Laser diode packaging module, distance detection device, and electronic device

Patent metadata

Field	Value
Publication number	US-11862929-B2
Application number	US-202117165744-A
Country	US
Kind code	B2
Filing date	Feb 2, 2021
Priority date	Aug 3, 2018
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

The present disclosure provides a laser diode package module. The laser diode package module includes a substrate including a first surface; a cover disposed on the first surface of the substrate; an accommodation space formed between the substrate and the cover; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area. The light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate.

First claim

What is claimed is:

1. A laser diode package module, comprising:
a substrate including a first surface;
a semiconductor mounted on the first surface;
a cover disposed on the first surface of the substrate;
an accommodation space formed between the substrate and the cover;
a laser diode die disposed in the accommodation space; and
a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area, wherein;
the light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate; and
notches or shallow grooves are disposed at sharp corners of a bottom surface of the semiconductor.

2. The package module of claim 1 , wherein:
the emitted light of the laser diode die is reflected by the reflective surface and transmitted through the light-transmitting area in a direction substantially perpendicular to the first surface of the substrate.

3. The package module of claim 1 , wherein:
the semiconductor has an anisotropic structure; and
the reflective surface is an inclined surface prepared by anisotropy etching, or the reflective surface includes a reflective film coated on the inclined surface prepared by anisotropy etching.

4. The package module of claim 3 , wherein:
the semiconductor includes a first part positioned at a bottom and a second part positioned on a partial surface of the first part, the reflective surface being disposed on one or more inclined surface of the second part.

5. The package module of claim 4 , wherein:
the laser diode die is disposed on a surface of the first part outside the reflective surface, and the exit surface of the laser diode die is disposed opposite the reflective surface.

6. The package module of claim 4 , wherein:
the reflective film includes a metal layer, the metal layer on the reflective surface further extending to cover a part of an exposed surface of the first part outside the reflective surface; and the part of the metal layer positioned on the surface of the first part is used for electrical connection with the bottom surface of the laser diode die.

7. The package module of claim 6 , wherein:
the laser diode die covers a part of the surface of the reflective film on the surface of the first part, and the reflective film is electrically connected to a pad on the substrate through a wire to lead out an electrode on the bottom surface of the laser diode die.

8. The package module of claim 1 , further comprising:
two or more obliquely disposed reflective surfaces disposed on the package module, wherein
each reflective surface is disposed opposite an exit surface of one or more of the laser diode dies, such that an exit light of each laser diode die is reflected by the reflective surface and emitted through the light-transmitting area.

9. The package module of claim 8 , wherein:
each of the reflective surfaces is disposed opposite the exit surfaces of two or more laser diode dies disposed in parallel, such that the exit light of each laser diode is reflected by the reflective surface and emitted through the light-transmitting area.

10. The package module of claim 8 , wherein:
the semiconductor has an anisotropic structure; and
the two or more obliquely disposed reflective surfaces are disposed on different inclined surfaces prepared by anisotropy etching.

11. The package module of claim 10 , wherein:
the two obliquely disposed reflective surfaces are disposed on two symmetrically disposed and opposite oblique surfaces on the semiconductor.

12. The package module of claim 8 , wherein:
the package module includes two or more semiconductors with an anisotropic structure, the semiconductor is one of the two or more semiconductors; and
the two or more obliquely disposed reflective surfaces are respectively disposed on inclined surfaces prepared by anisotropy etching.

13. The package module of claim 1 , wherein:
the notches are cuts formed by removing a part of bottom sharp corners of the semiconductor; and the shallow grooves are disposed at edges of the sharp corners of the bottom surface of the semiconductor and extend from the bottom surface of the semiconductor to a depth of a recessed part of a top surface of the semiconductor.

14. The package module of claim 1 , further comprising:
a collimating element for reducing a divergence angle of a light beam in a fast axis direction, wherein
the collimating element is disposed between the laser diode die and the reflective surface, such that the emitted light from the laser diode die reaches the reflective surface after passing through the collimating element.

15. The package module of claim 14 , wherein:
the collimating element is mounted on the first surface of the substrate.

16. The package module of claim 14 , wherein:
the collimating element is a cylindrical lens, and a curved surface of the cylindrical lens is opposite the exit surface of the laser diode die, such that the exit light of the laser diode die irradiates onto the curved surface of the cylindrical lens.

17. A distance detection device, comprising:
a laser diode package module including:
a substrate including a first surface;
a semiconductor mounted on the first surface;
a cover disposed on the first surface of the substrate;
an accommodation space formed between the substrate and the cover;
a laser diode die disposed in the accommodation space;
a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area, the light-transmitting area being partially disposed on a surface of the cover opposite the substrate;
a collimating lens disposed outside the light-transmitting area for collimating the light emitted from the light-transmitting area; and
a first optical path changing element disposed outside the light-transmitting area for changing an optical path of an outgoing light emitted from the light-transmitting area, such that the laser pulse from the laser diode package module is incident on the collimating lens in a direction substantially along a center axis of the collimating lens, wherein:
the laser diode package module emits laser pulses at an angle from the first surface of the substrate of the laser diode package module, the angle being less than 90 degrees; and
notches or shallow grooves are disposed at sharp corners of a bottom surface of the semiconductor.

18. The distance detection device of claim 17 , wherein the first optical path changing element includes:
a first reflector, the first reflector deviating from an optical axis of the collimating lens for reflecting the outgoing light emitted from the light-transmitting area to the collimating lens.

19. The distance detection device of claim 18 , wherein:
the laser diode package module is positioned on one side of the center axis of the collimating lens, and the first surface of the substrate in the laser diode package module is substantially parallel to the center axis of the collimating lens; and
the first reflector is positioned on the center axis of the collimating lens for reflecting the laser pulse emitted by the laser diode package module to a directly substantially along the center axis of the collimating lens.

20. The distance detection device of claim 18 , wherein:
the collimating lens condenses a part of a returned light reflected by an object; and
the

Assignees

• Sz Dji Technology Co Ltd

Inventors

• Liu Xiang
• Zheng Guoguang
• Hong Xiaoping
• Wang Mingyu
• Dong Shuai

Classifications

• H01S5/02255 Primary

  using beam deflecting elements · CPC title

• H01S5/02253

  using lenses · CPC title

• G01S17/08

  for measuring distance only (indirect measurement G01S17/46; active triangulation systems G01S17/48) · CPC title

• H01S5/4031

  Edge-emitting structures · CPC title

• H01S5/02325

  Mechanically integrated components on mount members or optical micro-benches · CPC title