Laminate production method

US11850772B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11850772-B2
Application numberUS-201816632141-A
CountryUS
Kind codeB2
Filing dateJul 24, 2018
Priority dateJul 27, 2017
Publication dateDec 26, 2023
Grant dateDec 26, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for producing a laminate including a substrate and a rubber layer, the rubber layer having a thickness of 200 μm or more from the surface of the substrate, the method including contacting the substrate in a heated state with a polymer latex having a viscosity of 2,000 to 100,000 mPa·s at 25° C. to thereby coagulate the polymer in contact therewith to form the rubber layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a laminate comprising a substrate and a rubber layer, the rubber layer having a thickness of 200 μm or more from a surface of the substrate, the method comprising: contacting the substrate in a heated state with a polymer latex having a viscosity of 2,000 to 100,000 mPa·s at 25° C. to thereby coagulate the polymer latex in contact therewith to form the rubber layer, only once, wherein a polymer contained in the polymer latex is a nitrile rubber; the polymer latex contains a heat-sensitive coagulant; and the method does not include a step of contacting the substrate with a coagulant solution before contacting the substrate with the polymer latex. 2. The method for producing the laminate according to claim 1 , wherein in the contacting with the polymer latex, the substrate is heated at 30° C. or higher. 3. The method for producing the laminate according to claim 1 , wherein in the contacting with the polymer latex, the substrate is heated at 50° C. or higher. 4. The method for producing the laminate according to claim 1 , wherein the thickness of the substrate is 0.01 to 3,000 mm, and the permeation thickness of the rubber layer into the substrate is 1 μm or more and less than the thickness of the substrate. 5. The method for producing the laminate according to claim 1 , wherein the polymer latex contains a nonionic surfactant. 6. The method according to claim 1 , wherein the heat-sensitive coagulant is a silicone oil or a fluoroalkyl ester polymer. 7. The method according to claim 1 , wherein a temperature of the substrate when the substrate contacts the polymer latex is between 50° C. and 90° C. 8. The method according to claim 1 , wherein the viscosity of the polymer latex when the substrate contacts the polymer latex is 11,000 to 100,000 mPa·s at 25° C. 9. A method for producing a protective glove using the laminate obtained by the method according to claim 1 .

Assignees

Inventors

Classifications

  • B29C41/20Primary

    incorporating preformed parts or layers, e.g. moulding inserts or for coating articles · CPC title

  • resistant to mechanical aggressions, e.g. cutting. piercing · CPC title

  • Dipping a core {(B29C41/10 takes precedence)} · CPC title

  • characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} · CPC title

  • next to a fibrous or filamentary layer · CPC title

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Frequently asked questions

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What does patent US11850772B2 cover?
A method for producing a laminate including a substrate and a rubber layer, the rubber layer having a thickness of 200 μm or more from the surface of the substrate, the method including contacting the substrate in a heated state with a polymer latex having a viscosity of 2,000 to 100,000 mPa·s at 25° C. to thereby coagulate the polymer in contact therewith to form the rubber layer.
Who is the assignee on this patent?
Zeon Corp
What technology area does this patent fall under?
Primary CPC classification B29C41/20. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).