Bimodal ethylene-based polymers having high molecular weight high density fractions

US11873393B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11873393-B2
Application numberUS-201916973639-A
CountryUS
Kind codeB2
Filing dateJun 13, 2019
Priority dateJun 15, 2018
Publication dateJan 16, 2024
Grant dateJan 16, 2024

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Abstract

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A bimodal ethylene-based polymer, including a high density fraction (HDF) from 3.0% to 25.0%, wherein the high density fraction is measured by crystallization elution fractionation (CEF) integration at temperatures from 93° C. to 119° C., an I10/I2 ratio from 5.5 to 7.5, wherein I2 is the melt index when measured according to ASTM D 1238 at a load of 2.16 kg and temperature of 190° C. and I10 is the melt index when measured according to ASTM D 1238 at a load of 10 kg and temperature of 190° C., and a short chain branching distribution (SCBD) less than or equal to 10° C., wherein the short chain branching distribution is measured by CEF full width at half height.

First claim

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The invention claimed is: 1. A bimodal ethylene-based polymer, comprising: a high density fraction (HDF) from 3.0% to 25.0%, wherein the high density fraction is measured by crystallization elution fractionation (CEF) integration at temperatures from 93° C. to 119° C.; an I 10 /I 2 ratio from 5.5 to 7.5, wherein I 2 is the melt index when measured according to ASTM D 1238 at a load of 2.16 kg and temperature of 190° C. and I 10 is the melt index when measured according to ASTM D 1238 at a load of 10 kg and temperature of 190° C.; and a short chain branching distribution (SCBD) less than or equal to 10° C., wherein the short chain branching distribution is measured by CEF full width at half height. 2. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has a density from 0.900 g/cc to 0.925 g/cc. 3. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has a melt index (I 2 ) from 0.5 g/10 mins to 7.0 g/10 mins. 4. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has a melt index (I 2 ) from 2.0 g/10 mins to 4.0 g/10 mins. 5. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has an HDF from 3.0% to 7.5%. 6. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has a I 10 /I 2 ratio from 5.5 to 6.0. 7. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has an SCBD less than or equal to 9° C. 8. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer has an SCBD less than or equal to 7° C. 9. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene-based polymer comprises a first polymer fraction and a second polymer fraction having a density and melt index (I 2 ) different from that of the first polymer fraction, and the bimodal ethylene-based polymer comprises from 70.0 wt. % to 92.0 wt. % of a first polymer fraction and 8.0 wt. % to 30 wt. % of a second polymer fraction. 10. The bimodal ethylene-based polymer of claim 9 , wherein the bimodal ethylene-based polymer has a density that is higher than a density of the first polymer fraction. 11. The bimodal ethylene-based polymer of claim 9 , wherein the bimodal ethylene-based polymer has a melt index (I 2 ) that is higher than a melt index (I 2 ) of the first polymer fraction. 12. The bimodal ethylene-based polymer of claim 9 , wherein a first portion of the second polymer fraction is formed in a mixer and a second portion of the second polymer fraction is formed in a non-agitated reactor, and the first portion of the second polymer fraction has a higher weight average molecular weight than the second portion of the second polymer fraction. 13. The bimodal ethylene-based polymer of claim 1 , wherein the bimodal ethylene based polymer has a zero shear viscosity ratio from 1.1 to 3.0. 14. The bimodal ethylene-based polymer of claim 1 , wherein a ratio of Mw to Mn is less than 2.800. 15. A film comprising the bimodal ethylene-based polymer of claim 1 . 16. A polymer composition comprising: the bimodal ethylene-based polymer of claim 1 ; and at least one polymer selected from the group consisting of low density polyethylene, ultra-low density polyethylene, linear low density polyethylene, high density polyethylene, a propylene-based polymer, and mixtures thereof. 17. The bimodal ethylene-based polymer of claim 2 , wherein the bimodal ethylene-based polymer has a melt index (I 2 ) from 0.5 g/10 mins to 7.0 g/10 mins. 18. The bimodal ethylene-based polymer of claim 2 , wherein the bimodal ethylene-based polymer has an HDF from 3.0% to 7.5%. 19. The bimodal ethylene-based polymer of claim 2 , wherein the bimodal ethylene-based polymer has a I 10 /I 2 ratio from 5.5 to 6.0. 20. The bimodal ethylene-based polymer of claim 2 , wherein the bimodal ethylene-based polymer has an SCBD less than or equal to 9° C.

Assignees

Inventors

Classifications

  • C08L23/12Primary

    Polypropene · CPC title

  • Multistage polymerisation processes characterised by a change in reactor conditions without deactivating the intermediate polymer (C08F295/00, C08F297/00 take precedence) · CPC title

  • characterised by special features of the polymerisation apparatus used · CPC title

  • Monomers containing five or more carbon atoms · CPC title

  • C08F210/16Primary

    Copolymers of ethene with alpha-alkenes, e.g. EP rubbers · CPC title

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What does patent US11873393B2 cover?
A bimodal ethylene-based polymer, including a high density fraction (HDF) from 3.0% to 25.0%, wherein the high density fraction is measured by crystallization elution fractionation (CEF) integration at temperatures from 93° C. to 119° C., an I10/I2 ratio from 5.5 to 7.5, wherein I2 is the melt index when measured according to ASTM D 1238 at a load of 2.16 kg and temperature of 190° C. and I10 i…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C08L23/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).