Resistor component

Patent metadata

Field	Value
Publication number	US-11862365-B2
Application number	US-202217743766-A
Country	US
Kind code	B2
Filing date	May 13, 2022
Priority date	Feb 11, 2022
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

A resistor component includes a substrate having a first surface and a second surface, opposing each other; an external electrode disposed outside of the substrate; a resistive layer disposed on the first surface of the substrate, connected to the external electrode, and including an alloy of a first metal and a second metal; and a first protective layer disposed on the resistive layer and including any one of the first and second metals.

First claim

What is claimed is:

1. A resistor component comprising:
a substrate having a first surface and a second surface, opposing each other;
an external electrode disposed outside of the substrate;
a resistive layer disposed on the first surface of the substrate, connected to the external electrode, and including an alloy of a first metal and a second metal; and
a first protective layer directly disposed on the resistive layer and including any one of the first and second metals,
wherein the first protective layer covers an entire surface of the resistive layer facing away from the first surface.

2. The resistor component of claim 1 , wherein the first protective layer comprises a plurality of aggregates of particles of any one of the first metal and the second metal.

3. The resistor component of claim 1 , wherein the first metal is copper (Cu), and the second metal is nickel (Ni).

4. The resistor component of claim 3 , wherein an amount of the second metal in the resistive layer is 20 to 60 moles, based on 100 moles of a total amount of the first metal and the second metal.

5. The resistor component of claim 1 , further comprising a second protective layer disposed on the first protective layer.

6. The resistor component of claim 1 , wherein the first protective layer further including glass.

7. The resistor component of claim 5 , wherein the second protective layer comprises a resin.

8. The resistor component of claim 1 , wherein the external electrode comprises a first electrode disposed on the substrate, and a second electrode disposed on the first electrode.

9. The resistor component of claim 8 , wherein the first electrode is disposed on a side surface of the substrate and extends to a portion of each of the first and second surfaces of the substrate, and
the resistive layer extends over the first electrode.

10. The resistor component of claim 8 , further comprising a second protective layer disposed on the first protective layer,
wherein the first protective layer is in contact with at least a portion of the first electrode, and the second protective layer is in contact with at least a portion of the first electrode and at least a portion of the second electrode, respectively.

11. The resistor component of claim 8 , wherein the first electrode comprises a conductive metal and glass, and
the second electrode comprises a conductive metal.

12. The resistor component of claim 11 , wherein the conductive metal of the first electrode comprises copper (Cu) or nickel (Ni), and
the conductive metal of the second electrode comprises at least one of nickel (Ni), tin (Sn), and palladium (Pd).

13. The resistor component of claim 11 , wherein the second electrode has a multilayer structure including a first layer including nickel (Ni) as the conductive metal and a second layer including tin (Sn) as the conductive metal.

14. The resistor component of claim 8 , wherein the first electrode comprises an upper electrode disposed on the first surface of the substrate, a lower electrode disposed on the second surface of the substrate, and a side electrode disposed on a side surface of the substrate and connecting the upper electrode and the lower electrode,
wherein the resistive layer covers a portion of the upper electrode.

15. The resistor component of claim 14 , wherein the side electrode is a sputtered layer.

16. A resistor component comprising:
a substrate having a first surface and a second surface, opposing each other;
an external electrode disposed outside of the substrate;
a resistive layer disposed on the first surface of the substrate; and
a first protective layer directly disposed on the resistive layer and including at least one of a first metal and a second metal,
wherein the first protective layer covers an entire surface of the resistive layer facing away from the first surface.

17. The resistor component of claim 16 , wherein the at least one of the first metal and the second metal is an additive in the first protective layer.

18. A method for manufacturing the resistor component of claim 16 comprising:
forming the first protective layer including applying a paste including at least one of the first metal and the second metal on the resistive layer.

19. The method of claim 18 , wherein the second metal is present in an amount of at least 10 wt %, based on a total weight of the paste.

20. The method of claim 18 , wherein the second metal is present in an amount of 10 wt % to 30 wt %, based on a total weight of the paste.

21. The method of claim 18 , wherein the paste further includes at least one of a glass component, a resin component, and a solvent.

Assignees

• Samsung Electro Mech

Inventors

• Yoon Jang Suk
• Kim Hyung Min

Classifications

• H01C1/14 Primary

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C7/003

  Thick film resistors · CPC title

• H01C1/08 Primary

  Cooling, heating or ventilating arrangements · CPC title

• H01C1/028 Primary

  the resistive element being embedded in insulation with outer enclosing sheath · CPC title

• H01C7/06 Primary

  including means to minimise changes in resistance with changes in temperature · CPC title