Photosensitive resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, semiconductor device, and method for producing organic EL display device

Patent metadata

Field	Value
Publication number	US-11852973-B2
Application number	US-201917273401-A
Country	US
Kind code	B2
Filing date	Sep 4, 2019
Priority date	Sep 18, 2018
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).

First claim

The invention claimed is:

1. A photosensitive resin composition comprising an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c),
wherein said phenolic resin (b) having a halogen atom has structural units represented by formula (1) and/or formula (2):

wherein in formulae (1) and (2),
A represents a divalent substituent having a halogen atom;
R 1 , R 2 , R 5 , and R 6 independently represent a hydrogen atom or an optionally substituted C 1-10 hydrocarbon group, methylol group, or alkoxymethyl group;
R 3 , R 4 , R 7 , and R 8 independently represent a hydrogen atom or an optionally substituted C 1-10 hydrocarbon group;
p represents an integer of 0 to 2;
q represents an integer of 0 to 4; and
r and s represent an integer of 0 to 3.

2. The photosensitive resin composition according to claim 1 , wherein the halogen atom of said phenolic resin (b) having a halogen atom comprises a fluorine atom.

3. The photosensitive resin composition according to claim 1 , wherein A in the general formula (1) and/or the general formula (2) is -C(CF 3 ) 2 -.

4. The photosensitive resin composition according to claim 1 , wherein said alkali-soluble resin (a) comprises a polyimide, a polybenzoxazole, a polyamide-imide, a precursor thereof, and/or a copolymer thereof.

5. The photosensitive resin composition according to claim 1 , wherein the amount of said phenolic resin (b) having a halogen atom is 10 to 100 parts by mass with respect to 100 parts by mass of said alkali-soluble resin (a).

6. The photosensitive resin composition according to claim 1 , wherein said phenolic resin (b) having a halogen atom has, as a repeating unit(s), 50 to 100 mol % of a structure represented by formula (1) and/or general formula (2) with respect to 100 mol % of all repeating units constituting said phenolic resin (b) having a halogen atom.

7. The photosensitive resin composition according to claim 1 , wherein the amount of said photosensitive compound (c) is 25 to 100 parts by mass with respect to 100 parts by mass of the total of said alkali-soluble resin (a) and said resin (b).

8. The photosensitive resin composition according to claim 1 , wherein said photosensitive compound (c) comprises a quinone diazide compound.

9. The photosensitive resin composition according to claim 1 , further comprising a thermal crosslinking agent (d).

10. The photosensitive resin composition according to claim 1 , further comprising a phenolic compound (e) having an electron-withdrawing group and a phenolic hydroxyl group and having a molecular weight of 100 or more and less than 500.

11. A photosensitive resin sheet formed from said photosensitive resin composition according to claim 1 .

12. A cured film formed by curing said photosensitive resin composition according to claim 1 .

13. An organic EL display device comprising a driving circuit, a planarization layer, a first electrode, an insulation layer, a light-emitting layer, and a second electrode on a substrate, wherein said planarization layer and/or insulation layer contain(s) said cured film according to claim 12 .

14. The organic EL display device according to claim 13 , wherein said substrate comprises a resin film.

15. The organic EL display device according to claim 13 , wherein at least a part of said planarization layer and/or said insulation layer has a bendable portion and/or a bent and fixed portion, and wherein the curvature radius of said bendable portion and/or the bent and fixed portion is in the range of 0.1 mm or more and 5 mm or less.

16. The organic EL display device according to claim 13 , wherein said planarization layer is multilayered.

17. A semiconductor electronic component or semiconductor device having an electrode, a metal wiring, an interlayer insulation layer, and/or a surface protective layer on a substrate, wherein said interlayer insulation layer and/or said surface protective layer contain(s) said cured film according to claim 12 .

18. A method of producing an organic EL display device, comprising the steps of:
forming a photosensitive resin film on a substrate using said photosensitive resin composition according to claim 1 ;
exposing said photosensitive resin film;
developing the exposed photosensitive resin film; and
heating the developed photosensitive resin film.

Assignees

• Toray Industries

Inventors

• Komori Yusuke
• Miyoshi Kazuto

Classifications

• G03F7/0236 Primary

  Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

• G03F7/0226 Primary

  characterised by the non-macromolecular additives · CPC title

• C08F2/48

  by ultraviolet or visible light · CPC title

• C08F4/26

  of manganese, iron group metals or platinum group metals · CPC title

• C08F12/24

  Phenols or alcohols · CPC title