Plasmonic lithography for patterning high aspect-ratio nanostructures

US11874480B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11874480-B2
Application numberUS-201816956334-A
CountryUS
Kind codeB2
Filing dateDec 20, 2018
Priority dateDec 20, 2017
Publication dateJan 16, 2024
Grant dateJan 16, 2024

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Abstract

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A plasmonic device incorporating a special hyperbolic metamaterial (HMM) metamaterial is used for plasmonic lithography, including ultraviolet (UV) lithography. It may be a Type II HMM (ϵ ∥ <0 and ϵ ⊥ >0) whose tangential component of the permittivity ϵ ∥ is close to zero. Due to the high anisotropy of the Type II epsilon near zero (ENZ) HMM, only one plasmonic mode can propagate horizontally with low loss in a waveguide system with ENZ HMM as its core. In certain aspects, a Type II ENZ HMM comprises alternating layers of aluminum/aluminum oxide films and the associated unusual mode of light transmission is used to expose a photosensitive layer in a specially designed lithography system. Methods for making patterns of nanofeatures via such plasmonic lithography are also provided, including as a plasmonic roller device.

First claim

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What is claimed is: 1. A method for plasmonic lithography comprising: passing electromagnetic radiation having a predetermined wavelength into a plasmonic device that comprises a photomask having a plurality of openings with an index matching layer disposed in the plurality of the openings and an optical epsilon-near-zero (ENZ) metamaterial structure having an effective in-plane permittivity of approximately 0, a multilayered stack that comprises at least one metal layer and at least one dielectric material layer, wherein the electromagnetic radiation generates a single plasmonic mode inside the optical epsilon-near-zero (ENZ) metamaterial structure and then passes to a photosensitive material disposed beneath the plasmonic device to form a pattern comprising a nanofeature in the photosensitive material, wherein the nanofeature has at least dimension that is less than ⅓ of the predetermined wavelength; and the photosensitive material is disposed between the optical epsilon-near-zero (ENZ) metamaterial structure and the multilayered stack, wherein the photomask is disposed adjacent to a first side of the optical epsilon-near-zero (ENZ) metamaterial structure and the photosensitive material is disposed adjacent to a second side of the optical epsilon-near-zero (ENZ) metamaterial structure opposite to the first side. 2. The method of claim 1 , wherein the plasmonic device is in the form of a roller and the optical epsilon-near-zero (ENZ) metamaterial structure is wrapped around a cylindrical component that transmits the electromagnetic radiation having the predetermined wavelength, wherein the passing occurs continuously to form the pattern. 3. The method of claim 2 , wherein the roller contacts the photosensitive material during the passing. 4. The method of claim 1 , wherein the nanofeature has at least one dimension that is less than ⅙ of the predetermined wavelength. 5. The method of claim 1 , wherein an average field intensity of light that reaches the photosensitive material is greater than or equal to about one half of the incident light. 6. The method of claim 1 , wherein the nanofeature has an aspect ratio of greater than or equal to about 2:1. 7. The method of claim 1 , wherein the pattern comprises a plurality of nanofeatures and the plurality of nanofeatures formed is substantially uniform so that a first dimension of a first nanofeature deviates less than 30% from a second dimension of a second nanofeature. 8. The method of claim 1 , wherein the predetermined wavelength is greater than or equal to about 10 nm to less than or equal to about 750 nm. 9. The method of claim 1 , wherein the optical epsilon-near-zero (ENZ) metamaterial structure is an epsilon-near-zero (ENZ) hyperbolic metamaterial (HMM), wherein the epsilon-near-zero (ENZ) hyperbolic metamaterial (HMM) is a Type II epsilon-near-zero (ENZ) hyperbolic metamaterial (HMM) that generates the single plasmonic mode. 10. The method of claim 1 , wherein the epsilon-near-zero (ENZ) hyperbolic metamaterial (HMM) comprises a stack comprising at least one metal layer and at least one dielectric layer. 11. The method of claim 10 , wherein the at least one metal layer comprises a metal selected from the group consisting of: aluminum (Al), gold (Au), copper (Cu), silver (Ag), combinations and alloys thereof and the at least one dielectric layer comprises a dielectric material selected from the group consisting of: aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), silicon nitride (Si 3 N 4 ), zinc selenide (ZnSe), zinc oxide (ZnO), zirconium oxide (ZrO 2 ), titanium oxide (TiO 2 ), tantalum pentoxide (Ta 2 O 5 ) dielectric polymers, and combinations thereof. 12. A plasmonic device for lithography comprising: an optical epsilon-near-zero (ENZ) metamaterial structure having an effective in-plane permittivity of approximately 0; a photomask having a grating structure comprising a plurality of metallic rows spaced apart from one another to define a plurality of openings through which electromagnetic radiation passes; an index matching layer disposed in the plurality of openings of the photomask; a multilayered stack that comprises at least one metal layer and at least one dielectric material layer; and a photosensitive material to be patterned by the electromagnetic radiation that is disposed between the optical epsilon-near-zero (ENZ) metamaterial structure and the multilayered stack, wherein the photomask is disposed adjacent to a first side of the optical epsilon-near-zero (ENZ) metamaterial structure and the photosensitive material is disposed adjacent to a second side of the optical epsilon-near-zero (ENZ) metamaterial structure opposite to the first side. 13. The plasmonic device of claim 12 , where a period of the photomask is greater than or equal to about 695 nm to less than or equal to about 702 nm. 14. The plasmonic device of claim 12 , wherein the optical epsilon-near-zero (ENZ) metamaterial structure comprises a stack comprising at least one metal layer having a thickness of less than or equal to about 15 nm and at least one dielectric layer, wherein the at least one metal layer consists essentially of aluminum (Al) or an alloy of aluminum (Al) and a metal selected from the group consisting of: gold (Au), copper (Cu), silver (Ag), and combinations. 15. The plasmonic device of claim 12 , wherein the at least one metal layer in the stack of the optical epsilon-near-zero (ENZ) metamaterial structure consists essentially of aluminum (Al) or an alloy of aluminum (Al) and silver (Ag).

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Classifications

  • G02B5/008Primary

    Surface plasmon devices (diffractive gratings with a pitch less than or comparable to the wavelength G02B5/1809; surface plasmons in integrated optics G02B6/1226; optical analysis of materials by means of surface plasmons G01N21/553) · CPC title

  • made of materials engineered to provide properties not available in nature, e.g. metamaterials · CPC title

  • with pitch less than or comparable to the wavelength · CPC title

  • Nanooptics, e.g. quantum optics or photonic crystals · CPC title

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What does patent US11874480B2 cover?
A plasmonic device incorporating a special hyperbolic metamaterial (HMM) metamaterial is used for plasmonic lithography, including ultraviolet (UV) lithography. It may be a Type II HMM (ϵ ∥ <0 and ϵ ⊥ >0) whose tangential component of the permittivity ϵ ∥ is close to zero. Due to the high anisotropy of the Type II epsilon near zero (ENZ) HMM, only one plasmonic mode can propagate horizontally …
Who is the assignee on this patent?
Univ Michigan Regents
What technology area does this patent fall under?
Primary CPC classification G02B5/008. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).