Mechanoresponsive polymers exhibiting low-energy molecular switching
US-2021102066-A1 · Apr 8, 2021 · US
Crosslinked polymers with tunable coefficients of thermal expansion
US11873301B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11873301-B2 |
| Application number | US-202318123665-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 20, 2023 |
| Priority date | Jun 15, 2020 |
| Publication date | Jan 16, 2024 |
| Grant date | Jan 16, 2024 |
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- Title
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Abstract
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Curatives and their resulting thermosets and other crosslinked polymers can reduce thermal expansion mismatch between an encapsulant and objects that are encapsulated. This can be accomplished by incorporating a negative CTE moiety into the thermoset resin or polymer backbone. The negative CTE moiety can be a thermal contractile unit that shrinks as a result of thermally induced conversion from a twist-boat to chair or cis/trans isomerization upon heating. Beyond CTE matching, other potential uses for these crosslinked polymers and thermosets include passive energy generation, energy absorption at high strain rates, mechanophores, actuators, and piezoelectric applications.
First claim
Opening claim text (preview).
We claim: 1. An epoxy thermoset comprising an epoxy resin crosslinked with a disubstituted-dibenzocyclooctane curative, wherein the disubstitution consists of a substitution of a functional group on each of the benzene rings. 2. The epoxy thermoset of claim 1 , wherein the disubstituted-dibenzocyclooctane curative is selected from the group consisting of diamino-dibenzocyclooctane, diepoxide-dibenzocyclooctane, diazido-dibenzocyclooctane, dihydroxy-dibenzocyclooctane, diisocyanate-dibenzocyclooctane, dicarboxylic acid-substituted-dibenzocyclooctane, or dianhydride-dibenzocyclooctane, and wherein the disubstitution consists of an amino, epoxide, azido, hydroxy, isocyanate, carboxylic acid, or anhydride group substituted on each of the benzene rings, respectively. 3. The epoxy thermoset of claim 1 , wherein the disubstituted-dibenzocyclooctane comprises a cis isomer.
Assignees
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Classifications
- C07D471/14Primary
Ortho-condensed systems · CPC title
at least one ring not being six-membered, the other rings being at the most six-membered · CPC title
containing a ring other than a six-membered aromatic ring forming part of at least one of the condensed ring systems · CPC title
- C07D321/12Primary
Eight-membered rings · CPC title
Polyhydroxylic alcohols · CPC title
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- What does patent US11873301B2 cover?
- Curatives and their resulting thermosets and other crosslinked polymers can reduce thermal expansion mismatch between an encapsulant and objects that are encapsulated. This can be accomplished by incorporating a negative CTE moiety into the thermoset resin or polymer backbone. The negative CTE moiety can be a thermal contractile unit that shrinks as a result of thermally induced conversion from…
- Who is the assignee on this patent?
- Nat Tech & Eng Solutions Sandia Llc
- What technology area does this patent fall under?
- Primary CPC classification C07D471/14. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).