In-situ vapor injection thermal desorption device

Patent metadata

Field	Value
Publication number	US-11858017-B2
Application number	US-202217931128-A
Country	US
Kind code	B2
Filing date	Sep 11, 2022
Priority date	Jan 6, 2022
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

An in-situ vapor injection thermal desorption device includes a sectional combined input head, several intermediate connectors and a bottom protector connected in series from top to bottom. The in-situ vapor injection thermal desorption device further includes several water-vapor coupling injection activation chips, selectively disposed below any of the intermediate connectors; the sectional combined input head is provided with a high-pressure-gas inlet, several pairs of heat-transfer-oil inlets and heat-transfer-oil outlets, and several pairs of hot-water inlets and hot-water outlets; the water-vapor coupling injection activation chip is provided with several gas-liquid spraying holes. The disclosure is an assembling structure; the number of the water-vapor coupling injection activation chips can be increased or reduced according to remediation depth on an actual site; it can be repeatedly used, uniformly sprayed, and enables the vapor for treating the organic soil to be generated in situ and remediating organic pollution sites in a low-carbon, energy-saving way.

First claim

What is claimed is:

1. An in-situ vapor injection thermal desorption device, comprising a sectional combined input head ( 1 ), several intermediate connectors ( 2 ) and a bottom protector ( 5 ) connected in series from top to bottom,
wherein the in-situ vapor injection thermal desorption device further comprises several water-vapor coupling injection activation chips ( 3 ) selectively disposed below any of the intermediate connectors; the sectional combined input head ( 1 ) is provided with a high-pressure-gas inlet, several pairs of heat-transfer-oil inlets and heat-transfer-oil outlets, and several pairs of hot-water inlets and hot-water outlets;
wherein a first high-pressure-gas through hole ( 201 ), several first heat-transfer-oil through holes ( 202 ), several second heat-transfer-oil through holes ( 203 ), several first hot-water through holes ( 204 ), and several second hot-water through holes ( 205 ) are disposed inside each intermediate connector and run therethrough from top to bottom; the first heat-transfer-oil through hole ( 202 ) and the second heat-transfer-oil through hole ( 203 ) adjacent to each other are communicated through a first connection hole ( 206 ), and the first hot-water through hole ( 204 ) and the second hot-water through hole ( 205 ) adjacent to each other are communicated through a second connection hole ( 207 );
wherein a second high-pressure-gas through hole ( 301 ), several third heat-transfer-oil through holes ( 302 ), several fourth heat-transfer-oil through holes ( 303 ), several third hot-water through holes ( 304 ) and several fourth hot-water through holes ( 305 ) are disposed inside each water-vapor coupling injection activation chip ( 3 ) and run therethrough from top to bottom; and several gas-liquid spraying holes ( 306 ) are uniformly and transversely arranged inside each water-vapor coupling injection activation chip ( 3 ); each gas-liquid spraying hole ( 306 ) has at least one outlet end and at least one inlet end, the at least one outlet end is disposed on a side of the water-vapor coupling injection activation chip ( 3 ), and the at least one inlet end is communicated with the second high-pressure-gas through hole ( 301 ); and a central portion of each gas-liquid spraying hole ( 306 ) is communicated with the third hot-water through hole ( 304 ) or fourth hot-water through hole ( 305 );
wherein the high-pressure-gas inlet, the first high-pressure-gas through hole ( 201 ) and the second high-pressure-gas through hole ( 301 ) are communicated with one another correspondingly; the heat-transfer-oil inlets, the first heat-transfer-oil through holes ( 202 ) and the third heat-transfer-oil through holes ( 302 ) are communicated with one another correspondingly; the heat-transfer-oil outlets, the second heat-transfer-oil through holes ( 203 ) and the fourth heat-transfer-oil through holes ( 303 ) are communicated with one another correspondingly; the hot-water inlets, the first hot-water through holes ( 204 ) and the third hot-water through holes ( 304 ) are communicated with one another correspondingly; and the hot-water outlets, the second hot-water through holes ( 205 ) and the fourth hot-water through holes ( 305 ) are communicated with one another correspondingly.

2. The in-situ vapor injection thermal desorption device according to claim 1 , wherein each gas-liquid spraying hole ( 306 ) is a Y-shaped though hole comprising two inlet ends and one outlet end; the two inlet ends of the gas-liquid spraying hole ( 306 ) are communicated with the second high-pressure-gas through holes respectively; the third hot-water through hole ( 304 ) or the fourth hot-water through hole ( 305 ) is communicated with a connection portion between the inlet ends, and the outlet end of an adjacent gas-liquid spraying hole ( 306 ) through a third connection pipe arranged transversely.

3. The in-situ vapor injection thermal desorption device according to claim 2 , wherein the outlet end of the gas-liquid spraying hole ( 306 ) has a flaring shape.

4. The in-situ vapor injection thermal desorption device according to claim 1 , wherein an end surface of the bottom protector ( 5 ) connected to an adjacent intermediate connector ( 2 ) is a closed surface.

5. The in-situ vapor injection thermal desorption device according to claim 1 , wherein an annular mounting board is disposed on an outer side of the sectional combined input head ( 1 ) for mounting the in-situ vapor injection thermal desorption device on a thermal enhanced vapor extraction box; the annular mounting board has several through holes thereon; and the annular mounting board is located below the heat-transfer-oil inlets, the heat-transfer-oil outlets, the high-pressure-gas inlet, the hot-water inlets, and the hot-water outlets.

6. The in-situ vapor injection thermal desorption device according to claim 1 , wherein the sectional combined input head ( 1 ), the intermediate connectors ( 2 ), the water-vapor coupling injection activation chip ( 3 ) and the bottom protector ( 5 ) are connected with one another through flanges.

7. The in-situ vapor injection thermal desorption device according to claim 2 , wherein a number of each of the heat-transfer-oil inlets, the heat-transfer-oil outlets, the hot-water inlets, and the hot-water outlets is two;
wherein each intermediate connector ( 2 ) has two first heat-transfer-oil through holes ( 202 ), two second heat-transfer-oil through holes ( 203 ), two first hot-water through holes ( 204 ), and two second hot-water through holes ( 205 ); the first high-pressure-gas through hole ( 201 ) is disposed at a middle portion of the intermediate connector ( 2 ); and the first heat-transfer-oil through holes ( 202 ), the second heat-transfer-oil through holes ( 203 ), the first hot-water through holes ( 204 ) and the second hot-water through holes ( 205 ) are uniformly distributed around the first high-pressure-gas through hole ( 201 );
each water-vapor coupling injection activation chip ( 3 ) has two third heat-transfer-oil through holes ( 302 ), two fourth heat-transfer-oil through holes ( 303 ), two third hot-water through holes ( 304 ), and two fourth hot-water through holes ( 305 ); the second high-pressure-gas through hole ( 301 ) is disposed at a middle portion of the water-vapor coupling injection activation chip ( 3 ); and the third heat-transfer-oil through holes ( 302 ), the fourth heat-transfer-oil through holes ( 303 ), the third hot-water through holes ( 304 ), and the fourth hot-water through holes ( 305 ) are uniformly distributed around the second high-pressure-gas through hole ( 301 ); and four gas-liquid spraying holes ( 306 ) are disposed on the water-vapor coupling injection activation chip ( 3 ).

8. The in-situ vapor injection thermal desorption device according to claim 6 , wherein the in-situ vapor injection thermal desorption device comprises four intermediate connectors ( 2 ), comprising a first intermediate connector, a second intermediate connector, a third intermediate connector, and a fourth intermediate connector respectively;
wherein the in-situ vapor injection thermal desorption device comprises three water-vapor coupling injection activation chips ( 3 ), comprising a first water-vapor coupling injection activation chip, a second water-vapor coupling injection activation chip, and a third water-vapor coupling injection activation chip, respectively, and the first water-vapor coupling injection activation chip, the second water-vapor coupling injection activation chip, and the third water-vapor coupling injection activation chip are disposed below the second intermediate connector, the third intermediate connector, and the fourth intermediate connector respectively;
wherein four first connection boards ( 401 ) are disposed on an

Assignees

• Inst Rock & Soil Mech Cas
• Institute Of Rock And Soil Mech Cas

Inventors

• Xue Qiang
• Li Yuan
• Wei Mingli
• Li Jiangshan
• Wan Yong
• Chen Zhixiang
• Chen Xin
• Liu Lei

Classifications

• B09C1/065 Primary

  by pyrolysis · CPC title

• B09C1/06

  thermally · CPC title

• B09C2101/00

  In situ · CPC title