Polymer substrate with hard coat layer

Patent metadata

Field	Value
Publication number	US-11866564-B2
Application number	US-201816497157-A
Country	US
Kind code	B2
Filing date	Mar 28, 2018
Priority date	Mar 29, 2017
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 μm and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 μm in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface,
Requirement (a1): when the chemical composition is represented by SiO x C y H z , x falls within the range 1.93-1.98, y falls within the range 0.04-0.15 and z falls within the range 0.10-0.50. Requirement (a3): when the chemical composition is represented by SiO x C y H z , x falls within the range 1.94-2.02, y falls within the range 0.05-0.16 and z falls within the range 0.20-0.50.

First claim

The invention claimed is:

1. A polymer substrate with a hard coat layer in which a polymer substrate, a cured underlayer, and a silicon oxide layer are directly laminated in this order, wherein
the cured underlayer has a thickness of 1 to 20 μm, and comprises 10 to 90 parts by weight of a multi-functional acrylate and 90 to 10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolysis-condensation product, or comprises a hydrolysis-condensation product of an organic silicon compound as a main component thereof,
the silicon oxide layer satisfies the following (a 1 ) at a position 0.04 μm from the interface between the cured underlayer and the silicon oxide layer in the thickness direction and satisfies the following (a 3 ) on a surface on a side opposite the interface:
(a 1 ) when the chemical composition is represented by SiO x C y H z , x is in the range of 1.93 to 1.98, y is in the range of 0.04 to 0.15, and z is in the range of 0.10 to 0.50, and
(a 3 ) when the chemical composition is represented by SiO x C y H z , x is in the range of 1.94 to 2.02, y is in the range of 0.05 to 0.16, and z is in the range of 0.20 to 0.50.

2. The polymer substrate with a hard coat layer according to claim 1 , wherein the silicon oxide layer satisfies all of the following requirements (a 1 ) to (c 1 ) at a position 0.04 μm from the interface between the cured underlayer and the silicon oxide layer in the thickness direction, and satisfies all of the following requirements (b 3 ) to (c 3 ) on the surface on the side opposite the interface:
(a 1 ) when the chemical composition is represented by SiO x C y H z , x is in the range of 1.93 to 1.98, y is in the range of 0.04 to 0.15, and z is in the range of 0.10 to 0.45,
(b 1 ) the ratio of infrared absorbance at a wave number of 930 cm −1 to that at a wave number of 1020 cm −1 (α 930 /α 1020 ) is in the range of 0.10 to 0.20,
(c 1 ) the ratio of infrared absorbance at a wave number of 1280 cm −1 to that at a wave number of 1020 cm −1 (α 1280 /α 1020 ) is in the range of 0 to 0.005,
(b 3 ) the ratio of infrared absorbance at a wave number of 930 cm −1 to that at a wave number of 1020 cm −1 (α 930 /α 1020 ) is in the range of 0.15 to 0.25, and
(c 3 ) the ratio of infrared absorbance at a wave number of 1280 cm −1 to that at a wave number of 1020 cm −1 (α 1280 /α 1020 ) is in the range of 0.002 to 0.020.

3. The polymer substrate with a hard coat layer according to claim 2 , wherein the cured underlayer comprises 10 to 90 parts by weight of a multi-functional acrylate, and 90 to 10 parts by weight of inorganic fine particles and/or a silicon compound hydrolysis-condensation product.

4. The polymer substrate with a hard coat layer according to claim 1 , wherein y of (a 3 ) is 0.02 to 0.10 greater than y of (a 1 ), and z of (a 3 ) is 0.05 to 0.25 greater than z of (a 1 ).

5. The polymer substrate with a hard coat layer according to claim 1 , wherein the cured underlayer comprises a (meth)acrylic resin including 0.1 to 5 mol/kg of at least one of a hydroxyl group, an amino group, a carboxyl group, or an alkoxysilyl group in the compound.

6. The polymer substrate with a hard coat layer according to claim 1 , wherein the primary particle diameter of the inorganic oxide fine particles is in the range of 1 nm to 200 nm.

7. The polymer substrate with a hard coat layer according to claim 1 , wherein the polymer substrate is a polycarbonate resin substrate.

8. The polymer substrate with a hard coat layer according to claim 1 , wherein the silicon oxide layer is a plasma CVD layer.

9. The polymer substrate with a hard coat layer according to claim 1 , wherein the silicon oxide layer has a thickness of 2.5 to 9 μm, and satisfies all of the following requirements (a 2 ) to (c 2 ) at a position 2.0 μm from the interface between the cured underlayer and the silicon oxide layer in the thickness direction:
(a 2 ) when the chemical composition is represented by SiO x C y H z , x is in the range of 1.81 to 1.90, y is in the range of 0.15 to 0.32, and z is in the range of 0.45 to 0.90,
(b 2 ) the ratio of infrared absorbance at a wave number of 930 cm −1 to that at a wave number of 1020 cm −1 (α 930 /α 1020 ) is in the range of 0.21 to 0.36, and
(c 2 ) the ratio of infrared absorbance at a wave number of 1280 cm −1 to that at a wave number of 1020 cm −1 (α 1280 /α 1020 ) is in the range of 0.010 to 0.040.

10. The polymer substrate with a hard coat layer according to claim 9 , wherein the thickness of a portion of the silicon oxide layer which satisfies all of requirements (a 2 ) to (c 2 ) is in the range of 1.5 to 8.5 μm.

11. The polymer substrate with a hard coat layer according to claim 9 , wherein the thickness of a portion of the silicon oxide layer which satisfies all of requirements (a 3 ) to (c 3 ) is in the range of 0.1 to 1.4 μm.

12. The polymer substrate with a hard coat layer according to claim 9 , further comprising, between the portion of the silicon oxide layer which satisfies all of requirements (a 1 ) to (c 1 ) and the portion of the silicon oxide layer which satisfies all of requirements (a 2 ) to (c 2 ), a gradient layer in which the values of x, y, z, α 930 /α 1020 and/or α 1280 /α 1020 change gradually.

13. The polymer substrate with a hard coat layer according to claim 9 , further comprising, between the portion of the silicon oxide layer which satisfies all of requirements (a 2 ) to (c 2 ) and the portion of the silicon oxide layer which satisfies all of requirements (a 3 ) to (c 3 ), a gradient layer in which the values of x, y, z, α 930 /α 1020 and/or α 1280 α 1020 change gradually.

14. The polymer substrate with a hard coat layer according to claim 1 , wherein the thickness of the silicon oxide layer is in the range of 0.1 to 2.5 μm.

15. The polymer substrate with a hard coat layer according to claim 14 , further comprising, between the portion of the silicon oxide layer which satisfies all of requirements (a 1 ) to (c 1 ) and the portion of the silicon oxide layer which satisfies all of requirements (a 3 ) to (c 3 ), a gradient layer in which the values of x, y, z, α 930 /α 1020 and/or α 1280 /α 1020 change gradually.

Assignees

• Teijin Ltd
• Tsukishima Kikai Co

Inventors

• Ekinaka Tatsuya
• Kon Tatsuichirou
• Kishimoto Hiroshi
• Takeda Yume
• Suga Takehiro
• Ogata Satoshi
• Nakagomi Masato

Classifications

• C08J7/046 Primary

  Forming abrasion-resistant coatings; Forming surface-hardening coatings · CPC title

• C08J7/0423

  with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder · CPC title

• C23C16/401

  containing silicon · CPC title

• C23C16/50

  using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} · CPC title

• C08J2369/00

  Characterised by the use of polycarbonates; Derivatives of polycarbonates · CPC title