System and method for multi-material molding

US11878447B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11878447-B2
Application numberUS-202117532459-A
CountryUS
Kind codeB2
Filing dateNov 22, 2021
Priority dateNov 20, 2020
Publication dateJan 23, 2024
Grant dateJan 23, 2024

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multi-material molding apparatus and method includes a single mold having, within a mold cavity, one or more movable partitions that segregate at least first and second molding materials. The first molding material is processed to form a first molded portion of the multi-material part. The second molding material is then flowed, through the movable partition, into contact with the first molded portion. That second molding material is then solidified to form a second molded portion of the multi-material part.

First claim

Opening claim text (preview).

What is claimed: 1. A method for molding a multi-material part, wherein the method is performed in a molding tool, wherein the molding tool includes a mold cavity having an upper portion, a lower portion and a partition, wherein a cross-sectional area of the upper portion of the molding tool is relatively larger than a cross-sectional area of the lower portion, and wherein the partition has a cross sectional area substantially equal to the lower portion of the mold cavity, the method comprising: segregating via the partition, a first molding material from a second molding material in the mold cavity by disposing the first molding material in the upper portion of the mold cavity in a region between a perimeter of the upper first portion and a perimeter of the partition, the partition thereby bounded by the first molding material, and disposing the second molding material in the lower portion of the mold cavity; forming a first molded portion of the multi-material part from the first molding material; flowing the second molding material through the partition to the first molded portion by actuating the partition to move downwardly, applying pressure to the second molding material, wherein the second molding material flows to a region formerly occupied by the partition, and is thereby bounded by the first molded portion; and forming a second molded portion of the multi-material part from the second molding material, the first molded portion and the second molded portion sharing a common interface. 2. The method of claim 1 wherein the multi-material part comprises a first layer that overlies a second layer, wherein the first molded portion defines the first layer and the second molded portion defines the second layer. 3. The method of claim 1 wherein, in the multi-material part, the first molded portion and the second molded portion are coplanar with one another. 4. The method of claim 1 comprising flowing the first molding material into the mold cavity. 5. The method of claim 1 wherein segregating via a partition, the first molding material from the second molding material comprises positioning the second molding material below the partition and positioning the first molding material above the partition. 6. The method of claim 1 wherein forming the second molded portion of the multi-material part from the second molding material creates the multi-material part wherein the first molded portion and the second molded portion are coplanar with one another. 7. The method of claim 1 wherein forming the first molded portion of the multi-material part comprises liquefying a resin in the first molding material and consolidating the first molding material via compression molding. 8. The method of claim 7 wherein forming the first molded portion comprises not liquefying a resin in the second molding material until the first molded portion is formed. 9. The method of claim 7 wherein forming the first molded portion comprises liquefying the resin in the first molding material and a resin in the second molding material at the same time. 10. The method of claim 9 wherein flowing the second molding material through the partition to the first molded portion comprises actuating the partition to move downwardly, applying pressure to the second molding material. 11. The method of claim 10 wherein flowing the second molding material through the partition to the first molded portion comprises actuating a flow control mechanism to permit flow of the second molding material through the partition.

Assignees

Inventors

Classifications

  • B29C43/146Primary

    for making multilayered articles · CPC title

  • Feeding the material to the mould or the compression means {(B29C43/085 takes precedence)} · CPC title

  • Moulds for making articles of definite length, i.e. discrete articles · CPC title

  • Heating or cooling · CPC title

  • using pressurising feeding means located in the mould, e.g. plungers or pistons · CPC title

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Frequently asked questions

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What does patent US11878447B2 cover?
A multi-material molding apparatus and method includes a single mold having, within a mold cavity, one or more movable partitions that segregate at least first and second molding materials. The first molding material is processed to form a first molded portion of the multi-material part. The second molding material is then flowed, through the movable partition, into contact with the first molde…
Who is the assignee on this patent?
Arris Composites Inc
What technology area does this patent fall under?
Primary CPC classification B29C43/146. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).