Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition comprising same

Patent metadata

Field	Value
Publication number	US-11866534-B2
Application number	US-201917299797-A
Country	US
Kind code	B2
Filing date	Oct 31, 2019
Priority date	Dec 5, 2018
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.

First claim

The invention claimed is:

1. An adhesive resin composition comprising a dicyclopentadiene-based hydrogenated resin and a thermoplastic resin,
wherein the dicyclopentadien-based hydrogenated resin is prepared by hydrogenating a dicyclopentadiene-based resin prepared by copolymerizing a monomer composition including a dicyclopentadiene-based monomer and a vinylamide-based monomer, and the adhesive resin composition has a mixed methylcyclohexane and aniline cloud point of 60° C. or lower, and a diacetone cloud point of 60° C. or lower,
and wherein the dicyclopentadiene-based resin has a number average molecular weight (Mn) of 200 to 1,200 g/mol, a weight average molecular weight (Mw) of 250 to 4,000 g/mol, and a Z average molecular weight (Mz) of 300 to 5,000 g/mol.

2. The adhesive resin composition of claim 1 , further comprising an oil.

3. The adhesive resin composition of claim 2 , wherein the oil includes any one or two or more selected from the group consisting of paraffin-based oils, naphthene-based oils, and aromatic-based oils.

4. The adhesive resin composition of claim 1 , wherein 50 to 90 wt % of the dicyclopentadiene-based hydrogenated resin and 10 to 50 wt % of the thermoplastic resin are included, based on a total weight of the adhesive resin composition.

5. The adhesive resin composition of claim 2 , wherein 1 to 60 parts by weight of the oil is included, based on 100 parts by weight of the dicyclopentadiene-based hydrogenated resin and the thermoplastic resin.

6. The adhesive resin composition of claim 1 , wherein the dicyclopentadiene-based resin is prepared by stepwise thermal polymerization.

Assignees

• Hanwha Solutions Corp

Inventors

• Kang Hyeonuk
• Byun Do Hyun
• Yoon Kyongjun

Classifications

• C08F232/08 Primary

  having condensed rings (coumarone-indene polymers C08F244/00) · CPC title

• C08F226/02

  by a single or double bond to nitrogen · CPC title

• C08L91/00

  Compositions of oils, fats or waxes; Compositions of derivatives thereof · CPC title

• C09J11/08 Primary

  Macromolecular additives · CPC title

• C09J145/00

  Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers (based on polymers of cyclic esters of polyfunctional acids C09J131/00; based on polymers of cyclic anhydrides or imides C09J135/00) · CPC title