Patterned fiber substrate

Patent metadata

Field	Value
Publication number	US-11864314-B2
Application number	US-201917417506-A
Country	US
Kind code	B2
Filing date	Dec 18, 2019
Priority date	Dec 26, 2018
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.

First claim

The invention claimed is:

1. A patterned fiber substrate comprising:
a fiber substrate; and
a pattern consisting of a functional material and formed on the fiber substrate,
wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate,
the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and
the pattern has a narrowest line width of 1 to 3000 μm.

2. The patterned fiber substrate according to claim 1 , wherein the fiber substrate has an air permeability of 400 cm 3 /cm 2 ·s or less.

3. The patterned fiber substrate according to claim 1 , wherein fibers that constitute the fiber substrate have an average fiber diameter of 0.1 to 20 μm.

4. The patterned fiber substrate according to claim 1 , wherein the fiber substrate is a nonwoven fabric.

5. The patterned fiber substrate according to claim 1 , wherein at least a part of the functional material that constitutes the pattern reaches a depth of 1 μm or more from a surface of the fiber substrate.

6. The patterned fiber substrate according to claim 1 , wherein the fiber substrate has a double roughness structure on its surface.

7. The patterned fiber substrate according to claim 1 , wherein the pattern is a conductive pattern.

8. The patterned fiber substrate according to claim 7 , comprising two or more conductive patterns formed on one surface of the patterned fiber substrate, wherein at least two of the conductive patterns are electrically connected together by being partially in contact with each other or by another conductive pattern.

9. The patterned fiber substrate according to claim 7 , comprising one or more conductive patterns (A) formed on one surface of the patterned fiber substrate, and one or more conductive patterns (B) formed on another surface of the patterned fiber substrate, wherein at least one of the conductive patterns (A) and at least one of the conductive patterns (B) are electrically connected together by being partially in contact with each other or by another conductive pattern.

10. A patterned fiber substrate laminate comprising a plurality of patterned fiber substrates,
wherein at least two of the plurality of patterned fiber substrates are each the patterned fiber substrate according to claim 7 ,
each of the at least two patterned fiber substrates includes one or more conductive patterns formed on one surface of the patterned fiber substrate, or one or more conductive patterns formed on each of both surfaces of the patterned fiber substrate, and
at least two conductive patterns included in separate patterned fiber substrates are electrically connected together by being partially in contact with each other or by another conductive pattern.

11. The patterned fiber substrate according to claim 1 , comprising a protective material on at least a part of at least one surface of the patterned fiber substrate.

12. The patterned fiber substrate laminate according to claim 10 , comprising a protective material on at least a part of at least one surface of the patterned fiber substrate laminate.

13. A method for producing the patterned fiber substrate according to claim 1 , the method comprising:
(i) forming a lyophilic region on the fiber substrate and in the inside of the fiber substrate;
(ii) providing a solution or a dispersion of the functional material to the formed lyophilic region; and
(iii) removing a solvent or a dispersion medium from the provided solution or dispersion.

14. The production method according to claim 13 , wherein in (i), the lyophilic region is formed by irradiating outside of the fiber substrate and the inside of the fiber substrate with ultraviolet light.

15. The production method according to claim 13 , wherein in (i), the lyophilic region is formed on the fiber substrate that is not subjected to a liquid repellent treatment and in the inside of the fiber substrate that is not subjected to a liquid repellent treatment.

16. The production method according to claim 13 , further comprising:
(iv) forming a protective material on at least a part of at least one surface of the patterned fiber substrate obtained in (iii).

17. The production method according to claim 16 , wherein in (iv), the protective material is formed by bonding of the protective material in sheet shape to the patterned fiber substrate, applying or electrodepositing a solution or a dispersion of the protective material to the patterned fiber substrate, and subsequently removing a solvent or a dispersion medium, or dipping the patterned fiber substrate into a solution or a dispersion of the protective material, and subsequently removing a solvent or a dispersion medium.

Assignees

• Kuraray Co
• Osaka Res Inst Ind Science & Tech

Inventors

• Hayashi Kohei
• Obata Soichi
• Shirotani Yasuhiro
• Nitani Masashi
• Uno Mayumi
• Maeda Kazuki

Classifications

• H05K1/038 Primary

  Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title

• D06M10/001

  Treatment with visible light, infrared or ultraviolet, X-rays · CPC title

• D06M23/16

  Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title