Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11877044-B2
Application number	US-201615999858-A
Country	US
Kind code	B2
Filing date	Jul 28, 2016
Priority date	Feb 18, 2016
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

First claim

What is claimed is:

1. A camera module, comprising
at least a lens;
at least a photosensitive chip;
at least a filter;
at least an integral base component;
at least a motor; and
at least a support,
wherein said integral base component comprises a base part and a circuit board part, wherein said base part is integrally packaged in said circuit board part, wherein said photosensitive chip is mounted on said circuit board part, wherein said base part has at least a through hole formed thereon to provide a light path for said photosensitive chip, wherein said lens is arranged along the light path of said photosensitive chip, wherein said support is mounted on said base part, wherein said filter is mounted on said support and along the light path of said photosensitive chip, wherein said base part has a flat extended top surface, wherein said lens is installed on said motor, and wherein said motor is installed on said top surface of said base part.

2. The camera module, as recited in claim 1 , wherein said support has a first support groove arranged on the top side thereof and a second support groove arranged on the bottom side thereof, for coupling with the top of said base part, wherein said first support groove is communicated with said through hole, wherein said filter is mounted on said first support groove.

3. The camera module, as recited in claim 1 , wherein said lens is, at least partially, mounted on said support.

4. A camera module, comprising:
at least a lens;
at least a photosensitive chip;
at least an integral base component, wherein said integral base component comprises a base part and a circuit board part, wherein said base part is molded on said circuit board part, wherein said base comprises at least a through hole formed thereon, for providing a light path for said photosensitive chip and said lens; and
at least a motor, wherein said base part has a flat extended top surface, wherein said lens is installed on said motor, and wherein said motor is installed on said top surface of said base part.

5. The camera module, as recited in claim 4 , wherein said base part has a mounting groove arranged thereon, wherein said mounting groove is communicated with said through hole, wherein said base part comprises at least a protruding step, forming said mounting groove.

6. The camera module, as recited in claim 5 , further comprising at least a filter, arranged in said mounting groove.

7. The camera module, as recited in claim 4 wherein said circuit board part comprises at least a side, wherein said base part wraps and covers the at least one said side of said circuit board part.

8. The camera module, as recited in claim 4 , wherein said base part further wraps and covers the bottom of said circuit board part.

9. The camera module, as recited in claim 4 , wherein said integral base component comprises at least a circuit element, wrapped and covered by said base part.

10. The camera module, as recited in claim 4 , wherein said circuit board part has a reinforcing hold, wherein said base part extends into said reinforcing hold.

11. The camera module, as recited in claim 4 , wherein said circuit board part comprises a reinforced layer, overlappingly arranged on the bottom of said circuit board part.

12. The camera module, as recited in claim 4 , wherein said circuit board part comprises a shielding layer, wrapping and covering on the outside of said camera module.

13. The camera module, as recited in claim 4 , wherein said circuit board part comprises a shielding layer, surroundingly provided on the inner side of said base part.

14. An integral base component, comprising:
a base part;
a circuit board part, wherein said base part is integrally packaged in said circuit board part, wherein a photosensitive chip of said camera module is adaptable for being mounted on said circuit board part, wherein said base part has at least a through hole formed thereon to provide a light path for said photosensitive chip, wherein said lens is arranged along the light path of said photosensitive chip; and
a motor connection member, preinstalled on said base part to allow said motor to be electrically connected with said circuit board part therethrough, wherein a motor of the camera module is adapted to be electrically connected with said circuit board part through said motor connection member.

15. The integral base component, as recited in claim 14 , wherein said base part further wraps and covers the bottom of said circuit board part.

16. The integral base component, as recited in claim 14 , wherein said integral base component comprises at least a circuit element, wrapped and covered by said base part.

17. The integral base component, as recited in claim 14 , wherein said base part has at least a first inner side provided thereon surroundingly forming at least part of said through hole, wherein said first inner side extends upward from said circuit board part in an inclining manner.

18. The integral base component, as recited in claim 17 , wherein said base part has a second inner side provided thereon foldingly extended from said first inner side, wherein said second inner side surroundingly forms the upper end of said through hole, wherein said second inner side extends upward in an inclining manner.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Guo Nan
• Chen Zhenyu
• Huang Zhen
• Chen Feifan
• Ding Liang

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title