Siphon-based heat sink for server

Patent metadata

Field	Value
Publication number	US-11853133-B2
Application number	US-201917281253-A
Country	US
Kind code	B2
Filing date	May 30, 2019
Priority date	Oct 10, 2018
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

A siphon-based heat sink for a server comprises a heat absorbing mechanism, a siphon mechanism, and a heat sink. The heat absorbing mechanism comprises a base plate and a cover plate. The base plate comprises a bottom plate and multiple sets of heat dissipating fins, and is in contact with the central processing unit. The heat sink comprises a cooling cavity and cooling fins. The evaporation cavity is communicated with the cooling cavity via two siphon tubes to enable heat transfer and circulation of a thermal conductive medium. Lower ends of the two fin plates are positioned close to and fixed to the bottom plate, while upper ends thereof are bent outward to form a curved mechanism, and an included angle between the two fin plates continuously increases from bottom to top.

First claim

The invention claimed is:

1. A siphon-based heat sink for a server, comprising:
a heat absorbing mechanism,
a siphon mechanism, and
a heat sink,
wherein the heat absorbing mechanism is installed at an upper portion of a central processing unit, the heat absorbing mechanism comprises a base plate and a cover plate, and the base plate and the cover plate are buckled to form an evaporation cavity, the base plate comprises a bottom plate and a plurality of sets of heat dissipating fins installed on an inner surface of the bottom plate, and the bottom plate is in contact with the central processing unit; the siphon mechanism comprises two siphon tubes; the heat sink comprises a cooling cavity and cooling fins, the evaporation cavity is communicated with the cooling cavity through the two siphon tubes for heat transfer and circulation of a thermal conductive medium; each set of the heat dissipating fins is composed of two fin plates arranged symmetrically, lower ends of the two fin plates are positioned close to each other and fixed to the bottom plate, and uppers ends of the two fin plates have tips and the two fin plates are bent outward to form a curved mechanism from the lower ends to the upper ends, and an included angle between the two fin plates gradually increases from bottom to top, which facilitates bubble formation and evaporation of the thermal conductive medium between the two fin plates and conducting heat.

2. The siphon-based heat sink for the server according to claim 1 , wherein the two siphon tubes are respectively an evaporation tube and a return tube, and a diameter of the evaporation tube is 1.5 to 3 times a diameter of the return tube.

3. The siphon-based heat sink for the server according to claim 2 , wherein a horizontal position of the return tube is relatively lower than a horizontal position of the evaporation tube.

4. The siphon-based heat sink for the server according to claim 1 , wherein the cover plate is inclined.

5. The siphon-based heat sink for the server according to claim 1 , wherein a width of the upper end of the fin plate is smaller than a width of the lower end of the fin plate.

6. The siphon-based heat sink for the server according to claim 1 , wherein a side of the fin plate is curved.

7. The siphon-based heat sink for the server according to claim 1 , wherein the included angle between tangents of inner sides of the two fin plates is between 0 degree and 60 degrees.

8. The siphon-based heat sink for the server according to claim 1 , wherein a height of the fin plate ranges from 1 cm to 2 cm, and a width of the lower end of the fin plate ranges from 0.5 cm to 1 cm.

Assignees

• Zhengzhou Yunhai Information Tech Co Ltd

Inventors

• Zong Bin

Classifications

• G06F1/20 Primary

  Cooling means · CPC title

• F28F3/06

  the means being attachable to the element · CPC title

• F28D15/0266 Primary

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• G06F2200/203

  Heat conductive hinge · CPC title

• F28D2021/0029

  Heat sinks · CPC title