Air processing system for semiconductor container

Patent metadata

Field	Value
Publication number	US-11854848-B2
Application number	US-202117184144-A
Country	US
Kind code	B2
Filing date	Feb 24, 2021
Priority date	Nov 3, 2020
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

A container includes a container body and an air processing system. The container body includes a plurality of walls defining an interior space for receiving wafers. The air processing system is attached to the container body. The air processing system includes an exchange module, an air extraction module, a first contaminant removal module, a processing module, a second contaminant removal module, a controller module and a power module. The exchange module is coupled to one of the walls of the container body. The air extraction module extracts air from the container body. The first contaminant removal module is coupled to the air extraction module and the exchange module. The processing module is coupled to the air extraction module. The second contaminant removal module is coupled to the processing module and the exchange module. The controller module is configured to turn the air extraction module on and off.

First claim

What is claimed is:

1. An air processing system comprising:
an inlet valve and an outlet valve coupled to a semiconductor container attached to a mobile vehicle, wherein the air processing system is isolated from the semiconductor container when the inlet valve and the outlet valve are closed, and the air processing system is connected to the semiconductor container when the inlet valve and/or the outlet valve are opened;
a pump configured for extracting air from the semiconductor container;
a controller module configured to turn the pump on and off, wherein the controller module is disposed between the inlet valve and the outlet valve;
a power module disposed between the inlet valve and the outlet valve;
a first filter coupled to the inlet valve and the pump; and
a desiccant coupled to the pump, wherein the desiccant comprises at least an adsorbing element.

2. The system of claim 1 , further comprising a second filter coupled to the desiccant and the outlet valve.

3. The system of claim 2 , wherein the second filter comprises a particle filter, an AMC filter, or activated carbon.

4. The system of claim 1 , wherein the first filter comprises a particle filter, an AMC filter, or activated carbon.

5. The system of claim 1 , wherein the desiccant comprises molecular sieve, silica gel, bentonite clay, calcium chloride (CaCl 2 ), magnesium chloride (MgCl 2 ), or activated aluminum oxide.

6. The system of claim 1 , wherein the desiccant comprises a particle filter or a chemical filter.

7. The system of claim 1 , wherein the power module is pluggable.

8. The system of claim 1 , wherein the controller module further comprises at least a humidity sensor and/or a temperature sensor.

9. The system of claim 1 , wherein the desiccant is pluggable, and the adsorbing element of the desiccant is replaceable according to different processing requirements.

10. The system of claim 1 , further comprising at least a heating/cooling chip installed on the inlet valve or the outlet valve.

11. A container of a mobile vehicle, comprising:
a container body of the mobile vehicle comprising a plurality of walls defining an interior space for receiving wafers; and
an air processing system attached to the container body, wherein the air processing system comprises:
an inlet valve and an outlet valve coupled to one of the walls of the container body, wherein the air processing system is isolated from the interior space of the container body when the inlet valve and the outlet valve are closed, and the air processing system is connected to the interior space of the container body when the inlet valve and/or the outlet valve are opened;
a pump configured for extracting air from the interior space of the container body;
a first filter coupled to the inlet valve and the pump;
a desiccant coupled to the pump;
a second filter coupled to the desiccant and the outlet valve;
a controller module configured to turn the pump on and off, and between the inlet valve and the outlet valve; and
a power module disposed between the inlet valve and the outlet valve.

12. The container of claim 11 , wherein the inlet valve and the outlet valve are coupled to a same wall of the container body.

13. The container of claim 11 , wherein the first filter of the air processing system comprises a particle filter, an AMC filter, or activated carbon.

14. The container of claim 11 , wherein the second filter of the air processing system comprises a particle filter, an AMC filter or activated carbon.

15. The container of claim 11 , wherein the controller module of the air processing system further comprises at least a humidity sensor and/or a temperature sensor.

16. The container of claim 11 , wherein the air processing system further comprises at least a heating/cooling chip installed on the inlet valve or the outlet valve.

17. The container of claim 11 , wherein the desiccant and the power module are pluggable.

18. A method for transporting wafers, comprising:
receiving a plurality of wafers in a semiconductor container of a mobile vehicle;
moving the semiconductor container and the mobile vehicle; and
reducing humidity inside the semiconductor container to below approximately 0.7% during the moving of the semiconductor container, wherein the reducing of the humidity is performed by an air processing system attached to the semiconductor container, and the air processing system comprises:
an inlet valve and an outlet valve coupled to the semiconductor container, wherein the air processing system is isolated from the semiconductor container when the inlet valve and the outlet valve are closed, and the air processing system is connected to the semiconductor container when the inlet valve and/or the outlet valve are opened;
a pump configured for extracting air from the semiconductor container;
a first filter coupled to the pump and the inlet valve;
a desiccant coupled to the first filter;
a second filter coupled to the desiccant and the outlet valve;
a controller module configured to turn the pump on and off, wherein the controller module is disposed between the inlet valve and the outlet valve; and
a power module disposed between the inlet valve and the outlet valve.

19. The method of claim 18 , where the reducing of the humidity inside the semiconductor container comprises:
turning on the pump to extract air from inside the semiconductor container into the air processing system through the inlet valve;
reducing the humidity of the air when the air passes through the desiccant; and
returning the air back to the semiconductor container through the outlet valve.

20. The method of claim 19 , further comprising removing particles or airborne molecular contamination (AMC) when the air passes through the first filter and/or the second filter.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yeh You-Cheng
• Huang Mao-Chih
• Huang Yen-Ching
• Chuang Yu Hsuan
• Lin Tai-Hsiang
• Lin Jian-Shian

Classifications

• H10P72/1926 Primary

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H10P72/3404

  Storage means · CPC title

• H10P72/1924 Primary

  characterised by atmosphere control · CPC title

• H01L21/67393 Primary

  Electricity · mapped topic

• B01D46/0036

  by adsorption or absorption · CPC title