Handling device and control device

Patent metadata

Field	Value
Publication number	US-11865720-B2
Application number	US-202017004094-A
Country	US
Kind code	B2
Filing date	Aug 27, 2020
Priority date	Mar 18, 2020
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

According to one embodiment, a handling device includes: a holding part that includes two or more supporting parts and is capable of holding an object by gripping the object with the two or more supporting parts; a calculation part configured to calculate a safety factor indicating safety of a state of the holding part holding the object; and a controller configured to cause the holding part to hold the object according to the safety factor.

First claim

What is claimed is:

1. A handling device comprising:
a holding part that includes two or more supporting parts and is capable of holding an object by gripping the object with the two or more supporting parts;
a memory configured to store computer executable programs;
a processor configured to, when executing the programs stored in the memory, calculate a safety factor indicating safety of a state of the holding part holding the object; and
a controller configured to cause the holding part to hold the object according to the safety factor,
wherein the safety factor is calculated based on:
a bending stress caused in regions where the supporting part contacts the object, and
a friction pressure generated in the regions where the supporting part contacts the object,

wherein the bending stress is calculated based on:
a value related to an area of the regions where the supporting part contacts the object,
a distance between a reference position in the regions and a center of gravity of the object, and
a mass of the object, and

wherein the controller changes a moving direction of the holding part based on the safety factor.

2. The handling device according to claim 1 , wherein the processor is further configured to, when executing the programs stored in the memory, plan a motion method including a moving speed of the holding part,
wherein the processor is configured to determine the moving speed according to an area of a region where the supporting part and the object are in contact with each other, and
the controller is configured to operate the holding part according to the motion method planned by the processor.

3. The handling device according to claim 1 , wherein the processor is further configured to, when executing the programs stored in the memory, plan a motion method including a moving speed of the holding part,
wherein the processor is configured to determine the moving speed according to the safety factor, and
the controller is configured to operate the holding part according to the motion method planned by the processor.

4. The handling device according to claim 1 , wherein
the controller is configured to keep distance a between the two or more supporting parts larger than an outer diameter of the object, and to move the two or more supporting parts around the object,
the controller is configured to cause the holding part to bring the two or more supporting parts close to each other, and to cause the holding part to hold the object in the state associated with the safety factor.

5. The handling device according to claim 1 , wherein
the object is arranged on a bottom surface of a container having an inner wall surface and the bottom surface,
the controller is configured to separate the two or more supporting parts from each other in a direction intersecting a horizontal direction, and to move the two or more supporting parts around the object, and
the controller is configured to cause the holding part to bring the two or more supporting parts close to each other, and to cause the holding part to hold the object in the state associated with the safety factor.

6. The handling device according to claim 1 , wherein
a shape of the object is flat, and the object is arranged so that a flat surface of the object contacts a bottom surface of a container having an inner wall surface and the bottom surface,
the controller is configured to separate the two or more supporting parts from each other in a direction intersecting a horizontal direction, and to move the two or more supporting parts toward the inner wall surface along the bottom surface, and
the controller is configured to cause the holding part to bring the two or more supporting parts close to each other, and to cause the holding part to hold the object in the state associated with the safety factor.

7. The handling device according to claim 1 , wherein
a shape of the object is flat, and the object is arranged so that a flat surface of the object contacts a bottom surface of a container having an inner wall surface and the bottom surface,
the controller is configured to keep a distance between the two or more supporting parts larger than an outer diameter of the object, to move the two or more supporting parts around the object, and to contact the two or more supporting parts with the bottom surface, and
the controller is configured to cause the holding part to bring the two or more supporting parts close to each other, and to cause the holding part to hold the object in the state associated with the safety factor.

8. The handling device according to claim 1 , wherein
a shape of the object is flat, and the object is arranged so that a flat surface of the object stands on a bottom surface of a container having an inner wall surface and the bottom surface,
the controller is configured to keep a distance between the two or more supporting parts larger than a thickness of the object, and to move the two or more supporting parts around the object, and
the controller is configured to cause the holding part to bring the two or more supporting parts close to each other, and to cause the holding part to hold the object in the state associated with the safety factor.

9. A control device comprising:
a memory configured to store computer executable programs;
a processor that, when executing the programs stored in the memory, calculates a safety factor indicating safety of a state in which a holding part holds an object by gripping the object with two or more supporting parts; and
a controller configured to cause the holding part to hold the object according to the safety factor,
wherein the safety factor is calculated based on:
a bending stress caused in regions where the supporting part contacts the object, and
a friction pressure generated in the regions where the supporting parts contact the object,

wherein the bending stress is calculated based on:
a value related to an area of the regions where the supporting part contacts the object,
a distance between a reference position in the regions and a center of gravity of the object, and
a mass of the object, and

wherein the controller changes a moving direction of the holding part based on the safety factor.

10. The control device according to claim 9 , wherein the processor is configured to, when executing the programs stored in the memory, plan a motion method including a moving speed of the holding part,
wherein the processor is configured to determine the moving speed according to an area of a region where the supporting part and the object are in contact with each other, and
the controller is configured to operate the holding part according to the motion method planned by the processor.

11. The control device according to claim 9 , wherein the processor is configured to, when executing the programs stored in the memory, plan a motion method including a moving speed of the holding part,
wherein the processor, is configured to determine the moving speed according to the safety factor, and
the controller is configured to operate the holding part according to the motion method planned by the processor.

Assignees

• Toshiba Kk

Inventors

• Eto Haruna
• Tokura Seiji
• Komoda Kazuma
• Jiang Ping
• Ogawa Akihito

Classifications

• B25J9/1653 Primary

  parameters identification, estimation, stiffness, accuracy, error analysis · CPC title

• B25J9/1612

  characterised by the hand, wrist, grip control · CPC title

• B25J9/1664

  characterised by motion, path, trajectory planning · CPC title

• B25J15/00

  Gripping heads {and other end effectors (grippers used in machine tools B23Q7/04; gripping members fitted on cranes B66C1/42, B66C1/44; gripping means used for mounting electrical components H05K13/04; gripping means used in the manufacture of semiconductors H10P72/7602)} · CPC title

• G05B2219/39504

  Grip object in gravity center · CPC title