Method for manufacturing PDMS device and PDMS device manufactured thereby

Patent metadata

Field	Value
Publication number	US-11850805-B2
Application number	US-202117365105-A
Country	US
Kind code	B2
Filing date	Jul 1, 2021
Priority date	Aug 25, 2020
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

A method for manufacturing a PDMS device in accordance with an exemplary embodiment of the present invention surface treats the entire surface of a pattern with a thiol group (—SH), so that a hydrogel may be connected to the surface of the pattern by a covalent bond under ultraviolet rays. Therefore, a PDMS device manufactured by the above method has an advantage in that the shape thereof may be stably maintained without the swelling or desorption of a hydrogel even when an electrolyte is filled in a pattern.

First claim

What is claimed is:

1. A method for manufacturing a PDMS device, the method comprising:
(a) preparing a first PDMS substrate and a second PDMS substrate at least one of which has a pattern formed thereon;
(b) introducing a hydroxyl group (—OH) on the surface of the first PDMS substrate and the surface of the second PDMS substrate;
(c) introducing a first thiol group (—SH) on the surface of the first PDMS substrate, and introducing an epoxide on the surface of the second PDMS substrate;
(d) bonding the first PDMS substrate and the second PDMS substrate to form a PDMS structure; and
(e) substituting the epoxide present on the surface of the pattern of the PDMS structure with a thiol group.

2. The method of claim 1 , wherein Step (b) is performed by irradiating the first PDMS substrate and the second PDMS substrate with ultraviolet rays in an ozone atmosphere.

3. The method of claim 1 , wherein the introducing of a first thiol group (—SH) on the surface of the first PDMS substrate in Step (c) is performed by dissolving at least one selected from the group consisting of (3-Mercaptopropyl)trimethoxysilane, (3-Mercaptopropyl)trimethoxy-d9-silane, and Bis[3-(triethoxysilyl)propyl]tetrasulfide in a solvent, and then immersing the first PDMS substrate therein.

4. The method of claim 1 , wherein the introducing of an epoxide on the surface of the second PDMS substrate in Step (c) is performed by dissolving at least one selected from the group consisting of (3-Glycidyloxypropyl)trimethoxysilane and Diethoxy(3-glycidyloxypropyl)methylsilane in a solvent, and then immersing the second PDMS substrate therein.

5. The method of claim 1 , wherein Step (e) is one in which a compound having 2 or more thiol groups (—SH) is dissolved together with a base in a solvent, and then allowed to come into contact with the pattern, thereby introducing a second thiol group while the epoxide ring is opened.

6. The method of claim 5 , wherein:
the compound having 2 or more thiol groups (—SH) is at least one selected from the group consisting of 1,2-Ethanedithiol, Propanedithiol, 2,3-Dimercapto-1-propanol, Poly(ethylene glycol)dithiolm and 4,4ç; and
the base is at least one selected from the group consisting of 1,8-Diazabicyclo[5.4.0]undec-7-ene, and 1,5-Diazabicyclo[4.3.0]non-5-ene.

7. The method of claim 1 , further comprising, after Step (e) is performed, injecting a hydrogel monomolecular aqueous solution at one position of the pattern, and then irradiating the pattern with ultraviolet rays to fix a hydrogel to the thiol group on the surface of the pattern.

Assignees

• Seoul Nat Univ R&Db Foundation
• Seoul Nat Univ R&Db Foundation

Inventors

• Chung Taek Dong
• Joo Young-Chang
• Sun Jeong-Yun
• Han Seok Hee
• Kim Sung Il
• Lee Hae-Ryung
• Lim Seung-Min

Classifications

• H10D8/045

  of PN junction diodes · CPC title

• B29C66/026 Primary

  Chemical pre-treatments (B29C66/028 takes precedence) · CPC title

• B29C35/0805

  using electromagnetic radiation · CPC title

• B29C66/712

  the composition of one of the parts to be joined being different from the composition of the other part · CPC title

• B29C66/72

  characterised by the structure of the material of the parts to be joined · CPC title