Method for manufacturing semiconductor device
US-2018350897-A1 · Dec 6, 2018 · US
US11868576B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11868576-B2 |
| Application number | US-202218085286-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2022 |
| Priority date | Jan 26, 2017 |
| Publication date | Jan 9, 2024 |
| Grant date | Jan 9, 2024 |
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A conducting structure is provided and includes a first layer; a first terminal on the first layer; a second layer overlapping the first layer via the first terminal; a second terminal on the second layer; a first hole which penetrates the second layer and the second terminal; an organic insulating layer located between the first terminal and the second layer, and having a second hole connected to the first hole; and a connecting material provided in the first and second holes to electrically connect the first terminal and the second terminal to each other, wherein a diameter of the second hole is greater than a diameter of the first hole.
Opening claim text (preview).
What is claimed is: 1. A conducting structure comprising: a first layer; a first terminal on the first layer; a second layer overlapping the first layer via the first terminal; a second terminal on the second layer; a first hole which penetrates the second layer and the second terminal; an organic insulating layer located between the first terminal and the second layer, and having a second hole connected to the first hole; and a connecting material provided in the first and second holes to electrically connect the first terminal and the second terminal to each other, and a detection electrode located on the second layer and connected to the second terminal, wherein a diameter of the second hole is greater than a diameter of the first hole, and a thickness of the second terminal is greater than a thickness of the detection electrode. 2. The structure of claim 1 , wherein the second terminal includes an oxide electrode which is in contact with the second layer. 3. The structure of claim 1 , wherein the second terminal includes a metal layer which is in contact with the second layer and an oxide electrode which is in contact with the metal layer. 4. The structure of claim 1 , further comprising: a protection material covering the second terminal. 5. The structure of claim 1 , further comprising: a first interlayer insulating layer located between the first layer and the first terminal, wherein the first terminal includes a first oxide electrode located on the first interlayer insulating layer. 6. The structure of claim 5 , wherein the first terminal includes a second oxide electrode located above the first oxide electrode. 7. The structure of claim 6 , further comprising: a second interlayer insulating layer located between the first oxide electrode and the second oxide electrode. 8. The structure of claim 6 , wherein the second oxide electrode is in contact with the first oxide electrode. 9. The structure of claim 1 , further comprising: a third hole which penetrates the first terminal. 10. A conducting structure comprising: a first layer; a first terminal on the first layer; a second layer overlapping the first layer via the first terminal; a second terminal on the second layer; a first hole which penetrates the second layer and the second terminal; an organic insulating layer located between the first terminal and the second layer, and having a second hole connected to the first hole; and a connecting material provided in the first and second holes to electrically connect the first terminal and the second terminal to each other, a first interlayer insulating layer located between the first layer and the first terminal, wherein a diameter of the second hole is greater than a diameter of the first hole, the first terminal includes a first oxide electrode located on the first interlayer insulating layer, the first terminal includes a second oxide electrode located above the first oxide electrode. 11. The structure of claim 10 , further comprising: a second interlayer insulating layer located between the first oxide electrode and the second oxide electrode. 12. The structure of claim 10 , wherein the second oxide electrode is in contact with the first oxide electrode. 13. The structure of claim 10 , wherein the second terminal includes an oxide electrode which is in contact with the second layer. 14. The structure of claim 10 , wherein the second terminal includes a metal layer which is in contact with the second layer and an oxide electrode which is in contact with the metal layer. 15. The structure of claim 10 , further comprising: a protection material covering the second terminal. 16. The structure of claim 10 , further comprising: a third hole which penetrates the first terminal.
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