Preparation method for thermoplastic multi-hybrid polyimide films

Patent metadata

Field	Value
Publication number	US-11879039-B1
Application number	US-202318233907-A
Country	US
Kind code	B1
Filing date	Aug 15, 2023
Priority date	Aug 17, 2022
Publication date	Jan 23, 2024
Grant date	Jan 23, 2024

Abstract

A preparation method for thermoplastic multi-hybrid polyimide films is provided. The method includes the following steps: S1, adding an aromatic diisocyanate to an aromatic dianhydride solution system to obtain an anhydride-terminated polyimide precursor solution containing a seven-membered ring structure named a first solution; S2, adding an aromatic dianhydride to an aromatic diamine solution system to obtain an amino-terminated polyamic acid solution named a second solution; S3, mixing the first solution and the second solution to obtain a uniform multi-polymerization solution; S4, after extending the multi-polymerization solution to form a film, carrying out a gradient heating curing in a vacuum oven and an ordinary oven respectively to obtain a thermoplastic multi-hybrid polyimide film after cooling. The invention prepares a thermoplastic multi-hybrid polyimide film with better comprehensive performance rapidly, the preparation process is simple, and the production cost is effectively reduced.

First claim

What is claimed is:

1. A preparation method for a thermoplastic multi-hybrid polyimide film, comprising the following steps:
S1, adding an aromatic diisocyanate to an aromatic dianhydride solution system according to a molar ratio of anhydride to isocyanate of 1.05:1-1.10:1, and stirring in a nitrogen atmosphere for a first reaction for 8-12 h to obtain an anhydride-terminated polyimide precursor solution containing a seven-membered ring structure named a first solution, where in a weight percentage of an anhydride-terminated polyimide precursor containing the seven-membered ring structure of the first solution is 15%-25%;
S2, adding an aromatic dianhydride to an aromatic diamine solution system according to a molar ratio of diamine to anhydride of 1.04:1-1.08:1, stirring for a second reaction for 4-8 h to obtain an amino-terminated polyamic acid solution named a second solution; wherein a weight percentage of an amino-terminated polyamic acid in the second solution is 15%-25%,
S3, mixing the first solution and the second solution according to a weight ratio of 1:1.6-1:3.2 for a third reaction for 10-20 min to obtain a multi-polymerization solution;
S4, after extending the multi-polymerization solution to form a film, carrying out a gradient heating curing in a vacuum oven and an ordinary oven respectively, and cooling to obtain the thermoplastic multi-hybrid polyimide film.

2. The preparation method for the thermoplastic multi-hybrid polyimide films according to claim 1 , wherein a reaction temperature of the first solution is 90-100° C.; a reaction temperature of the second solution is −5-25° C.; a mixing temperature of step S3 is −15-25° C.

3. The preparation method for the thermoplastic multi-hybrid polyimide films according to claim 1 , wherein a mixing method for the aromatic dianhydride and the aromatic diamine solution system in step S2 is as follows: evenly dividing the aromatic dianhydride into 4-6 portions and adding the aromatic dianhydride to a polar solvent solution containing aromatic diamine in 2-4 batches, and an amount of each batch is 1-3 portions.

4. The preparation method for the thermoplastic multi-hybrid polyimide films according to claim 1 , wherein the aromatic diisocyanate in step S1 comprises one or a mixture of 2,4′-diphenylmethane diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,2′-methylene diphenyl diisocyanate, toluene-2,4-diisocyanate, toluene-2,5-diisocyanate, toluene-2,6-diisocyanate, toluene-3,4-diisocyanate, toluene-3,5-diisocyanate, 3,3′-dimethylbiphenyl-4,4′-diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, o-phenylene dimethyl diisocyanate, naphthalene diisocyanate, benzenedimethylene diisocyanate, and tetramethylbenzenedimethylene diisocyanate.

5. The preparation method for the thermoplastic multi-hybrid polyimide films according to claim 1 , wherein the aromatic dianhydride in step S1 and step S2 comprises one or a mixture of pyromellitic dianhydride, dibromo pyromellitic dianhydride, 4,4′-diphenyl ether dianhydride, 3,3′,4,4′-diphenyl ether tetracarboxylic dianhydride, 3,3′,4,4′-diphenyl sulfone tetracarboxylic dianhydride, 3,3′,4,4′-diphenyl tetracarboxylic dianhydride, 3,3′,4,4′-diphenyl ketone tetracarboxylic dianhydride, 2,3,3′,4′-diphenyl ether tetracarboxylic dianhydride, 3,3′,4,4′-triphenyl ether tetracarboxylic dianhydride, 4,4′-(4,4′-isopropyldiphenoxy) tetracarboxylic anhydride, 2,2′-dimethyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,2′-diphenyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride, and 5,5′-methylenebis (isobenzofuran-1,3-dione).

6. The preparation method for the thermoplastic multi-hybrid polyimide films according to claim 1 , wherein aromatic diamine in step S2 comprises one or a mixture of 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 4,4′-diaminobenzophenone, 1,3-bis (3-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, m-phenylenediamine, p-phenylenediamine, 3,3′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl sulfone, 4-bis (4-diaminophenoxy) diphenyl sulfone, 4-bis (3-diaminophenoxy) phenyl sulfone, 4,4′-bis (3-aminophenoxy) biphenyl, 4,4′-bis (4-aminophenoxy) biphenyl, 4,4′-diaminodiphenylmethane, and diethyltoluenediamine.

7. The preparation method for the thermoplastic multi-hybrid polyimide films according to claim 1 , wherein the gradient heating curing in step S4 comprises a first gradient heating stage and a second gradient heating stage, the first gradient heating stage comprises: raising a temperature to 80-90° C., 100-110° C., and 130-140° C. in turn in the vacuum oven, and curing in each temperature section for 2-3 h at a vacuum degree being maintained at 75-85 kPa; the second gradient heating stage comprises: raising the temperature to 160-180° C., 190-210° C., 240-260° C., 290-310° C. and 320-340° C. in turn in the ordinary oven, and curing in each temperature section for 1-2 h.

Assignees

• Univ Harbin Eng

Inventors

• Sun Gaohui
• Tao Kangkang
• Han Shihui
• Chen Rongrong
• Wang Jun

Classifications

• C08J5/18 Primary

  Manufacture of films or sheets · CPC title

• C08G73/1007

  from tetracarboxylic acids or derivatives and diamines · CPC title

• C08G73/1035

  from tetracarboxylic acids or derivatives and diisocyanates · CPC title

• C08G73/1067

  Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

• C08J3/005

  Processes for mixing polymers · CPC title