Circuit substrate and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11856694-B2
Application number	US-202017008636-A
Country	US
Kind code	B2
Filing date	Aug 31, 2020
Priority date	Jun 16, 2020
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

First claim

What is claimed is:

1. A circuit substrate, comprising:
a substrate having a base region and a circuit region, wherein the base region having a first pattern is constituted by a first thermoplastic material, and the circuit region having a second pattern is constituted by a second thermoplastic material, and the first pattern has a portion opposite to the second pattern; and
a wiring formed on the circuit region along the second pattern,
wherein the first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material contains a catalyst particle,
wherein the surface roughness of the second pattern is greater than the surface roughness of the first pattern.

2. The circuit substrate according to claim 1 , wherein the content of the catalyst particle is about 0.1 to 10 parts by weight based on 100 parts by weight of the second thermoplastic material.

3. The circuit substrate according to claim 1 , wherein the substrate has a three-dimensional structure formed by a method comprising a three-dimensional printing method.

4. The circuit substrate according to claim 1 , wherein the first thermoplastic material comprises a polylactic acid (PLA), and the second thermoplastic material comprises an acrylonitrile-butadiene-styrene (ABS).

5. A method for manufacturing a circuit substrate, comprising:
providing a first thermoplastic material;
providing a second thermoplastic material different from the first thermoplastic material, wherein the second thermoplastic material contains a catalyst precursor;
spraying the first thermoplastic material and the second thermoplastic material by a three-dimensional printing method to form a substrate having a base region and a circuit region, wherein the base region having a first pattern is constituted by the first thermoplastic material, and the circuit region having a second pattern is constituted by the second thermoplastic material, and the first pattern has a portion opposite to the second pattern;
immersing the substrate into a solution containing a reducing agent, so that the catalyst precursor in the second pattern is reduced to a catalyst particle; and
forming a wiring on the circuit region along the second pattern,
wherein the method further comprises:
before immersing the substrate into the solution containing the reducing agent, performing an acid treatment on the substrate, so that the surface roughness of the second pattern is greater than the surface roughness of the first pattern.

6. The method for manufacturing the circuit substrate according to claim 5 , wherein the content of the catalyst particle is about 0.1 to 10 parts by weight based on 100 parts by weight of the second thermoplastic material.

7. The method for manufacturing the circuit substrate according to claim 5 , wherein the surface of the second pattern has more hydrophilic groups than the surface of the first pattern after performing the acid treatment on the substrate.

8. The method for manufacturing the circuit substrate according to claim 5 , wherein the wiring is formed on the circuit region along the second pattern by an electroless plating method.

Assignees

• Univ Nat Taiwan Science & Technology

Inventors

• Wang chen-hao
• Chen Hsueh-Yu
• Tong Guan-Cheng

Classifications

• H05K1/0353 Primary

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• B29C64/112

  using individual droplets, e.g. from jetting heads · CPC title

• B29C64/30

  Auxiliary operations or equipment · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B33Y40/20

  Post-treatment, e.g. curing, coating or polishing · CPC title