Electronic device

Patent metadata

Field	Value
Publication number	US-11848494-B2
Application number	US-202117791054-A
Country	US
Kind code	B2
Filing date	Mar 26, 2021
Priority date	Apr 17, 2020
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

The present invention provides an electronic device. The electronic device includes a mainboard, a metal frame, a display module, and a shield structure. The mainboard includes a radio frequency circuit. The metal frame is coupled to the radio frequency circuit, and configured to receive or transmit a radio frequency signal. The shield structure is located in the display module or on a side of the display module closer to the mainboard, and is connected to the display module. The shield structure includes a metal shield layer. The metal shield layer is insulated from the metal frame and the radio frequency circuit, and the metal shield layer can generate reflection between the metal frame and the display module, weaken field strength generated in the display module by radiated energy from the metal frame, and shield the energy radiated from the metal frame to the display module.

First claim

What is claimed is:

1. An electronic device, comprising:
a display module, configured to display an image;
a mainboard, comprising a radio frequency circuit;
a metal frame surrounding the display module, coupled to the radio frequency circuit and configured to receive or transmit a radio frequency signal;
a shield structure, located in the display module or on a side of the display module closer to the mainboard, and connected to the display module, wherein the shield structure comprises a metal shield layer, the metal shield layer is insulated from the metal frame and the radio frequency circuit, and the metal shield layer is annular; and
a near field communication circuit, wherein the near field communication circuit and the shield structure are both disposed on the side of the display module closer to the mainboard; and
the shield structure is located between the near field communication circuit and the display module; and the near field communication circuit is configured to transmit or receive a near field communication signal on a side of the display module through an opened portion in the metal shield layer.

2. The electronic device according to claim 1 , wherein the metal shield layer comprises a mesh structure formed by a plurality of intersecting metal wires.

3. The electronic device according to claim 2 , wherein a wire width of the metal wire ranges from 0.1 μm to 20 μm; a distance between two adjacent metal wires ranges from 0.1 μm to 500 μm; the metal wire has a sheet resistance R; and 0<R≤10 Ω/□.

4. The electronic device according to claim 1 , wherein a width H of an annular portion of the metal shield layer is in the range of 0 mm<H≤2 mm.

5. The electronic device according to claim 1 , wherein the metal frame, the metal shield layer, and the display module are all in a circular ring shape; and centers of the metal frame, the metal shield layer, and the display module coincide; or the metal frame, the metal shield layer, and the display module are all in a rectangular ring shape; geometric centers of the metal frame, the metal shield layer, and the display module coincide; and the geometric center is an intersection of two diagonal lines of the rectangular ring.

6. The electronic device according to claim 1 , wherein the display module comprises a display panel; the shield structure is disposed on a light-emitting side of the display panel; and an opened portion of the metal shield layer is used to expose an active area of the display panel.

7. The electronic device according to claim 1 , wherein the shield structure further comprises a transparent carrier plate; and the metal shield layer is disposed on a side surface of the transparent carrier plate closer to the display module; and
the transparent carrier plate is connected to the display module; and a thickness of the transparent carrier plate ranges from 23 μm to 150 μm.

8. The electronic device according to claim 1 , wherein the metal shield layer comprises at least one of silver or copper.

9. The electronic device according to claim 1 , wherein the metal shield layer is coupled to a ground terminal on the mainboard.

10. The electronic device according to claim 1 , wherein the shield structure is configured to shield energy radiated from the metal frame to the display module.

11. The electronic device according to claim 1 , wherein the shield structure is disposed in the metal frame and surrounded by the metal frame.

Assignees

• Honor Device Co Ltd

Inventors

• Wang Rong
• Liu Bing
• Yang Yuchan
• Wang Hanyang
• Xu Huiliang
• Lee Chien-Ming

Classifications

• H01Q1/526 Primary

  Electromagnetic shields · CPC title

• G04G17/04

  Mounting of electronic components · CPC title

• G04R60/12

  inside metal cases · CPC title

• H01Q1/242

  specially adapted for hand-held use · CPC title

• H01Q1/273

  Adaptation for carrying or wearing by persons or animals · CPC title