Control module, method for manufacturing same, and electronic device

Patent metadata

Field	Value
Publication number	US-11848277-B2
Application number	US-202017296574-A
Country	US
Kind code	B2
Filing date	Aug 21, 2020
Priority date	Aug 21, 2020
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

Provided is a control module including a printed circuit board, an IC, and a shielding cover. The shielding cover is provided with a dispensing hole for adhesive dispensing. The IC is soldered onto the printed circuit board, and an adhesive may be dispensed between the IC and the printed circuit board through the dispensing hole. A method for manufacturing a control module is also provided.

First claim

What is claimed is:

1. A control module, comprising:
a printed circuit board;
an integrated circuit (IC) disposed on the printed circuit board; and
a shielding cover soldered onto the printed circuit board and housing the IC inside;
wherein the shielding cover is provided with a dispensing hole for adhesive dispensing,
wherein the control module further comprises a shielding film covering an opening, the opening comprising the dispensing hole.

2. The control module according to claim 1 , wherein the shielding cover comprises a top plate and a side plate, one end of the side plate being connected to the top plate and the other end of the side plate being soldered onto the printed circuit board; wherein the dispensing hole is disposed in the top plate.

3. The control module according to claim 2 , wherein an orthographic projection of the dispensing hole on the printed circuit board is overlapped with an orthographic projection of the IC on the printed circuit board.

4. The control module according to claim 1 , wherein the dispensing hole is in the shape of a circle, a square, or a rhombus.

5. The control module according to claim 1 , wherein the shielding cover is further provided with an observation hole for observation.

6. The control module according to claim 5 , wherein an orthographic projection of the IC on the printed circuit board is in the shape of a rectangle, and orthographic projections of the observation hole and the dispensing hole on the printed circuit board fall on two opposite sides or at two opposite corners of the rectangle.

7. The control module according to claim 1 , wherein an orthographic projection of the opening on the printed circuit board is within an orthographic projection of the shielding film on the printed circuit board.

8. The control module according to claim 1 , wherein the shielding cover is further provided with at least one rectangular surface and a plurality of openings formed in a same with the at least one rectangular surface;
wherein a plurality of shielding films are provided, wherein the plurality of shielding films covering the plurality of openings, and the plurality of openings one-to-one corresponding to the plurality of shielding films; or a single shielding film is provided, the single shielding film covering the plurality of openings.

9. The control module according to claim 8 , wherein
the shielding cover is further provided with an observation hole for observation, and an orthographic projection of the IC on the printed circuit board is in the shape of a rectangle; wherein orthographic projections of the observation hole and the dispensing hole on the printed circuit board fall on two opposite sides or at two opposite corners of the rectangle;
the dispensing hole is in the shape of a circle, a square, or a rhombus, and an orthographic projection of the opening on the printed circuit board is within an orthographic projection of the shielding film on the printed circuit board;
a material of the shielding film comprises a flexible metal material, a thickness of the flexible metal material being less than a thickness threshold; a material of the shielding cover comprises a metal material; the printed circuit board comprises a flexible printed circuit (FPC); and the IC comprises a touch IC; and
an adhesive used in the adhesive dispensing comprises a hot-melt adhesive; and the adhesive dispensing comprises: dispensing the adhesive between the printed circuit board and the IC to bond the printed circuit board to the IC.

10. The control module according to claim 1 , a material of the shielding film comprises a flexible metal material, a thickness of the flexible metal material being less than a thickness threshold.

11. The control module according to claim 1 , wherein a material of the shielding cover comprises a metal material.

12. The control module according to claim 1 , wherein the printed circuit board comprises a flexible printed circuit (FPC); and the IC comprises a touch IC.

13. The control module according to claim 1 , wherein an adhesive used in the adhesive dispensing comprises a hot-melt adhesive.

14. The control module according to claim 1 , wherein the adhesive dispensing comprises: dispensing an adhesive between the printed circuit board and the IC to bond the printed circuit board to the IC.

15. An electronic device, comprising: a base substrate, and the control module as defined in claim 1 , the control module being disposed on the base substrate.

16. A method for manufacturing a control module, comprising:
providing a printed circuit board;
arranging an integrated circuit (IC) on the printed circuit board;
soldering a shielding cover onto the printed circuit board, the shielding cover housing the IC inside and being provided with a dispensing hole for adhesive dispensing; and
dispensing an adhesive between the IC and the printed circuit board through the dispensing hole.

17. The method according to claim 16 , wherein the shielding cover comprises a top plate and a side plate, one end of the side plate being connected to the top plate and the other end of the side plate being soldered onto the printed circuit board; wherein the dispensing hole is disposed in the top plate.

18. The method according to claim 17 , wherein an orthographic projection of the dispensing hole on the printed circuit board is overlapped with an orthographic projection of the IC on the printed circuit board.

19. The method according to claim 16 , wherein the dispensing hole is in the shape of a circle, a square, or a rhombus.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Zheng Meizhu
• Li Yuanyuan
• Xiang Dalin
• Wang Jiuzhen

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title