Flexible hexagonal boron nitride composites for additive manufacturing applications

US11850327B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11850327-B2
Application numberUS-201917049281-A
CountryUS
Kind codeB2
Filing dateApr 30, 2019
Priority dateApr 30, 2018
Publication dateDec 26, 2023
Grant dateDec 26, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Thermal management composites and scaffolds for heat-generating implantable electronic devices made from the thermal management composites are provided. The composite materials are cytocompatible, porous materials that include hexagonal boron nitride particles dispersed in an elastomeric polymer binder.

First claim

Opening claim text (preview).

What is claimed is: 1. A biocompatible device comprising: an implantable electronic device; and a thermally conductive, electrically insulating scaffold around at least a portion of the implantable electronic device, the scaffold comprising continuous flexible fibers of a cytocompatible composite, the cytocompatible composite comprising: a biocompatible elastomeric polymer binder; and hexagonal boron nitride particles dispersed in the biocompatible elastomeric polymer binder. 2. The device of claim 1 , wherein the cytocompatible composite has a hexagonal boron nitride particle content in the range from 30 vol. % to 60 vol. %. 3. The device of claim 1 , wherein the cytocompatible composite has a hexagonal boron nitride particle content in the range from 35 vol. % to 45 vol. %. 4. The device of claim 1 , wherein the cytocompatible composite has a porosity in the range from 20% to 40%. 5. The device of claim 1 , wherein the cytocompatible composite has a porosity in the range from 20% to 35%. 6. The device of claim 2 , wherein the cytocompatible composite has a porosity in the range from 20% to 40%. 7. The device of claim 6 , wherein the biocompatible elastomeric polymer binder is poly(lactic-co-glycolic acid). 8. The device of claim 7 , wherein the cytocompatible composite has a thermal conductivity of at least 1.5 W/m-K. 9. The device of claim 1 , wherein the one or more fibers have a cross-sectional diameter in the range from 50 μm to 500 μm. 10. The device of claim 9 , wherein the one or more fibers have a circular or oval cross-section.

Assignees

Inventors

Classifications

  • A61L27/446Primary

    with other specific inorganic fillers other than those covered by A61L27/443 or A61L27/46 · CPC title

  • Materials characterised by their function or physical properties {, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials} · CPC title

  • specially adapted for implantation · CPC title

  • Pacemakers · CPC title

  • Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

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What does patent US11850327B2 cover?
Thermal management composites and scaffolds for heat-generating implantable electronic devices made from the thermal management composites are provided. The composite materials are cytocompatible, porous materials that include hexagonal boron nitride particles dispersed in an elastomeric polymer binder.
Who is the assignee on this patent?
Univ Northwestern
What technology area does this patent fall under?
Primary CPC classification A61L27/446. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Dec 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).