Camera module and method for assembling same

US11874482B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11874482-B2
Application numberUS-202117470815-A
CountryUS
Kind codeB2
Filing dateSep 9, 2021
Priority dateJul 29, 2016
Publication dateJan 16, 2024
Grant dateJan 16, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A camera module includes a lens holder having a hollow region; a first lens unit disposed in the hollow region and including at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other. The adhesion unit includes an opening and a portion of an internal space formed by a coupling of the circuit board and the lens holder is to be open to an outside through the opening of the adhesion.

First claim

Opening claim text (preview).

What is claimed is: 1. A camera module comprising: a lens holder comprising a hollow region; a first lens unit disposed in the hollow region and comprising at least one lens, the first lens unit directly contacting the lens holder; a second lens unit disposed above the lens holder; a spacer disposed between the first lens unit and the second lens unit, the spacer being located in the hollow region; a circuit board disposed under the lens holder; and an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other, wherein the adhesion unit comprises an opening, and a portion of an internal space formed by a coupling of the circuit board and the lens holder is open to an outside through the opening of the adhesion unit. 2. The camera module according to claim 1 , comprising an image sensor disposed on the circuit board, wherein the image sensor comprises a sensing unit disposed so as to face the first lens unit. 3. The camera module according to claim 2 , comprising a filter disposed between the first lens unit and the image sensor, wherein the filter faces the first lens unit and the image sensor in an optical-axis direction. 4. The camera module according to claim 1 , wherein the lens holder comprises a third coupling portion protruding a lower surface of the lens holder, and the third coupling portion is coupled to the circuit board. 5. The camera module according to claim 1 , wherein a perimeter of the lower surface of the lens holder is equal to a perimeter of the circuit board. 6. A camera module comprising: a lens holder comprising a hollow region; a first lens unit disposed in the hollow region and comprising at least one lens, the first lens unit directly contacting the lens holder; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; and an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other, wherein the adhesion unit comprises an opening, and a portion of an internal space formed by a coupling of the circuit board and the lens holder is open to an outside through the opening of the adhesion unit, wherein the lens holder comprises a first coupling portion surrounding the hollow region, and the first coupling portion is disposed above the hollow region, and wherein the second lens unit comprises a second coupling portion surrounding the first coupling portion and the second coupling portion is coupled to the first coupling portion. 7. The camera module according to claim 6 , wherein the first coupling portion and the second coupling portion are coupled to each other by an adhesive or a thread-engagement manner. 8. The camera module according to claim 6 , comprising a sealing member disposed between the first coupling portion and the second coupling portion. 9. A camera module comprising: a lens holder comprising a hollow region; a first lens unit disposed in the hollow region and comprising at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; and an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other, wherein the adhesion unit comprises an opening, and a portion of an internal space formed by a coupling of the circuit board and the lens holder is open to an outside through the opening of the adhesion unit, wherein the lens holder comprises a third coupling portion protruding a lower surface of the lens holder, and the third coupling portion is coupled to the circuit board, and wherein the third coupling portion is formed in a closed curve shape. 10. The camera module according to claim 9 , comprising a spacer disposed between the first lens unit and the second lens unit. 11. The camera module according to claim 9 , wherein the lens holder comprises a first coupling portion surrounding the hollow region, and the first coupling portion is disposed above the hollow region, and wherein the second lens unit comprises a second coupling portion surrounding the first coupling portion and the second coupling portion is coupled to the first coupling portion. 12. The camera module according to claim 11 , wherein the first coupling portion and the second coupling portion are coupled to each other by an adhesive or a thread-engagement manner. 13. The camera module according to claim 11 , comprising a sealing member disposed between the first coupling portion and the second coupling portion. 14. The camera module according to claim 9 , comprising an image sensor disposed on the circuit board, wherein the image sensor comprises a sensing unit disposed so as to face the first lens unit. 15. A camera module comprising: a lens holder comprising a hollow region; a first lens unit disposed in the hollow region and comprising at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; and an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other, wherein the adhesion unit comprises an opening, and a portion of an internal space formed by a coupling of the circuit board and the lens holder is open to an outside through the opening of the adhesion unit, and wherein the lens holder comprises an installation recess concavely formed in a lower surface of the lens holder for installation of a gasket, and the installation recess is formed in a closed curve shape so as to surround the circuit board.

Assignees

Inventors

Classifications

  • G02B5/283Primary

    designed for the ultraviolet · CPC title

  • Interference filters · CPC title

  • Mountings, adjusting means, or light-tight connections, for optical elements · CPC title

  • for lenses {(supports for magnifying lenses G02B25/002)} · CPC title

  • with mechanism for focusing or varying magnification · CPC title

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What does patent US11874482B2 cover?
A camera module includes a lens holder having a hollow region; a first lens unit disposed in the hollow region and including at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder an…
Who is the assignee on this patent?
Lg Innotek Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B5/283. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).