Dressing board, use method of dressing board, and cutting apparatus

Patent metadata

Field	Value
Publication number	US-11850696-B2
Application number	US-202217943747-A
Country	US
Kind code	B2
Filing date	Sep 13, 2022
Priority date	Aug 22, 2017
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.

First claim

What is claimed is:

1. A method of using a dressing board in a cutting apparatus, where the cutting apparatus comprises a chuck table that holds a workpiece, a cutting unit that cuts the workpiece held by the chuck table by a cutting blade, a control unit that controls the chuck table and the cutting unit, and an imaging unit connected to the control unit, where the control unit includes a reading part that is connected to the imaging unit and is configured to read a barcode and a two-dimensional code, an information registration part, a specifying part, and a determining part, wherein the method includes:
reading, via the reading part, a barcode and a two-dimensional code that are possessed by a dressing board disposed in the cutting apparatus,
registering, in the information registration part, identification information read from the barcode by the reading part and information relating to properties of the dressing board, read from the two-dimensional code, in association with each other,
registering, using the specifying part, a kind of dressing board suitable for dressing of the cutting blade,
determining, via the determining part, whether or not the properties of the dressing board included in the information relating to the properties read out from the information registration part based on the identification information read by the reading part match the kind of dressing board suitable for dressing of the cutting blade, registered in the specifying part,
dressing the cutting blade with the dressing board such that the two-dimensional code is rendered unreadable by the reading part,
wherein, after the identification information read from the barcode and the information relating to properties of the dressing board have been registered in association with each other, and after the two-dimensional code is rendered unreadable by the reading part:
the reading part sends, to the information registration part: (i) a signal indicating that the two-dimensional code cannot be read, and (ii) the identification information acquired by reading the bar code, and
the information registration part: (i) acquires the information relating to properties of the dressing board that have been registered in association with the identification information sent by the reading part, and (ii) sends the acquired information relating to the properties of the dressing board to the determining part.

2. The method according to claim 1 , wherein the cutting blade of the cutting unit and the dressing board are oriented with respect to each other such that a groove in the dressing board created by the cutting blade extends in a first direction and wherein the barcode includes a plurality of bars that each extend in a second direction, and where the second direction crosses the first direction.

3. The method according to claim 2 , wherein the two-dimensional code is positioned with respect to the barcode such that a space extending in the first direction is defined therebetween.

Assignees

• Disco Corp

Inventors

• Sekiya Kazuma

Classifications

• H10W10/00

  Isolation regions in semiconductor bodies between components of integrated devices · CPC title

• H10W10/01

  Manufacture or treatment · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/0618

  using identification means, e.g. labels on substrates or labels on containers · CPC title

• H10P72/0614

  Marking devices · CPC title