvent and the heat-curing adhesive, to create a nanocomposite adhesive; and removing the solvent from the nanocomposite adhesive before applying the electromagnetic wave to the nanocomposite adhesive. 3. The method of claim 1 , wherein introducing the plurality of nanoheater elements comprises introducing from 1 to 10 wt % of the nanoheater elements to the heat-curing adhesive. 4. The method of claim 1 , wherein each of the plurality of nanoheater elements comprises a nanofiber, a nanorod, a nanotube, nanoplatelet, or a nanoplate. 5. The method of claim 1 , wherein the plurality of nanoheater elements each have a length-to-width aspect ratio of greater than 1000. 6. The method of claim 1 , wherein the plurality of nanoheater elements each have a diameter between 15 nanometers and 500 nanometers. 7. The method of claim 1 , wherein the plurality of nanoheater elements comprise ceramic nanofibers. 8. The method of claim 1 , wherein the first material comprises at least one of a fiber glass, aluminum, or stainless steel. 9. The method of claim 1 , wherein the second material comprises at least one of a fiber glass, aluminum, or stainless steel. 10. The method of claim 1 , wherein the first material and the second material comprise different materials. 11. The method of claim 1 , wherein the plurality of nanoheater elements comprises a non-magnetic material. 12. The method of claim 1 , wherein the plurality of nanoheater elements have a dielectric loss tangent of 0.01 to 0.5 at GHz frequencies. 13. The method of claim 1 , wherein the plurality of nanoheater elements comprises at least one of a lossy ferroelectric material, carbon nanotube, or a metal. 14. The method of claim 1 , wherein the heat-curing adhesive comprises an epoxy. 15. The method of claim 1 , wherein providing the RF electromagnetic wave to the nanocomposite adhesive comprises: spatially configuring an RF applicator relative to the nanocomposite adhesive, such that the RF applicator supplies the RF electromagnetic wave to the nanoheater elements of the nanocomposite adhesive. 16. The method of claim 1 , wherein the RF electromagnetic wave comprises an electromagnetic wave with a frequency from 20 kHz to 300 GHz. 17. The method of claim 1 , wherein introducing the plurality of nanoheater elements comprises introducing a loading ratio of nanoheater elements at an amount lower than a percolation threshold.

Assignees

Inventors

Classifications

  • C09J11/04Primary

    inorganic · CPC title

  • involving heating of the applied adhesive · CPC title

  • Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title

  • Manufacture or treatment of nanostructures · CPC title

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What does patent US11879073B2 cover?
A method for fabricating, and curing, nanocomposite adhesives including introducing nanoheater elements into a heat-curing adhesive to fabricate a nanocomposite adhesive, and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive to heat, and cure the nanocomposite adhesive. The nanocomposite adhesive is physically applied to first and second materials to bond the f…
Who is the assignee on this patent?
Uchicago Argonne Llc
What technology area does this patent fall under?
Primary CPC classification C09J11/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).