Fluororesin film
US-2019382544-A1 · Dec 19, 2019 · US
Film
US11845839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11845839-B2 |
| Application number | US-201816762211-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 29, 2018 |
| Priority date | Nov 8, 2017 |
| Publication date | Dec 19, 2023 |
| Grant date | Dec 19, 2023 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/μm or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crystallinity of 65% or higher.
First claim
Opening claim text (preview).
The invention claimed is: 1. A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/μm or higher, wherein the film comprises at least one fluoropolymer selected from the group consisting of a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer. 2. The film according to claim 1 , having a volume resistivity at 160° C. of 1.0E16 Ω·cm or more. 3. The film according to claim 1 , wherein the fluoropolymer has a crystallinity of 65% or higher. 4. The film according to claim 1 , wherein the fluoropolymer has a melting point of 270° C. or higher. 5. The film according to claim 1 , wherein the fluoropolymer has a relative permittivity of 2.5 or lower. 6. The film according to claim 1 , having a thickness of 1 to 100 μm. 7. The film according to claim 1 , wherein the film is intended to be used in a film capacitor, an electrowetting device, a circuit board, an electric wire cable, a high frequency printed circuit board, a sealing material for an electronic component, or for electric insulation in a motor or transformer.
Assignees
Inventors
Classifications
- C08J5/18Primary
Manufacture of films or sheets · CPC title
of synthetic material, e.g. derivatives of cellulose (H01G4/16 takes precedence) · CPC title
Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title
comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} · CPC title
PTFE, i.e. polytetrafluoroethylene · CPC title
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- What does patent US11845839B2 cover?
- A film having a dielectric dissipation factor at a frequency of 1 kHz and 160° C. of 0.02% or lower and a dielectric breakdown strength at 160° C. of 400 V/μm or higher. Also disclosed is a film including at least one fluoropolymer selected from a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer and a tetrafluoroethylene/hexafluoropropylene copolymer, the fluoropolymer having a crysta…
- Who is the assignee on this patent?
- Daikin Ind Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08J5/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).