Method for interconnecting components of an electronic system by sintering

Patent metadata

Field	Value
Publication number	US-11876002-B2
Application number	US-202117446767-A
Country	US
Kind code	B2
Filing date	Sep 2, 2021
Priority date	Sep 3, 2020
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

A method for interconnecting components of an electronic system includes depositing a sintering solution onto a first component to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the nanoparticles. More than 95.0%, preferably more than 99.0% of the mass of the nanoparticles include a metal selected from silver, gold, copper and alloys thereof and have a polyhedral shape with an aspect ratio greater than 0.8. The method also includes eliminating, at least partially, the solvent from the layer to form an ordered agglomerate in which the nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the nanoparticles at a distance from each other, debinding and sintering the layer, and depositing a second component in contact with the layer before or during debinding or sintering.

First claim

The invention claimed is:

1. A method for interconnecting components of an electronic system, the method comprising the steps of:
a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles,
the metal nanoparticles comprising for more than 95.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8,
the stabilizing agent is one or more surfactants customized so that during elimination of the solvent, the metal nanoparticles assemble in a least one ordered agglomerate,
b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one ordered agglomerate in which the metal nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the metal nanoparticles at a distance from each other,
c) debinding and sintering the interconnection layer, and
d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

2. The method according to claim 1 , the metal nanoparticles comprising for more than 99.0% of their mass a metal selected from silver, gold, copper and alloys thereof.

3. The method according to claim 1 , the sintered interconnection layer having a density that is greater than or equal to 90% of the density of said metal.

4. The method according to claim 1 , more than 95.0% of the mass of the metal nanoparticles being constituted by silver.

5. The method according to claim 1 , the metal nanoparticles being cubic in shape.

6. The method according to claim 1 , the metal nanoparticles forming a granular assembly which is monodisperse in size.

7. The method according to claim 1 , the sintering solution comprising, as percentages by weight expressed on the basis of the mass of the sintering solution:
between 5.0% and 50.0% of metal nanoparticles,
between 0.1% and 4.0% of stabilizing agent, and
between 46.0% and 94.9% of solvent.

8. The method according to claim 1 , the solvent being selected from water, ethanol, 1,2-propanediol, ethylene glycol, diethylene glycol and mixtures thereof.

9. The method according to claim 1 , the stabilizing agent being selected from cetyltrimethylammonium chloride, dodecyltrimethylammonium chloride, decyltrimethylammonium chloride, trimethylammonium chloride and mixtures thereof.

10. The method according to claim 9 , the stabilizing agent being cetyltrimethylammonium chloride.

11. The method according to claim 1 , the elimination of solvent in step b) comprising evaporation and/or decomposition of the solvent.

12. The method according to claim 1 , step b) for eliminating the solvent being carried out at a temperature of less than 200° C.

13. The method according to claim 1 , debinding and sintering in step c) being carried out by bringing the at least one ordered agglomerate into contact with at least one destabilizing agent configured to desorb the stabilizing agent from the metal nanoparticles in order to aggregate and coalesce said metal nanoparticles between themselves.

14. The method according to claim 13 , the at least one destabilizing agent being selected from an alcohol, sodium styrene sulfonate, sodium polystyrene sulfonate and mixtures thereof.

15. The method according to claim 1 , the at least one ordered agglomerate being defined by regular repetition of an elementary pattern comprising metal nanoparticles along three axes, the elementary pattern being simple cubic, centered cubic or face centered cubic.

16. The method according to claim 1 , step c) for debinding and sintering being carried out at a temperature of less than 200° C.

17. The method according to claim 1 , in which the first component and/or the second component of the electronic system are selected from a support, a chip produced from a semiconductor material, a light emitting diode, and a component of an electronic power system.

18. The method according to claim 1 , the metal nanoparticles having a truncated cubic shape.

Assignees

• Commissariat Energie Atomique
• Centre Nat Rech Scient
• Univ Bordeaux
• Inst Polytechnique Bordeaux

Inventors

• Bronchy Maxime
• Duguet Etienne
• Feautrier Céline
• Treguer-Delapierre Mona

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• B22F2998/10

  Processes characterised by the sequence of their steps · CPC title

• B22F3/24

  After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

• H10W99/00 Primary

  Subject matter not provided for in other groups of this subclass · CPC title

• H01L21/4814 Primary

  Electricity · mapped topic