Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology

Patent metadata

Field	Value
Publication number	US-11864327-B2
Application number	US-202017006305-A
Country	US
Kind code	B2
Filing date	Aug 28, 2020
Priority date	Jan 26, 2018
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

An inductor structure is provided that is positioned within a via of a printed circuit board. The inductor structure includes a via extending through a printed circuit board. The inductor structure includes at least one coil of an electrically conductive material beginning at a first opening to the via continuously present on a sidewall of the via encircling a center of the via extending to a second opening of the via opposite the first opening of the via. It further includes at least electrode present in contact with an end of the coil at said first or second opening.

First claim

The invention claimed is:

1. An inductor structure comprising:
a via extending through a printed circuit board;
at least one coil of an electrically conductive material beginning at a first opening to the via continuously present on a sidewall of the via encircling a center of the via extending to a second opening ci the via opposite the first opening of the via;
a tap to center of a substantially center portion of a sidewall off, said at least one coil of the electrically conductive material, wherein the tap to center is present substantially encapsulated within the printed circuit board;
a dielectric fill in the via;
a ferromagnetic core present substantially centrally positioned in the at least one coil; and
at least one electrode present in contact with an end of the coil at the first or second opening.

2. The inductor structure of claim 1 , further comprising an opening present through the dielectric fill and a second coil present on sidewalls of the opening.

3. The inductor structure of claim 1 , wherein the at least one comprises two concentric coils extending between the first and second opening of the via.

4. The inductor structure of claim 1 , wherein the at least one electrode comprises a first contact formed on a first surface of the print d circuit board at the first opening and a second contact formed on a second sur ace of the printed circuit board at the second opening.

5. The inductor structure of claim 3 , wherein each of the two concentric coils is in electrical communication with contacts formed at each of the first and second openings.

6. The inductor structure of claim 5 , wherein at least two of the contacts are formed on opposite surfaces of the printed circuit board.

7. The inductor structure of claim 1 , further comprising two contacts formed at each of the first and second openings of the via with each contact being in electrical communication with the electrically conductive material present on the sidewall of the via.

8. A passive electrical device comprising: a via extending through a printed circuit board; two electrically conductive electrodes that are separated from one another and present on separate portions of a sidewall of the via, wherein at least one of the two electrically conductive electrodes extends along an entirety of the height of the via; a dielectric fill in the via; a ferromagnetic core present substantially centrally positioned in the via; and a tap to center of a substantially center portion of a sidewall of at least one of the at least two electrically conductive electrodes that is present substantially encapsulated within the printed circuit board.

9. The passive electrical device of claim 8 , wherein a resistive element is present as a core of the via in electrical communication with at least two electrically conductive electrodes to provide that the passive electrical device is a resistor.

10. The passive electrical device of claim 9 , wherein the resistive element has a composition selected from the group consisting of platinum, nickel, copper, Balco (an iron-nickel alloy), tungsten, iridium and combinations thereof.

11. The passive electrical device of claim 8 , wherein the dielectric fill is in electrical communication with at least two electrically conductive electrodes to provide that the passive electrical device is a capacitor.

Assignees

• IBM

Inventors

• Bartley Gerald
• Becker Darryl
• Doyle Matthew
• Jeanson Mark

Classifications

• H05K3/301 Primary

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title

• H01B1/02 Primary

  mainly consisting of metals or alloys · CPC title

• G02B6/46

  Processes or apparatus adapted for installing {or repairing} optical fibres or optical cables (installation of cables containing electric conductors and optical fibres H02G) · CPC title

• G03F7/70733

  Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask · CPC title

• H01F17/0013

  with stacked layers · CPC title