Heat-curing epoxy resin composition having high storage stability

Patent metadata

Field	Value
Publication number	US-11866544-B2
Application number	US-201816759087-A
Country	US
Kind code	B2
Filing date	Oct 24, 2018
Priority date	Oct 24, 2017
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

A one-component thermosetting epoxy resin compositions that feature good storage stability. The epoxy resin compositions are especially suitable for use as bodywork adhesive and for production of structural foams.

First claim

The invention claimed is:

1. A one-component thermosetting epoxy resin composition comprising:
a) at least one epoxy resin A having an average of more than one epoxy group per molecule;
b) at least one latent curing agent for epoxy resins B;
c) at least one compound of the formula

wherein:
substituents R 1 and R 2 are independently an unsubstituted benzene, a halogenated benzene, alkoxylated benzene, an alkylated benzene or an N derivative of an aniline,
substituent R 3 is H or an alkyl group having 1 to 10 carbon atoms,
a weight ratio of the at least one epoxy resin A having an average of more than one epoxy group per molecule to the at least one compound of the formula (III) is 5-800,
the one-component thermosetting epoxy resin composition has a viscosity at 25° C. of 500-3000 Pa*s, and
the one-component thermosetting epoxy resin composition has a percentage rise in viscosity at 25° C. after storage for one week at 60° C. after mixing that is less than 90% of the corresponding percentage rise in viscosity of a one-component thermosetting epoxy resin composition that is the same except not having a compound of formula (III).

2. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein, in the at least one compound of the formula (III), the substituents R 1 and R 2 are independently an unsubstituted benzene; a halogenated benzene, or an alkylated benzene.

3. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein, in the at least one compound of the formula (III), the substituent R 3 is H or an alkyl group having 1 to 8 carbon atoms.

4. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein, in the at least one compound of the formula (III), the substituents R 1 and R 2 are each unsubstituted benzene and the substituent R 3 is H or an alkyl group having 1 to 4 carbon atoms.

5. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein the weight ratio of the at least one epoxy resin A having an average of more than one epoxy group per molecule to the at least one compound of the formula (III) is 10-600.

6. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein a weight ratio of the at least one latent curing agent for epoxy resins B to the at least one compound of the formula (III) is 0.5-8.

7. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein a proportion of the at least one compound of the formula (III) is 0.1% by weight-15% by weight, based on a total weight of the one-component thermosetting epoxy resin composition.

8. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein the latent curing agent for epoxy resins B is selected from the group consisting of dicyandiamide, guanamines, guanidines, anhydrides of polybasic carboxylic acids, dihydrazides, and aminoguanidines.

9. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein the thermosetting epoxy resin composition additionally includes at least one accelerator C selected from the group consisting of substituted ureas, imidazoles, imidazolines and blocked amines.

10. The one-component thermosetting epoxy resin composition as claimed in claim 9 , wherein the latent curing agent B is a guanidine, and the accelerator C for epoxy resins is selected from the group consisting of substituted ureas and blocked amines.

11. The one-component thermosetting epoxy resin composition as claimed in claim 1 , wherein the thermosetting epoxy resin composition additionally includes at least one toughness improver D selected from the group consisting of terminally blocked polyurethane polymers D1, liquid rubbers D2 and core-shell polymers D3.

12. A motor vehicle construction or sandwich panel construction, comprising the one-component thermosetting epoxy resin composition as claimed in claim 1 after heat curing to form an adhesive.

13. A method of bonding thermally stable substrates, comprising the steps of
i) applying the one-component thermosetting epoxy resin composition as claimed in claim 1 to a surface of a thermally stable substrate S1;
ii) contacting the one-component thermosetting epoxy resin composition applied with a surface of a further thermally stable substrate S2; and
iii) heating the one-component thermally epoxy resin composition to a temperature of 100-220° C.,
wherein the substrate S2 consists of the same material or a different material than the substrate S1.

14. A bonded article obtained from the method as claimed in claim 13 .

Assignees

• Sika Tech Ag

Inventors

• Munzinger Noah
• Krüger Christian

Classifications

• C08G59/245 Primary

  aromatic · CPC title

• C08G59/4021 Primary

  Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title

• C08K5/0025

  Crosslinking or vulcanising agents; including accelerators · CPC title

• C08K5/07

  Aldehydes; Ketones · CPC title

• C08K5/132

  Phenols containing keto groups {, e.g. benzophenones} · CPC title