Fabricating apparatus and method for altering the kinetic energy of liquid droplets

Patent metadata

Field	Value
Publication number	US-11858209-B2
Application number	US-202117215557-A
Country	US
Kind code	B2
Filing date	Mar 29, 2021
Priority date	Mar 31, 2020
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

A fabricating apparatus includes a powder layer forming device, a fabrication liquid discharge device, and processing circuitry. The powder layer forming device is configured to form a powder layer. The fabrication liquid discharge device is configured to discharge fabrication liquid onto the powder layer. The processing circuitry is configured to control the fabrication liquid discharge device to discharge the fabrication liquid with a first kinetic energy and then discharge the fabrication liquid with a second kinetic energy higher than the first kinetic energy.

First claim

What is claimed is:

1. A fabricating apparatus comprising:
a powder layer forming device configured to form a powder layer;
a fabrication liquid discharge device configured to discharge fabrication liquid onto the powder layer; and
processing circuitry configured to
control the powder layer forming device to form the powder layer, and
control the fabrication liquid discharge device to discharge the fabrication liquid with a first kinetic energy and then discharge the fabrication liquid with a second kinetic energy higher than the first kinetic energy,

wherein the processing circuitry is configured to control discharge of the fabrication liquid discharge device such that, when n is a natural number and any droplet of the fabrication liquid is an n-th droplet, a kinetic energy of the n-th droplet is lower than a kinetic energy of an (n+1)-th droplet.

2. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control discharge of the fabrication liquid discharge device such that a discharge amount of a first droplet of the fabrication liquid discharged in advance of a second droplet of the fabrication liquid is smaller than a discharge amount of the second droplet.

3. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control discharge of the fabrication liquid discharge device such that a discharge speed of a first droplet of the fabrication liquid discharged in advance of a second droplet of the fabrication liquid is lower than a discharge speed of the second droplet.

4. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control the discharge of the fabrication liquid discharge device such that a discharge speed of the n-th droplet is slower than a discharge speed of the (n+1)-th droplet.

5. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control the discharge of the fabrication liquid discharge device such that a discharge amount of the n-th droplet is smaller than a discharge amount of the (n+1)-th droplet.

6. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control the fabrication liquid discharge device to discharge a first droplet in a first scan and then discharge a second droplet of the fabrication liquid in a second scan different from the first scan.

7. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control discharge of the fabrication liquid discharge device such that a resolution corresponding to a discharge amount of a first droplet of the fabrication liquid discharged in advance of a second droplet of the fabrication liquid is higher than a resolution corresponding to a discharge amount of the second droplet.

8. The fabricating apparatus according to claim 7 ,
wherein the processing circuitry is configured to control the discharge of the fabrication liquid discharge device such that a resolution corresponding to the discharge amount of the first droplet in a main scanning direction of the fabrication liquid discharge device is higher than a resolution corresponding to a discharge amount of the second droplet in the main scanning direction.

9. The fabricating apparatus according to claim 1 ,
wherein the processing circuitry is configured to control the fabrication liquid discharge device to discharge different types of fabrication liquids for a first droplet of the fabrication liquid and a second droplet of the fabrication liquid discharged after the first droplet.

10. The fabricating apparatus according to claim 9 ,
wherein a specific gravity of the first droplet is smaller than a specific gravity of the second droplet.

11. The fabricating apparatus according to claim 9 ,
wherein a surface energy of the first droplet is smaller than a surface energy of the second droplet.

12. The fabricating apparatus according to claim 1 ,
wherein
the fabrication liquid with the first kinetic energy are first droplets,
the fabrication liquid with the second kinetic energy are second droplets,
the processing circuitry is further configured to
discharge the second droplets such that at least some of the second droplets overlap contact points of the first droplets, the contact points being on the powder layer, and
discharge the first and second droplets in separate, discrete discharges,

the first droplets are configured to solidify an upper partial portion of the powder layer, and
the second droplets are configured to solidify the powder layer below the upper partial portion of the powder layer and form a fabrication layer of a three-dimensional fabricated object.

13. A fabricating method comprising:
forming a powder layer;
first discharging first fabrication liquid with a first kinetic energy to a first region of the powder layer; and
second discharging second fabrication liquid with a second kinetic energy higher than the first kinetic energy to a second region at least partially overlapping with the first region,
wherein when n is a natural number and any fabrication liquid is n-th fabrication liquid, a kinetic energy of the n-th fabrication liquid is lower than a kinetic energy of (n+1)-th fabrication liquid.

14. The fabricating method according to claim 13 ,
wherein a discharge amount of the first fabrication liquid discharged in advance of the second fabrication liquid is smaller than a discharge amount of the second fabrication liquid.

15. The fabricating method according to claim 13 ,
wherein a discharge speed of the first fabrication liquid discharged in advance of the second fabrication liquid is lower than a discharge speed of the second fabrication liquid.

16. The fabricating method according to claim 13 ,
wherein the first discharging and the second discharging are performed by different scans.

17. The fabricating method according to claim 13 ,
wherein a resolution corresponding to the discharge amount of the first fabrication liquid discharged in advance of the second fabrication liquid is higher than a resolution corresponding to the discharge amount of the second fabrication liquid.

18. The fabricating method according to claim 17 ,
wherein the resolution corresponding to the discharge amount of the first fabrication liquid in a main scanning direction is higher than the resolution corresponding to the discharge amount of the second fabrication liquid in the main scanning direction.

Assignees

• Nagatomo Yuji
• Hashimoto Kenichiroh
• Takagi Hisataka
• Nishio Takuei
• Ricoh Co Ltd

Inventors

• Nagatomo Yuji
• Hashimoto Kenichiroh
• Takagi Hisataka
• Nishio Takuei

Classifications

• B29C64/165 Primary

  using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

• B22F10/14 Primary

  by jetting of binder onto a bed of metal powder · CPC title

• B22F10/30

  Process control · CPC title

• B29C64/209

  Heads; Nozzles · CPC title

• B29C64/393

  for controlling or regulating additive manufacturing processes · CPC title