Metal surface protection

Patent metadata

Field	Value
Publication number	US-11857997-B2
Application number	US-202016905463-A
Country	US
Kind code	B2
Filing date	Jun 18, 2020
Priority date	Jun 18, 2020
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate. The method can also include covalently bonding the polymer film to the metal oxide.

First claim

What is claimed is:

1. A method, comprising:
providing a metal substrate having a plurality of metal oxide surfaces native to the metal substrate and positioned at multiple, non-continous locations of surfaces on the metal substrate, wherein the metal substrate has a thickness between 20 nanometers and 5 micrometers;
coating the metal oxide surfaces with a polymer film that self-assembles one or more layers on the metal oxide surfaces, wherein the coating is performed via immersion of the metal oxide surfaces in an aqueous solution comprising the polymer film;
covalently bonding the polymer film to the plurality of metal oxide surfaces by heating the metal substrate and the plurality of metal oxide surfaces on a hot plate at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 140 degrees Celsius for between one and five minutes, and wherein the heating evaporates one or more solvents or surfactants from the aqueous solutions and catalyzes one or more interactions between the polymer film and the plurality of the metal oxide surfaces.

2. The method of claim 1 , wherein the polymer film comprises an organic polymer comprising at least one functional group selected from the group consisting of: a pendant phosphonic acid group, a hydroxamic acid group, and a carboxylic acid group.

3. The method of claim 2 , wherein the organic polymer is selected from the group consisting of poly(styrenephosphonic) acid and poly(vinylphosphonic acid).

4. The method of claim 1 , wherein the polymer film comprises an organic co-polymer comprising at least one functional group selected from the group consisting of: a pendant phosphonic acid group, a hydroxamic acid group, and a carboxylic acid group.

5. The method of claim 4 , wherein the organic co-polymer is-co-poly(styrene-vinylphosphonic acid).

6. The method of claim 1 , wherein the polymer film is comprised within an aqueous solution that further includes a solvent and co-polymers, wherein the heating removes the solvent from the plurality of metal oxide surfaces, and wherein the metal oxide surfaces are between 1 nanometer and 3 nanometers thick.

7. The method of claim 1 , further comprising:
applying, after the coating and the heating, a lithography process to the polymer film, and wherein the polymer film protects the metal substrate from chemically reacting with a base compound of the lithography process.

8. The method of claim 7 , wherein the polymer film protects at least a portion of the metal substrate from reacting with a basic solution of the lithography process.

Assignees

• IBM

Inventors

• Afzali-Ardakani Ali
• Rath David L
• Bangsaruntip Sarunya
• Totir George Gabriel

Classifications

• B05D1/18 Primary

  performed by dipping · CPC title

• B05D1/005

  Spin coating · CPC title

• B05D1/02

  performed by spraying · CPC title

• B05D3/005

  Pretreatment for allowing a non-conductive substrate to be electrostatically coated · CPC title

• B05D3/062

  Pretreatment · CPC title