Opening/closing apparatus and molding apparatus comprising the same

US11858185B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11858185-B2
Application numberUS-202117364320-A
CountryUS
Kind codeB2
Filing dateJun 30, 2021
Priority dateFeb 18, 2015
Publication dateJan 2, 2024
Grant dateJan 2, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A movable platen according to the present invention includes: a mold clamping platen 42 having a projecting portion 62 in a mold closing direction-side surface; a mold mounting platen 44 mounted to the projecting portion 62 of the mold clamping platen 42 ; and a guide mechanism 50 fixed to the mold clamping platen 42 and supporting the mold mounting platen 44 . Only the mold clamping platen 42 is fixed to the guide mechanism 50 , while the mold mounting platen 44 is not fixed but placed on platen surface support portions 52.

First claim

Opening claim text (preview).

The invention claimed is: 1. An opening/closing apparatus comprising: a movable platen configured to mount a first mold of a pair of molds, the movable platen comprising: a mold clamping platen having a projecting portion in a mold closing direction-side surface; a mold mounting platen mounted to the projecting portion of the mold clamping platen and configured to project from side surfaces of the mold clamping platen, the mold mounting platen comprising a mold mounting surface; and a guide mechanism fixed to the mold clamping platen and supporting the mold mounting platen, the guide mechanism comprising: a pair of platen surface support portions, a pair of leg portions constructed integrally with the pair of platen surface support portions respectively, a pair of linear motion guides held on the pair of leg portions to prevent floating of the mold clamping platen, and an adjustment mechanism configured to adjust a height of the mold mounting platen, the adjustment mechanism provided between the pair of platen surface support portions of the guide mechanism and the first mold on both sides of the mold mounting surface of the mold mounting platen, wherein only the mold clamping platen is fixed to the guide mechanism by using fixing members, while the mold mounting platen is not fixed but placed on the pair of the platen surface support portions of the guide mechanism; a fixed platen configured to mount a second mold of the pair of molds in a position opposite the first mold; a pressure-receiving platen connected to the fixed platen by tie bars; and an opening/closing mechanism connecting the pressure-receiving platen and the movable platen, the opening/closing mechanism being configured to open and close the pair of molds by moving the movable platen back and forth. 2. A molding apparatus comprising the opening/closing apparatus according to claim 1 . 3. The opening/closing apparatus according to claim 1 , wherein the mold clamping platen is constructed integrally with the guide mechanism supporting the mold mounting platen. 4. An opening/closing apparatus comprising: a movable platen configured to mount a first mold of a pair of molds, the movable platen comprising: a mold clamping platen having a projecting portion in a mold closing direction-side surface; a mold mounting platen mounted to the projecting portion of the mold clamping platen and configured to project from side surfaces of the mold clamping platen, the mold mounting platen comprising a mold mounting surface; and a guide mechanism constructed integrally with the mold clamping platen and supporting the mold mounting platen, the guide mechanism comprising: a pair of platen surface support portions, a pair of leg portions constructed integrally with the pair of platen surface support portions respectively, a pair of linear motion guides held on the pair of leg portions to prevent floating of the mold clamping platen, and an adjustment mechanism configured to adjust a height of the mold mounting platen, the adjustment mechanism provided between the pair of platen surface support portions of the guide mechanism and the first mold on both sides of the mold mounting surface of the mold mounting platen, wherein only the mold clamping platen is fixed to the guide mechanism by using fixing members, while the mold mounting platen is not fixed but placed on the pair of the platen surface support portions of the guide mechanism; a fixed platen configured to mount a second mold of the pair of molds in a position opposite the first mold; a pressure-receiving platen connected to the fixed platen by tie bars; and an opening/closing mechanism connecting the pressure-receiving platen and the movable platen, the opening/closing mechanism being configured to open and close the pair of molds by moving the movable platen back and forth. 5. A molding apparatus comprising the opening/closing apparatus according to claim 4 .

Assignees

Inventors

Classifications

  • Means for guiding movable mould supports or injection units on the machine base or frame; Machine bases or frames (B29C45/1747 takes precedence) · CPC title

  • Dies (manufacture, see the appropriate class, e.g. B23P15/24); Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies · CPC title

  • Mechanisms or devices for locking or opening dies · CPC title

  • B22D17/263Primary

    mechanically · CPC title

  • Opening, closing or clamping · CPC title

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Frequently asked questions

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What does patent US11858185B2 cover?
A movable platen according to the present invention includes: a mold clamping platen 42 having a projecting portion 62 in a mold closing direction-side surface; a mold mounting platen 44 mounted to the projecting portion 62 of the mold clamping platen 42 ; and a guide mechanism 50 fixed to the mold clamping platen 42 and supporting the mold mounting platen 44 . Only the mold clamp…
Who is the assignee on this patent?
Shibaura Machine Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/1761. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).